초록 ▼

A device and method for processing substrates, whereby medium consumption and processing time are reduced. According to the inventive method, liquid is conducted to a surface of the substrate that is to be treated via at least one nozzle that is arranged in a substantially centric position with resp

A device and method for processing substrates, whereby medium consumption and processing time are reduced. According to the inventive method, liquid is conducted to a surface of the substrate that is to be treated via at least one nozzle that is arranged in a substantially centric position with respect to said substrate and via a plurality of second nozzles that are controlled separately from the first nozzle.

대표청구항 ▼

1. An apparatus for processing substrates, comprising:a nozzle plate;and aligned with an upper surface of said nozzle plate, wherein said at least one first nozzle plate is capable of providing outwardly directed uniform flow over the upper surface of said nozzle plate;a plurality of second nozzles

1. An apparatus for processing substrates, comprising:a nozzle plate;and aligned with an upper surface of said nozzle plate, wherein said at least one first nozzle plate is capable of providing outwardly directed uniform flow over the upper surface of said nozzle plate;a plurality of second nozzles disposed in said nozzle plate at an angle of less than 90° relative thereto, wherein said second nozzles and said at least one first nozzle are separately controllable, wherein said second nozzles provide a flow therefrom directed transverse to said radial flow from said at least one first nozzle, and wherein said second nozzles are distributed over the surface of said nozzle plate such that said transverse flow therefrom deflects said radial flow from said at least one first nozzle into a spirally outwardly extending flow. 2. An apparatus according to claim 1, wherein said at least one first nozzle is a single point nozzle. 3. An apparatus according to claim 1, wherein said second nozzles form at least one nozzle group, which extends along a prescribed contour. 4. An apparatus according to claim 3, wherein said prescribed contour extends tangential to said at least one first nozzle. 5. An apparatus according to claim 1, which includes at least one further nozzle, which is disposed between said at least one first nozzle and said second nozzles, and is directed radially toward said at least one first nozzle. 6. An apparatus according to claim 1, wherein said second nozzles are disposed in said nozzle plate at an angle of 45°. 7. An apparatus according to claim 1, wherein said second nozzles are point nozzles. 8. An apparatus according to claim 1, wherein said at least one first nozzle and said second nozzles can operate under different pressures and/or can be supplied with different fluids. 9. An apparatus according to claim 5, wherein a common base is provided for said at least one first nozzle, said second nozzles, and said at least one further nozzle. 10. An apparatus according to claim 9, wherein an insert is integrated perpendicular into said base, and wherein said at least one first nozzle is provided in said insert. 11. An apparatus according to claim 1, wherein an annular fluid chamber is disposed beneath said nozzle plate. 12. An apparatus according to claim 9, wherein said base is provided with a surface that surrounds said nozzle plate and is disposed lower than said nozzle plate, wherein said surface is provided with a plurality of bores for accommodating a corresponding number of spacers. 13. An apparatus according to claim 12, wherein said spacers are adjustable. 14. An apparatus according to claim 9, wherein said base is provided with an overflow collar. 15. An apparatus according to claim 14, wherein said overflow collar is provided with at least one inwardly directed nozzle. 16. An apparatus according to claim 9, wherein a tank is provided that surrounds said base. 17. An apparatus according to claim 1, wherein a substrate carrier is provided for holding a substrate, and wherein a device is provided for conducting a fluid onto an outer side of said substrate carrier. 18. An apparatus according to claim 17, wherein said device is disposed on said substrate carrier. 19. An apparatus according to claim 1, wherein said second nozzles form at least one nozzle group, which is positioned along a straight line. 20. A method of processing substrates, including the steps of:providing at least one first nozzle, and a nozzle plate disposed parallel to a substrate fixed on a substrate carrier, wherein said at least one first nozzle is disposed essentially centrally relative to said substrate and aligned with said nozzle plate;conducting a fluid, via said at least one first nozzle, at a right angle onto a substrate surface that is to be treated so that fluid striking said substrate is deflected into a radial flow between said substrate and said nozzle plate;providing a plurality of second nozzles disposed in said nozzle plate and positioned at an angle of less than 90° relative to the nozzle plate, wherein said second nozzles and the at least one first nozzle are separately controlled;conducting a fluid transverse to said radial flow, onto said substrate surface that is to be treated via said plurality of second nozzles, wherein fluid is simultaneously conducted onto said substrate surface by said first and second nozzles; andwherein said second nozzles are distributed over the surface of said nozzle plate in such a way that said radial flow is deflected into a spirally outwardly extending flow. 21. A method according to claim 20, wherein said fluid is conducted via said second nozzles onto said surface that is to be treated in essentially a peripheral direction of said substrate. 22. A method according to claim 20, wherein said fluid is conducted onto said substrate surface that is to be treated via said second nozzles at an angle of 45°. 23. A method according to claim 20, wherein fluid is conducted onto said substrate surface that is to be treated via said first and second nozzles at different pressures. 24. A method according to claim 20, wherein different fluids are conducted onto said substrate surface that is to be treated via said first and second nozzles. 25. A method according to claim 20, wherein a rinsing fluid is conducted onto said substrate surface that is to be treated via said at least one first nozzle. 26. A method according to claim 20, wherein a vacuum is applied to said at least one first nozzle. 27. A method according to claim 20, wherein a gas is conducted onto the substrate surface that is to be treated via said second nozzles. 28. A method according to claim 20, wherein an overflow collar having at least one further nozzle is provided, and wherein a fluid is conducted onto an outer surface of the substrate carrier that carries a substrate via said at least one further nozzle.