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Boiling cooler for cooling heating element by heat transfer with boiling 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0813606 (2001-03-21)
우선권정보 JP-0083918 (2000-03-24); JP-0214152 (2000-07-14); JP-0214204 (2000-07-14); JP-0214333 (2000-07-14); JP-0214449 (2000-07-14)
발명자 / 주소
  • Osakabe, Hiroyuki
출원인 / 주소
  • DENSO Corporation
대리인 / 주소
    Harness, Dickey & Pierce, PLC
인용정보 피인용 횟수 : 18  인용 특허 : 20

초록

A boiling cooler has a heat exchange part in which refrigerant vapor performs heat exchange with cooling water. The refrigerant vapor is produced from liquid refrigerant that is boiled and gasified by heat transferred from a heating element. In this boiling cooler, the refrigerant vapor can be coole

대표청구항

1. A boiling cooler for cooling a heating element, the boiling cooler comprising:a refrigerant vessel storing liquid refrigerant therein, the refrigerant vessel having a boiling portion where the liquid refrigerant boils to produce refrigerant vapor, and defining therein a vapor outflow passage thro

이 특허에 인용된 특허 (20)

  1. Benedict Olusegun O. (Les Ulis FRX), Air conditioning apparatus, especially for an electric vehicle.
  2. Inoue Atsuo,JPX, Air conditioning system for automotive vehicles.
  3. Uttam Shyamalindu Ghoshal, Apparatus for dense chip packaging using heat pipes and thermoelectric coolers.
  4. Iritani Kunio,JPX ; Numazawa Shigeo,JPX ; Fujiwara Kenichi,JPX ; Yamanaka Yasushi,JPX ; Isaji Akira,JPX ; Suzuki Nobunao,JPX ; Suzuki Takahisa,JPX ; Honda Keita,JPX ; Sanada Ryoichi,JPX, Automotive air conditioner having condenser and evaporator provided within air duct.
  5. Ru-Ching Wang TW, Compact heat sink module.
  6. Hiroyuki Osakabe JP; Kiyoshi Kawaguchi JP; Masahiko Suzuki JP; Shigeru Kadota JP, Cooling apparatus boiling and condensing refrigerant.
  7. Osakabe, Hiroyuki; Kawaguchi, Kiyoshi; Suzuki, Masahiko, Cooling apparatus boiling and condensing refrigerant.
  8. Sugito, Hajime, Cooling apparatus boiling and condensing refrigerant.
  9. Osakabe Hiroyuki,JPX ; Kawaguchi Kiyoshi,JPX ; Suzuki Masahiko,JPX, Cooling apparatus for high-temperature medium by boiling and condensing refrigerant.
  10. Tanaka Hiroshi,JPX ; Terao Tadayoshi,JPX ; Kawaguchi Kiyoshi,JPX ; Ohara Takahide,JPX ; Maeda Akihiro,JPX ; Tanaka Eitaro,JPX, Cooling apparatus using boiling and condensing refrigerant.
  11. Osakabe Hiroyuki,JPX ; Kawaguchi Kiyoshi,JPX ; Ohara Takahide,JPX ; Kadota Shigeru,JPX ; Suzuki Masahiko,JPX, Cooling apparatus using boiling and condensing refrigerant and method for manufacturing the same.
  12. Hiroshi Tanaka JP; Tadayoshi Terao JP; Eitaro Tanaka JP; Takahide Ohara JP; Kiyoshi Kawaguchi JP, Cooling device boiling and condensing refrigerant.
  13. Hiroshi Tanaka JP; Tadayoshi Terao JP; Kiyoshi Kawaguchi JP; Takahide Ohara JP; Akihiro Maeda JP, Cooling device boiling and condensing refrigerant.
  14. Grover George M. (Los Alamos NM) Chrisman Robert H. (Los Alamos NM), Heat pipe.
  15. Rogers Carey S., Heat pipe assisted cooling of x-ray windows in x-ray tubes.
  16. Watt ; Richard E., Isothermal process solar collector panel.
  17. Huang Bin-Juine,TWX, Network-type heat pipe device.
  18. Mermet-Guyennet, Michel, Power converter enclosure.
  19. Schneider Michael G. ; Bland ; deceased Timothy, Reflux cooler coupled with heat pipes to enhance load-sharing.
  20. Thomas Daniel Lee, Thin, planar heat spreader.

이 특허를 인용한 특허 (18)

  1. Liu,Tay Jian, Cooling device incorporating boiling chamber.
  2. Farrar,Paul A.; Forbes,Leonard; Ahn,Kie Y.; Geusic,Joseph E.; Bhattacharyya,Arup; Reinberg,Alan R., Integrated circuit cooling and insulating device and method.
  3. Farrar,Paul A.; Forbes,Leonard; Ahn,Kie Y.; Geusic,Joseph E.; Bhattacharyya,Arup; Reinberg,Alan R., Integrated circuit cooling and insulating device and method.
  4. Farrar,Paul A.; Forbes,Leonard; Ahn,Kie Y.; Geusic,Joseph E.; Bhattacharyya,Arup; Reinberg,Alan R., Integrated circuit cooling and insulating device and method.
  5. Farrar,Paul A.; Forbes,Leonard; Ahn,Kie Y.; Geusic,Joseph E.; Bhattacharyya,Arup; Reinberg,Alan R., Integrated circuit cooling and insulating device and method.
  6. Farrar,Paul A., Integrated circuit cooling system and method.
  7. Ghosh, Debashis; Bhatti, Mohinder Singh, Integrated liquid cooled heat sink for electronic components.
  8. Bhatti,Mohinder Singh; Ghosh,Debashis; Reyzin,Ilya, Liquid cooled thermosiphon for electronic components.
  9. Reyzin,Ilya; Bhatti,Mohinder Singh, Liquid cooled thermosiphon with flexible coolant tubes.
  10. Minamitani, Rintaro; Ohashi, Shigeo; Naganawa, Takashi; Matsushita, Shinji; Oikawa, Hironori, Liquid cooling system and an electronic apparatus having the same therein.
  11. Mori, Shogo; Obara, Hideyasu; Kuribayashi, Taizo; Tamura, Shinobu, Liquid-cooled-type cooling device.
  12. Edmunds, Howard Ross; McFalls, Richard Kenneth, Method and apparatus for cooling electronics.
  13. Joshi, Yogendra; Murthy, Sunil S.; Nakayama, Wataru, Orientation-independent thermosyphon heat spreader.
  14. Farrar,Paul A., Packaging of electronic chips with air-bridge structures.
  15. Farrar,Paul A., Packaging of electronic chips with air-bridge structures.
  16. Guo, Dongming; Qiang, Kewen, Radiator, backlight module and display module.
  17. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Vapor condenser with three-dimensional folded structure.
  18. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Vapor condenser with three-dimensional folded structure.
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