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High power LED power pack for spot module illumination 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F21V-029/00
출원번호 US-0063924 (2002-05-24)
발명자 / 주소
  • Bohler, Christopher L.
  • Pollard, Anthony D.
  • Burkholder, Greg E.
  • Petroski, James T.
  • Sommers, Mathew L.
  • Karlicek, Jr., Robert F.
  • Weaver, Jr., Stanton E.
  • Becker, Charles A.
출원인 / 주소
  • GELcore LLC
대리인 / 주소
    Fay, Sharpe, Fagan, Minnich & McKee, LLP
인용정보 피인용 횟수 : 157  인용 특허 : 17

초록

A light module includes a light emitting diode assembly defining a front side light emitting diode array and a rear side. The rear side is in thermal communication with a thermally conductive spreader, and a thermally conductive core is in thermal communication with the conductive spreader. The ther

대표청구항

1. A light module, comprising:a light emitting diode assembly including a generally planar front side light emitting diode array and a rear side, the rear side in thermal communication with a thermally conductive spreader;a thermally conductive elongated core having a first end in thermal communicat

이 특허에 인용된 특허 (17)

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