IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0384571
(2003-03-11)
|
우선권정보 |
JP-0067312 (2002-03-12); JP-0067313 (2002-03-12) |
발명자
/ 주소 |
- Minami, Tomohide
- Shinya, Hiroshi
- Kitano, Takahiro
|
출원인 / 주소 |
|
대리인 / 주소 |
Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
|
인용정보 |
피인용 횟수 :
19 인용 특허 :
6 |
초록
▼
A low-pressure dryer dries a substrate applied a coating solution thereon at low pressure. The dryer includes an airtight chamber installing a substrate table to place the substrate thereon; a diffuser plate, provided as facing the substrate placed on the substrate table with a gap, for discharging
A low-pressure dryer dries a substrate applied a coating solution thereon at low pressure. The dryer includes an airtight chamber installing a substrate table to place the substrate thereon; a diffuser plate, provided as facing the substrate placed on the substrate table with a gap, for discharging gas existing in the gap toward outside, the diffuser plate having a size almost the same as or larger than the substrate; a substrate-temperature adjuster, installed in the substrate table, for adjusting a temperature of the substrate; and a decompression mechanism for decompressing the airtight chamber. The diffuser plate has a temperature adjuster for making temperature adjustments to have a temperature difference between a first region and a second region of the diffuser plate, the first region facing a center region of the substrate, the second region being outside the first region and including a region facing an outer region of the substrate.
대표청구항
▼
1. A low-pressure dryer for drying a substrate applied a coating solution thereon at low pressure, comprising:an airtight chamber installing a substrate table to place the substrate thereon;a diffuser plate, provided as facing the substrate placed on the substrate table with a gap, for discharging g
1. A low-pressure dryer for drying a substrate applied a coating solution thereon at low pressure, comprising:an airtight chamber installing a substrate table to place the substrate thereon;a diffuser plate, provided as facing the substrate placed on the substrate table with a gap, for discharging gas existing in the gap toward outside, the diffuser plate having a size almost the same as or larger than the substrate;a substrate-temperature adjuster, installed in the substrate table, for adjusting a temperature of the substrate; anda decompression mechanism for decompressing the airtight chamber,wherein the diffuser plate has a temperature adjuster for making temperature adjustments to have a temperature difference between a first region and a second region of the diffuser plate, the first region facing a center region of the substrate, the second region being outside the first region and including a region facing an outer region of the substrate. 2. The low-pressure dryer according to claim 1, wherein the temperature adjuster makes the temperature adjustments so that a temperature of the first region is higher than a temperature of the second region. 3. The low-pressure dryer according to claim 1, wherein the temperature adjuster makes the temperature adjustments so that a temperature of the region facing the outer region of the substrate is higher than a temperature of the first region. 4. The low-pressure dryer according to claim 2, wherein the temperature adjuster has a first heater provided on the first region. 5. The low-pressure dryer according to claim 4, wherein the temperature adjuster has a second heater provided as surrounding the first heater, the second heater being set at a temperature lower than the first heater. 6. The low-pressure dryer according to claim 5 further comprising a heat insulator between the first and the second heaters. 7. The low-pressure dryer according to claim 1 further comprising a heat-equalizing plate provided on a lower side of the diffuser plate, the lower side facing the substrate, for offering a uniform temperature over the wafer surface given by the temperature adjuster. 8. The low-pressure dryer according to claim 4, wherein the first heater is provided on a circular region of the diffuser plate, the circular region having a diameter of 40%±10% to a diameter of the wafer. 9. The low-pressure dryer according to claim 3 further comprising a first heater provided on a region of the temperature adjuster, the region facing the outer region of the substrate. 10. The low-pressure dryer according to claim 9, wherein the temperature adjuster has a second heater provided as being surrounded by the first heater, the second heater being set at a temperature lower than the first heater. 11. The low-pressure dryer according to claim 10 further comprising a heat insulator between the first and the second heaters. 12. The low-pressure dryer according to claim 11 further comprising a heat-equalizing plate provided on a lower side of the diffuser plate, the lower side facing the substrate, for offering sequential change in temperature to a region of the diffuser plate corresponding to the heat insulator. 13. A low-pressure drying method of drying a substrate applied a coating solution thereon at low pressure, comprising the steps of:placing the substrate on a substrate table installed in an airtight chamber;positioning a diffuser plate as facing the substrate placed on the substrate table with a gap, the diffuser plate having a size almost the same as or larger than the substrate;adjusting a temperature of the substrate placed on he substrate table to a given temperature;making temperature adjustments to have a temperature difference between a first region and a second region of the diffuser plate, the first region facing a center region of the substrate, the second region being outside the first region and including a region facing an outer region of the substrate; anddecompressing the airtight chamber to discharge gas existing in the gap to outside the diffuser plate, thus evaporating solvent components contained in the coating solution. 14. The low-pressure drying method according to claim 13, wherein the step of making temperature adjustments makes the temperature adjustments so that a temperature of the first region is higher than a temperature of the second region. 15. The low-pressure drying method according to claim 13, wherein the step of temperature adjustments makes the temperature adjustments so that a temperature of the region facing the outer region of the substrate is higher than a temperature of the first region.
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