Ceramic electronic device and method of manufacturing the device
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B32B-009/04
H01G-002/12
H01G-004/00
B05D-001/18
C25D-005/34
출원번호
US-0042138
(2002-01-11)
발명자
/ 주소
Kimura, Takeshi
Igaki, Emiko
Ito, Hiroshi
Yamashita, Osamu
Tanahashi, Masakazu
출원인 / 주소
Matsushita Electric Industrial Co., Ltd.
대리인 / 주소
Wenderoth, Lind & Ponack, L.L.P.
인용정보
피인용 횟수 :
10인용 특허 :
4
초록▼
A ceramic electronic device is protected at the surface from retention of water, thus having improved operation reliability, and a method of manufacturing the device is provided. A protective layer is formed on the ceramic element and external electrodes by dehydrating condensation of organic silico
A ceramic electronic device is protected at the surface from retention of water, thus having improved operation reliability, and a method of manufacturing the device is provided. A protective layer is formed on the ceramic element and external electrodes by dehydrating condensation of organic silicon compound.
대표청구항▼
1. A ceramic electronic device comprising:a ceramic element;an external electrode on said ceramic element, said external electrode having a plating layer provided on a surface of said external electrode; anda water repellent protective layer on said ceramic element and said plating layer, said prote
1. A ceramic electronic device comprising:a ceramic element;an external electrode on said ceramic element, said external electrode having a plating layer provided on a surface of said external electrode; anda water repellent protective layer on said ceramic element and said plating layer, said protective layer being formed through impregnating a compound into said ceramic element and external electrode and through dehydration-condensation, said compound being expressed by a formula of: n H 2n —Si—(OR′) 3 where R is an epoxy group, alkyl group, aryl group, perfluoroaryl group, or mixture thereof, n is a natural number, and R′ is an alkyl group having 1 to 4 carbon atoms, hydrogen, or halogen atom, wherein at least one of R′ is hydrogen. 2. A ceramic electronic device according to claim 1, wherein the ceramic element is a sintered dielectric material. 3. A ceramic electronic device comprising:a ceramic element;an external electrode on said ceramic element, said external electrode having a plating layer provided on a surface of said external electrode; anda water repellent protective layer on said ceramic element and said plating layer, said protective layer being formed through impregnating, into said ceramic element and external electrode and through dehydration-condensation, a compound being expressed by a formula of: n H 2n —Si—(OR′) 3 where R is an epoxy group, alkyl group, aryl group, perfluoroaryl group, or mixture thereof, n is a natural number, and R′ is an alkyl group having 1 to 4 carbon atoms, hydrogen, or halogen atom, wherein at least one of R′ is hydrogen. 4. A ceramic electronic device according to claim 3, wherein the ceramic element is a sintered dielectric material. 5. A method of manufacturing a ceramic electronic device, comprising the steps of:providing a ceramic electronic device including a ceramic element and an external electrode on the ceramic element;plating the external electrode;after said step of plating the external electrode, immersing the ceramic electronic device into a solution containing a compound expressed by a formula of: n H 2n —Si—(OR′) 3 where R is an epoxy group, alkyl group, aryl group, perfluoroaryl group, or mixture thereof, n is a natural number, and R′ is an alkyl group having 1 to 4 carbon atoms, hydrogen, or halogen atom, wherein at least one of R′ is hydrogen; andtaking out the immersed ceramic electronic device from the solution and subjecting the ceramic electronic device to heat treatment. 6. A method according to claim 5, wherein said step of providing the ceramic electronic device includes the sub-steps of:forming the ceramic element through stacking an internal electrode and a ceramic layer; andforming the external electrodes on the ceramic element, being electrically connected to the internal electrode. 7. A method of manufacturing a ceramic electronic device comprising the steps of:providing a ceramic electronic device including a ceramic element and an external electrode on the ceramic element;plating the external electrode;after said step of plating the external electrode, immersing the ceramic electronic device into a solution containing a compound expressed by a formula of: n H 2n —Si—(OR′) 3 where R is an epoxy group, alkyl group, aryl group, perfluoroaryl group, or mixture thereof, n is a natural number, and R′ is an alkyl group having 1 to 4 carbon atoms, hydrogen, or halogen atom, wherein at least one of R′ is hydrogen; andtaking out the immersed ceramic electronic device from the solution and subjecting the ceramic electronic device to heat treatment. 8. A method according to claim 7, wherein said step of providing the ceramic electronic device includes the sub-steps of:forming the ceramic element through stacking an internal electrode and a ceramic layer; andforming the external electrode on the ceramic element , being electrically connected to the internal electrode.
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