|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||015/088.3; 015/077; 015/102|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 1 인용 특허 : 6|
A new apparatus is provided that can be applied to clean outer edges of semiconductor substrates. Under the first embodiment of the invention, a brush is mounted on the surface of the substrate around the periphery of the substrate, chemicals are fed to the surface that is being cleaned by means of a hollow core on which the cleaning brush is mounted. The surface that is being cleaned rotates at a relatively high speed thereby causing the chemicals that are deposited on this surface (by the brush) to remain in the edge of the surface. Under the second em...
1. An apparatus for cleaning a semiconductor wafer, comprising:a cylinder mounted over a semiconductor wafer, said semiconductor wafer having a peripheral edge and a center point, a first central axis of said cylinder being parallel to a surface of said semiconductor wafer, said central axis furthermore intersecting with a line through said center point of said semiconductor wafer that is perpendicular to said semiconductor wafer, said cylinder comprising:(i) an cylinder outside diameter; and(ii) a hollow core having a cross section taken in a plane that...