초록 ▼

A three-dimensional multichip module having a base structure formed by a plurality of chips secured together in a stack and a plurality of exterior chips mounted to the exterior faces of the base structure. The multichip module may incorporate memory chips, processor chips, logic chips, A to D conve

A three-dimensional multichip module having a base structure formed by a plurality of chips secured together in a stack and a plurality of exterior chips mounted to the exterior faces of the base structure. The multichip module may incorporate memory chips, processor chips, logic chips, A to D converter chips, and other chips in a compact package. The module permits chips that require extensive cooling to be positioned within the structure in a manner such that a large surface area of the chip is not in contact with other chips. The module also permits extensive interconnection between chips within the module.

대표청구항 ▼

1. A method of forming a multichip module, comprising:securing together a plurality of semiconductor chins in a manner so as to form a base structure having at least one lateral face that is comprised of a portion of each chip;forming a plurality of conductive contacts on the at least one lateral fa

1. A method of forming a multichip module, comprising:securing together a plurality of semiconductor chins in a manner so as to form a base structure having at least one lateral face that is comprised of a portion of each chip;forming a plurality of conductive contacts on the at least one lateral face wherein the conductive contacts provide connection between the chins and external circuitry;securing an exterior chin to each of the at leapt one lateral face wherein a first surface of the exterior chip is positioned adjacent the lateral face and extends across at least a portion of the lateral face; andwherein securing together the semiconductor chips so as to form a base structure comprises forming a base structure having an upper face, a lower face, and four lateral faces wherein each lateral face comprises a portion of each chip. 2. The method of claim 1 wherein forming a base structure comprises positioning the chips in a murmur such that a circuit-containing, active surface of the chips located at the upper and lower end of the structure form the upper and lower faces of the structure. 3. The method of claim 1 wherein securing an exterior chip to each of the at least one lateral face comprises securing a plurality of exterior chips to three of the lateral faces wherein a first surface of each exterior chip is positioned adjacent the respective lateral face and extends across at least a portion of the lateral face, wherein each exterior chip has a second surface that is substantially parallel to the first surface wherein the second surface is exposed to air cooling. 4. The method of claim 3 wherein securing the exterior chip to the lateral faces comprises using an adhesive to bond the exterior chips to the lateral faces. 5. The method of claim 3 further comprising securing exterior chips to the upper and lower faces of the base structure. 6. The method of claim 2 further comprises fanning a plurality of conductive elements on the first surface of each exterior chip wherein the conductive elements are configured to make contact with conductive contacts formed on the respective lateral fives of the base structure.