초록 ▼

In methods for fabricating MOS transistors with notched gate electrodes, a notched gate electrode may be readily fabricated using a damascene process for filling a stair-shaped opening formed in a multi-layered insulation layer. In this manner, the width and a height of the notch region of the gate

In methods for fabricating MOS transistors with notched gate electrodes, a notched gate electrode may be readily fabricated using a damascene process for filling a stair-shaped opening formed in a multi-layered insulation layer. In this manner, the width and a height of the notch region of the gate electrode may be readily adjusted and controlled.

대표청구항 ▼

1. A method for fabricating a MOS transistor, comprising:forming a multi-layered insulation layer, including at least two insulation layers, on a substrate;patterning the multi-layered insulation layer to form an opening exposing a predetermined region of the substrate, wherein the opening has a sta

1. A method for fabricating a MOS transistor, comprising:forming a multi-layered insulation layer, including at least two insulation layers, on a substrate;patterning the multi-layered insulation layer to form an opening exposing a predetermined region of the substrate, wherein the opening has a stair-shaped sidewall such that an upper portion of the opening is wider than a lower portion of the opening;forming a gate insulation layer on the exposed substrate;forming a gate electrode filling the opening on the gate insulation layer;removing the multi-layered insulation layer to form a gate electrode having a notch region under an edge portion thereof, the multi-layered insulation layer being removed from the notch region; andfollowing removing the multi-layered insulation layer, forming source and drain regions in the substrate using the gate electrode having the notch region as an ion implantation mask. 2. The method as claimed in claim 1, wherein the multi-layered insulation layer includes lower and upper molding layers, which are sequentially stacked. 3. The method as claimed in claim 2, wherein the lower molding layer includes a sacrificial layer and a lower insulation layer, which are sequentially stacked. 4. The method as claimed in claim 3, wherein the sacrificial layer comprises a silicon oxide layer. 5. The method as claimed in claim 3, wherein the lower insulation layer comprises a silicon oxide layer formed to have a thickness ranging from 50 to 1000 §. 6. The method as claimed in claim 3, wherein forming the opening having the stair-shaped sidewall comprises:patterning the upper molding layer using a mask pattern to form an upper opening exposing the lower insulation layer;forming a self-aligned spacer on a side of the upper opening;etching the lower insulation layer using the self-aligned spacer as an etch mask to form a lower opening exposing the sacrificial layer; andremoving the sacrificial layer using a cleaning process to expose a surface of the substrate. 7. The method as claimed in claim 6, wherein the self-aligned spacer comprises a silicon nitride layer formed to have a thickness ranging from 5 to 500 §. 8. The method as claimed in claim 3, wherein forming the opening having the stair-shaped sidewall comprises;patterning the upper molding layer using a first mask pattern to form an upper opening exposing a surface of the lower insulation layer;patterning the lower insulation layer using a second mask pattern to form a lower opening exposing a surface of the sacrificial insulation layer; andremoving the sacrificial insulation layer using a cleaning process to expose a surface of the substrate. 9. The method as claimed in claim 2, wherein the upper molding layer includes an etch stop layer, an upper insulation layer, a polishing stop layer, and a capping insulation layer, which are sequentially stacked. 10. The method as claimed in claims 9 , wherein the etch stop layer comprises a silicon nitride layer. 11. The method as claimed in claim 9, wherein the upper insulation layer comprises a silicon oxide layer formed to have a thickness ranging from 500 to 3000 Å. 12. The method as claimed in claim 9, wherein the polishing stop layer comprises a silicon nitride layer. 13. The method as claimed in claim 9, wherein the capping insulation layer comprises a silicon oxide layer. 14. The method as claimed in claim 9, wherein forming the opening having the stair-shaped sidewall comprises:patterning the capping insulation layer, the polishing stop layer, and the upper insulation layer using a mask pattern to form an upper opening exposing the etch stop layer;forming a spacer insulation layer on an entire surface of the substrate including the upper opening;etching back the spacer insulation layer until a surface of the lower molding layer is exposed such that a self-aligned spacer is formed; andetching the lower molding layer by using the self-aligned spacer as an etch mask to form a lower opening exp osing a surface of the semiconductor substrate. 15. The method as claimed in claim 14, wherein the self-aligned spacer comprises a silicon nitride layer formed to have a thickness ranging from 5 to 500 §. 16. The method as claimed in claim 9, wherein forming the opening having the stair-shaped sidewall comprises:patterning the capping insulation layer, the polishing stop layer, and the upper insulation layer using a first mask pattern to form an upper opening exposing a surface of the etch stop layer; andpatterning the etch stop layer and the lower molding layer using a second mask pattern to form a lower opening exposing a surface of the semiconductor substrate. 17. The method as claimed in claim 9, wherein forming the opening having the stair-shaped sidewall comprises:patterning the capping insulation layer, the polishing stop layer, and the upper insulation layer using a mask pattern to form an upper opening exposing the etch stop layer;forming a spacer insulation layer on an entire surface of the substrate including the upper opening;etching back the spacer insulation layer until a surface of the lower insulation layer is exposed such that a self-aligned spacer is formed;etching the lower insulation layer using the self-aligned spacer as an etch mask to form a lower opening exposing a surface of the sacrificial insulation layer; andremoving the sacrificial insulation layer using a cleaning process to expose a surface of the substrate. 18. The method as claimed in claim 17, wherein the self-aligned spacer comprises a silicon nitride layer formed to have a thickness ranging from 5 to 500 §. 19. The method as claimed in claim 9, wherein forming the opening having the stair-shaped sidewall comprises:patterning the capping insulation layer, the polishing stop layer, and the upper insulation layer using a first mask pattern to form an upper opening exposing a surface of the etch stop layer;patterning the etch stop layer and the lower insulation layer using a second mask pattern to form a lower opening exposing a surface of the sacrificial insulation layer; andremoving the sacrificial insulation layer using a cleaning process to expose a surface of the substrate. 20. The method as claimed in claim 2, wherein the lower molding layer includes a sacrificial layer and a lower insulation layer, and the upper molding layer includes an etch stop layer, an upper insulation layer, a polishing stop layer and a capping insulation layer. 21. The method as claimed in claim 2, wherein forming the opening having the stair-shaped sidewall comprises:patterning the upper molding layer using a mask pattern to form an upper opening exposing the lower molding layer;forming a self-aligned spacer on a side of the upper opening; andetching the lower molding layer using the self-aligned spacer as an etch mask to form a lower opening exposing a surface of the semiconductor substrate. 22. The method as claimed in claim 21, wherein the self-aligned spacer comprises a silicon nitride layer formed to have a thickness ranging from 5 to 500 §. 23. The method as claimed in claim 2, wherein forming the opening having the stair-shaped sidewall comprises:patterning the upper molding layer using a first mask pattern to form an upper opening exposing a surface of the lower molding layer; andpatterning the lower molding layer using a second mask pattern to form a lower opening exposing a surface of the semiconductor substrate. 24. The method as claimed in claim 1, further comprising:forming a protecting spacer insulation layer on an entire surface of the substrate including the opening with the stair-shaped sidewall; andetching back the protecting spacer insulation layer to form a protecting spacer on a side of the stair-shaped opening. 25. The method as claimed in claim 1, wherein forming the gate electrode filling the opening on the gate insulation layer comprises:forming a gate conductive layer that sufficiently fills the opening; andplanarizing the gate conductive layer using chemical mechanical polishing (CMP). 26. The method as claimed in claim 25, wherein the gate conductive layer is composed of at least one material selected from the group consisting of polysilicon, silicon germanium, cobalt, tungsten, titanium, and nickel. 27. The method as claimed in claim 1, wherein forming the source and drain regions comprises:forming lightly doped impurity source and drain regions using the gate electrode having the notch region as an ion implantation mask;forming a gate electrode spacers on sidewalls of the gate electrode having the notch region; andforming heavily doped impurity regions using the gate electrode having the notch region and the gate electrode spacers as an ion implantation mask. 28. A method for fabricating a MOS transistor, comprising:forming a multi-layered insulation layer including lower and upper molding layers which are sequentially stacked on a substrate, wherein the upper molding layer includes an etch stop layer, an upper insulation layer, a polishing stop layer, and a capping insulation layer, which are sequentially stacked;patterning the multi-layered insulation layer to form an opening exposing a predetermined region of the substrate, wherein the opening has a stair-shaped sidewall such that an upper portion of the opening is wider than a lower portion of the opening;forming a gate insulation layer on the exposed substrate;forming a gate electrode filling the opening on the gate insulation layer; andremoving the multi-layered insulation layer to form a gate electrode having a notch region under an edge portion thereof. 29. The method as claimed in claim 28, wherein the lower molding layer includes a sacrificial layer and a lower insulation layer, which are sequentially stacked. 30. A method for fabricating a MOS transistor, comprising:forming a multi-layered insulation layer including lower and upper molding layers which are sequentially stacked on a substrate;patterning the multi-layered insulation layer to form an opening exposing a predetermined region of the substrate by:patterning the upper molding layer using a mask pattern to form an upper opening exposing the lower molding layer;forming a self-aligned spacer on a side of the upper opening; andetching the lower molding layer using the self-aligned spacer as an etch mask to form a lower opening exposing a surface of the semiconductor substrate, wherein the opening has a stair-shaped sidewall such that an upper portion of the opening is wider than a lower portion of the opening;forming a gate insulation layer on the exposed substrate;forming a gate electrode filling the opening on the gate insulation layer; andremoving the multi-layered insulation layer to form a gate electrode having a notch region under an edge portion thereof.