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[미국특허] Adjustable delay transmission line 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H03P-007/30
  • H01P-009/00
출원번호 US-0006178 (2001-12-04)
발명자 / 주소
  • Miller, Charles A.
출원인 / 주소
  • Formfactor, Inc.
대리인 / 주소
    Smith-Hill Bedell Fliesler Meyer
인용정보 피인용 횟수 : 70  인용 특허 : 31

초록

A transmission line includes a signal conductor and at least one varactor diode capacitively coupled to the signal conductor. The transmission line's signal path delay is a function of its shunt capacitance, and the varactor's capacitance forms a part of the transmission line's shunt capacitance. Th

대표청구항

1. A transmission line providing a signal path for conveying a signal between two points with an adjustable signal path delay, the transmission line comprising:a signal conductor conveying the signal between the two points;a first varactor diode having a first variable capacitance; anda first coupli

이 특허에 인용된 특허 (31) 인용/피인용 타임라인 분석

  1. Hopfer Samuel (Brooklyn NY), Analog phase shifter.
  2. Carroll Michael Scott ; Ivanov Tony Georgiev ; Martin Samuel Suresh, Article for de-embedding parasitics in integrated circuits.
  3. Bruce Jeffrey D. ; Roberts Gordon D. ; Schoenfeld Aaron M., Controlling impedances of an integrated circuit.
  4. Kondo Toshio (Kunitachi JPX) Ogawa Toshio (Chiba JPX) Ishida Kazunari (Kashiwa JPX) Ueyama Akihiro (Tama JPX), Delay circuit of ultrasonic diagnostic apparatus using delay line comprising variable capacitance diode and inductor.
  5. Hiroyuki Nagamori JP; Hitoshi Akamine JP; Shun Imai JP; Satoshi Arai JP; Yasuhiro Nunogawa JP, Directional coupler, high frequency circuit module and wireless communication system.
  6. Kleveland Bendik ; Lee Thomas H., Distributed ESD protection device for high speed integrated circuits.
  7. Haill Harry K. (Houston TX) Birchak James R. (Spring TX) Hon Wai-Leung (Sugarland TX), Driver system and distributed transmission line network for driving devices under test.
  8. Kameya Kazuo (Tsurugashima JPX), Electromagnetic variable delay line system.
  9. Shenoy Jayarama N. ; Findley Paul, Flip chip circuit arrangement with redistribution layer that minimizes crosstalk.
  10. Huppenthal Jon (Colorado Springs CO), Functional at speed test system for integrated circuits on undiced wafers.
  11. Morse Alfred W. (Ellicott City MD), High efficiency diode phase shifter.
  12. Takeuchi Kunio (Gyoda JPX), IC tester.
  13. Martel Anthony Paul ; McQuade Francis T., Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment.
  14. Blumenkranz Robert M. (Vancouver CAX), LC Delay line for feedforward amplifier.
  15. Sato Kazunari,JPX, Lead-frame having interdigitated signal and ground leads with high frequency leads positioned adjacent a corner and shi.
  16. Moline Daniel D. (Chandler AZ) Weir ; III Bernard E. (Chandler AZ), Low inductance lead frame for a semiconductor package.
  17. Schwindt Randy J., Low-current probe card with reduced triboelectric current generating cables.
  18. Vacanti, David C.; Read, John C.; Takeuchi, Jimmy S., Low-loss radio frequency multiple port variable power controller.
  19. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.
  20. Barbaste Rgis (Portet FRX) Larroque Jol (Montrabe FRX) Cerro Albert (Ramonville St Agne FRX) Labarre Florence (Versailles FRX), Microwave equalizer suitable for aerospace applications.
  21. Li Frank Xiaohui, Multi-layer printed wiring board having integrated broadside microwave coupled baluns.
  22. Ruelke Charles R. (Davie FL), Multi-layered bi-directional coupler.
  23. Tam Ambrose W. C. (Hong Lok Yuen HKX), RF coupler having non-overlapping off-set coupling lines.
  24. Moon Un-Ku ; Wilson William B., Self-calibrating voltage-controlled oscillator for asynchronous phase applications.
  25. Lin Chao-Hui (Taichung TWX), Surface mountable microwave IC package.
  26. Koscica Thomas E. (Clark NJ) Babbitt Richard W. (Fair Haven NJ) Wilber William D. (Neptune NJ), Thin film ferroelectric varactor.
  27. Agoston Agoston (Beaverton OR), Tunable delay line.
  28. Marcoux Jean (Magny Les Hameaux FRX), Tunable microwave bandstop filter device.
  29. Silverman Lawrence H. (Dix Hills NY) Teague Randy (Syosset NY) Kaminsky Richard (Dix Hills NY), Varactor tunable coupled transmission line band reject filter.
  30. Merenda Joseph Leonard, Varactor tuned strip line resonator and VCO using same.
  31. Cohn Marvin, Variable phase shifter using an array of varactor diodes for uniform transmission line loading.

이 특허를 인용한 특허 (70) 인용/피인용 타임라인 분석

  1. Strid, Eric; Gleason, K. Reed, Active wafer probe.
  2. Strid,Eric; Gleason,K. Reed, Active wafer probe.
  3. Miller, Charles A., Adjustable delay transmission line.
  4. Miller,Charles A., Adjustable delay transmission line.
  5. Miller,Charles A., Adjustable delay transmission lines.
  6. Kang,Han Chang; Lee,Chao Cheng, Apparatus and method for generating a phase delay.
  7. Strid, Eric; Campbell, Richard, Calibration structures for differential signal probing.
  8. Campbell, Richard; Strid, Eric W.; Andrews, Mike, Differential signal probe with integral balun.
  9. Strid, Eric; Campbell, Richard, Differential signal probing system.
  10. Campbell, Richard L.; Andrews, Michael, Differential waveguide probe.
  11. Mahanavelu,Ravindran; Heydari,Payam, Distributed delay-locked-based clock and data recovery systems.
  12. Mahanavelu,Ravindran; Heydari,Payam, Distributed delay-locked-based clock and data recovery systems.
  13. Burcham, Terry; McCann, Peter; Jones, Rod, Double sided probing structures.
  14. Burcham,Terry; McCann,Peter; Jones,Rod, Double sided probing structures.
  15. Andrews, Peter; Hess, David; New, Robert, Interface for testing semiconductors.
  16. Tervo,Paul A.; Cowan,Clarence E., Low-current pogo probe card.
  17. Tervo,Paul A.; Cowan,Clarence E., Low-current pogo probe card.
  18. Schwindt,Randy J., Low-current probe card.
  19. Gleason, K. Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
  20. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
  21. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing structure with laterally scrubbing contacts.
  22. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing system.
  23. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth; Lesher,Timothy; Koxxy,Martin, Membrane probing system.
  24. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth; Lesher,Timothy; Koxxy,Martin, Membrane probing system.
  25. Smith,Kenneth; Gleason,Reed, Membrane probing system.
  26. Smith,Kenneth; Gleason,Reed, Membrane probing system.
  27. Tervo,Paul A.; Smith,Kenneth R.; Cowan,Clarence E.; Dauphinais,Mike P.; Koxxy,Martin J., Membrane probing system.
  28. Tervo,Paul A.; Smith,Kenneth R.; Cowan,Clarence E.; Dauphinais,Mike P.; Koxxy,Martin J., Membrane probing system.
  29. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing system with local contact scrub.
  30. Gleason,K. Reed; Smith,Kenneth R.; Bayne,Mike, Membrane probing system with local contact scrub.
  31. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth, Method for constructing a membrane probe using a depression.
  32. Hayden, Leonard; Martin, John; Andrews, Mike, Method of assembling a wafer probe.
  33. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth, Method of constructing a membrane probe.
  34. Smith, Kenneth R., Method of replacing an existing contact of a wafer probing assembly.
  35. Ding, Hanyi; Woods, Jr., Wayne H., On-chip variable delay transmission line with fixed characteristic impedance.
  36. Strid,Eric; Campbell,Richard, On-wafer test structures for differential signals.
  37. Tervo,Paul A.; Cowan,Clarence E., POGO probe card for low current measurements.
  38. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  39. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  40. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  41. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  42. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  43. Campbell,Richard L.; Andrews,Michael; Bui,Lynh, Probe for high frequency signals.
  44. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Probe for testing a device under test.
  45. Smith, Kenneth; Jolley, Michael; Van Syckel, Victoria, Probe head having a membrane suspended probe.
  46. Smith,Kenneth; Jolley,Michael; Van Syckel,Victoria, Probe head having a membrane suspended probe.
  47. Schwindt,Randy, Probe holder for testing of a test device.
  48. Smith, Kenneth R.; Hayward, Roger, Probing apparatus with impedance optimized interface.
  49. Smith, Kenneth R., Replaceable coupon for a probing apparatus.
  50. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for high-frequency testing of a device under test.
  51. Gleason, K. Reed; Lesher, Tim; Strid, Eric W.; Andrews, Mike; Martin, John; Dunklee, John; Hayden, Leonard; Safwat, Amr M. E., Shielded probe for testing a device under test.
  52. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
  53. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
  54. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
  55. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
  56. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for testing a device under test.
  57. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for testing a device under test.
  58. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe with low contact resistance for testing a device under test.
  59. Elad, Danny; Goren, David; Shlafman, Shlomo, Structure and compact modeling of variable transmission lines.
  60. Ding, Hanyi; Woods, Jr., Wayne H., Structure, structure and method for providing an on-chip variable delay transmission line with fixed characteristic impedance.
  61. Ding, Hanyi; Woods, Jr., Wayne H., Structure, structure and method for providing an on-chip variable delay transmission line with fixed characteristic impedance.
  62. Ding, Hanyi; Woods, Jr., Wayne H., Structure, structure and method for providing an on-chip variable delay transmission line with fixed characteristic impedance.
  63. Andrews, Peter; Hess, David, System for testing semiconductors.
  64. Campbell, Richard, Test structure and probe for differential signals.
  65. Campbell,Richard, Test structure and probe for differential signals.
  66. Hayden, Leonard; Martin, John; Andrews, Mike, Wafer probe.
  67. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  68. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  69. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  70. Campbell, Richard, Wideband active-passive differential signal probe.

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