초록 ▼

A new apparatus is provided that can be applied to clean outer edges of semiconductor substrates. Under the first embodiment of the invention, a brush is mounted on the surface of the substrate around the periphery of the substrate, chemicals are fed to the surface that is being cleaned by means of

A new apparatus is provided that can be applied to clean outer edges of semiconductor substrates. Under the first embodiment of the invention, a brush is mounted on the surface of the substrate around the periphery of the substrate, chemicals are fed to the surface that is being cleaned by means of a hollow core on which the cleaning brush is mounted. The surface that is being cleaned rotates at a relatively high speed thereby causing the chemicals that are deposited on this surface (by the brush) to remain in the edge of the surface. Under the second embodiment of the invention, a porous roller is mounted between a chemical reservoir and the surface that is being cleaned, the surface that is being cleaned rotates at a relatively high speed. The chemicals that are deposited by the interfacing porous roller onto the surface that is being cleaned therefore remain at the edge of this surface thereby causing optimum cleaning action of the edge of the surface. After contaminants have been removed in this manner from the surface, the surface can be further cleaned by applying DI water.

대표청구항 ▼

1. An apparatus for cleaning a semiconductor wafer, comprising:a cylinder mounted over a semiconductor wafer, said semiconductor wafer having a peripheral edge and a center point, a first central axis of said cylinder being parallel to a surface of said semiconductor wafer, said central axis further

1. An apparatus for cleaning a semiconductor wafer, comprising:a cylinder mounted over a semiconductor wafer, said semiconductor wafer having a peripheral edge and a center point, a first central axis of said cylinder being parallel to a surface of said semiconductor wafer, said central axis furthermore intersecting with a line through said center point of said semiconductor wafer that is perpendicular to said semiconductor wafer, said cylinder comprising:(i) an cylinder outside diameter; and(ii) a hollow core having a cross section taken in a plane that is perpendicular to its central axis with an outside diameter that is smaller than the cylinder outside diameter, further comprising a multiplicity of channels provided in said cylinder extending in a radial manner from said hollow core of said cylinder to an outside surface of said cylinder; anda cylindrical brush attached to and mounted on an exposed surface of said cylinder, said cylindrical brush extending over said peripheral edge of said semiconductor wafer. 2. The apparatus of claim 1 said cylinder comprising:said first central axis;a longitudinal dimension of height;a cross section taken in a plane that is perpendicular to said central axis;an outside diameter;said hollow core;a means for transporting cleaning chemicals; anda means for imparting a rotating motion to said cylinder. 3. The apparatus of claim 2, wherein said means for imparting a rotating motion to said cylinder is;an axis extending from said cylinder in a direction coinciding with a direction of said central axis of said cylinder; anda means of imparting a rotating motion to said axis. 4. The apparatus of claim 2 with the addition of a means for supplying cleaning chemicals to said hollow core of said cylinder. 5. The apparatus of claim 1, said cylindrical brush attached to and mounted on an exposed surface of said cylinder having a cross section taken in a plane that is perpendicular to said central axis of said cylinder that comprises an inner circle and a therewith concentric outer circle, whereby a diameter of said inner circle is about equal to an outer diameter of said cylinder, said outer circle having a diameter larger than said diameter of said inner circle, a substantive material forming said brush being concentrated between said inner circle and said outer circle in a direction of said central axis of said cylinder over a distance shorter than a longitudinal dimension of height of said cylinder.