초록 ▼

Electroless plating solutions are disclosed for forming metal alloys, such as cobalt-tungsten alloys. In accordance with the present invention, the electroless plating solutions may be formulated so as not to contain any alkali metals. Further, the solutions can be formulated without the use of tetr

Electroless plating solutions are disclosed for forming metal alloys, such as cobalt-tungsten alloys. In accordance with the present invention, the electroless plating solutions may be formulated so as not to contain any alkali metals. Further, the solutions can be formulated without the use of tetramethylammonium hydroxide. In a further embodiment, a plating solution can be formulated that does not require the use of a catalyst, such as a palladium catalyst prior to depositing the metal alloy on a substrate.

대표청구항 ▼

1. An electroless plating process for forming a layer in a micro-electronic device comprising:providing an electroless plating solution comprising a first reducing agent, a second reducing agent, a pH adjusting agent, a first metal source, and a second metal source, the first reducing agent comprisi

1. An electroless plating process for forming a layer in a micro-electronic device comprising:providing an electroless plating solution comprising a first reducing agent, a second reducing agent, a pH adjusting agent, a first metal source, and a second metal source, the first reducing agent comprising a hypophosphorous acid or an ammonium hypophosphite, the second reducing agent comprising a borane-dimethylamine complex, the first reducing agent being present in the solution in an amount from about 0.1 to about 0.4 mol/l and the second reducing agent being present in the solution in an amount from about 0.01 to about 0.1 mol/l, the electroless plating solution being alkali metal-free and containing no tetramethylammonium hydroxide; andcontacting a substrate with the electroless plating solution to form a deposit on the substrate by electroless deposition, the deposit comprising a first metal-second metal alloy and wherein the deposit is formed on the substrate without first contacting the substrate with a catalyst. 2. A process as defined in claim 1, wherein the alloy comprises a cobalt-tungsten-phosphorous alloy, cobalt-tungsten-phosphorous-boron alloy, nickel-tungsten-phosphorous alloy, nickel-tungsten-phosphorouiboron alloy, cobalt-rhenium-phosphorous alloy, cobalt-rhenium-phosphorous-boron alloy, nickel-rhenium-phosphorous alloy, or nickel-rhenium-phosphorous-boron alloy. 3. A process as defined in claim 1, wherein the electroless plating solution further comprises a buffer. 4. A process as defined in claim 1, wherein the electroless plating solution further comprises a complexing agent. 5. A process as defined in claim 1, wherein the pH-adjusting agent comprises an amine, an ammonium hydroxide, or a hydroxy amine. 6. A process as defined in claim 5, wherein the pH-adjusting agent comprises monoethanolamine or ethylenediamine. 7. A process as defined in claim 3, wherein the buffer comprises boric acid or an ammonium salt. 8. A process as defined in claim 7, wherein the buffer comprises ammonium sulfate, ammonium chloride, or ammonium acetate. 9. A process as defined in claim 4, wherein complexing agent comprises an amino acid, a hydroxy acid, a pyrophosphoric acid, or an ammonium salt thereof. 10. A process as defined in claim 9, wherein the complexing agent comprises succinic acid, malic acid, glycine, tartaric acid, citric acid, or an ammonium salt thereof. 11. A process as defined in claim 1, wherein the first metal source comprises cobalt sulfate, cobalt chloride, or cobalt hydroxide, and the second metal source comprises tungstic acid, tungsten oxide, ammonium tungstate, or phosphorous tungsten acid. 12. A process as defined in claim 1, wherein the electroless plating solution has a pH of from about 7.5 to about 11.0 and has a temperature of from about 50° C. to about 95° C. when contacted with the substrate. 13. A process as defined in claim 1, wherein the alloy is formed on a copper layer on the substrate. 14. A process as defined in claim 1, wherein the first metal source is present within the electroless plating solution in an amount from about 0.05 to about 0.1 mol/l, and the second metal source is present in the electroless plating solution in an amount from about 0.01 to about 0.05 mol/l. 15. A process as defined in claim 1, wherein the first metal source comprises cobalt sulfate, cobalt chloride, or cobalt hydroxide and the second metal source comprises rhenium (VII) oxide, perrhenic acid, or ammonium perrhenate. 16. A process as defined in claim 1, wherein the first metal source comprises nickel hydroxide or a soluble nickel salt and the second metal source comprises tungstic acid, tungsten oxide, ammonium tungstate, or phosphorous tungsten acid. 17. A process as defined in claim 1, wherein the electroless plating solution further comprises a surfactant. 18. A process as defined in claim 1, wherein the electroless plating solution further comprises a stabilizer, the stabilizer comprising an organic sulfurous compound.