초록 ▼

A receptacle assembly includes a guide frame having top, bottom and side walls joined to form an interior cavity configured to receive an electrical module. One of the top, bottom and side walls has an opening therethrough, and a heat sink is mounted over the opening. The heat sink has an engagement

A receptacle assembly includes a guide frame having top, bottom and side walls joined to form an interior cavity configured to receive an electrical module. One of the top, bottom and side walls has an opening therethrough, and a heat sink is mounted over the opening. The heat sink has an engagement surface located proximate the interior cavity of the guide frame, and the engagement surface of the heat sink is configured to physically contact a module when installed in said interior cavity. The heat sink dissipates heat generated in the module and facilitates a data transmission rate of 10 Gbs through the assembly.

대표청구항 ▼

1. A receptacle assembly, comprising:a guide frame having top, bottom and side walls joined to form an interior cavity configured to receive an electrical module, one of said top, bottom and side walls having an opening therethrough; anda heat sink mounted over said opening in said one of said top,

1. A receptacle assembly, comprising:a guide frame having top, bottom and side walls joined to form an interior cavity configured to receive an electrical module, one of said top, bottom and side walls having an opening therethrough; anda heat sink mounted over said opening in said one of said top, bottom and side walls, said heat sink having an engagement surface located proximate said interior cavity of said guide frame, said engagement surface of said heat sink being configured to physically contact a module when installed in said interior cavity. 2. The receptacle assembly of claim 1, wherein said opening is in said top wall and said bottom wall is configured to be mounted to a circuit board. 3. The receptacle assembly of claim 1, wherein said opening is provided in said top wall, said top wall includes front, rear and opposed lateral portions that define a perimeter of said opening and that support said heat sink when mounted over said opening. 4. The receptacle assembly of claim 1, wherein said opening includes notched out portions of said side walls, said heat sink resting on edges of said side walls in said notched out portions. 5. The receptacle assembly of claim 1, further comprising a retention tab formed on one of said side walls, said retention tab engaging a heat sink clip retaining said heat sink on said guide frame. 6. The receptacle assembly of claim 1, further comprising a clip provided over said heat sink, said clip securely engaging said guide frame to retain said heat sink upon said guide frame. 7. The receptacle assembly of claim 1, further comprising a spring member secured over said heat sink, said spring member flexing to permit said heat sink to move outward away from said guide frame when a module is inserted, said spring member exerting a desired force against said heat sink to facilitate thermal transfer. 8. The receptacle assembly of claim 1, further comprising a clip having side rails that snap over said side walls of said guide frame, said side rails being joined by spring members that extend over, and flexibly engage, said heat sink. 9. The receptacle assembly of claim 1, wherein said engagement surface of said heat sink is stepped to extend into said interior cavity of said guide frame. 10. The receptacle assembly of claim 1, wherein said heat sink includes a peripheral surface surrounding said engagement surface, said peripheral surface being recessed with respect to a plane containing said engagement surface. 11. The receptacle assembly of claim 1, wherein, when the module is removed, said engagement surface of said heat sink rests within said interior cavity of said guide frame at a level that interferes with an installation path of the module, said heat sink being movable outward by the module when the module is installed to provide an abutting interface between the heat sink and module. 12. The receptacle assembly of claim 1, wherein said engagement surface of said heat sink is flat and smooth to slide along a mating surface of a module when installed. 13. The receptacle assembly of claim 1, further comprising a thermal interface material disposed on said engagement surface of said heat sink, said thermal interface material configured to be compressed between said engagement surface and an adjoining surface of the module when the module is installed. 14. The receptacle assembly of claim 1, further comprising a triangular retention tab formed on one of said side walls, said retention tab engaging a heat sink clip, thereby retaining said heat sink from horizontal and vertical movement relative to said guide frame. 15. A transceiver receptacle assembly, comprising:a guide frame having top, bottom and side walls joined to form an interior cavity configured to receive a transceiver, one of said top, bottom and side walls having an opening therethrough; anda heat sink mounted over said opening in said one of said top, bottom and side walls, said heat sink having an engagement surface located p roximate said interior cavity of said guide frame, said engagement surface of said heat sink being configured to physically contact the transceiver when installed in said interior cavity. 16. The transceiver receptacle assembly of claim 15, wherein said opening is surrounded by front, rear and opposed lateral portions of said one of said top, bottom and side walls, said front, rear and lateral portions defining a perimeter of said opening and defining a maximum distance that said heat sink extends into said interior cavity. 17. The transceiver receptacle assembly of claim 15, further comprising a clip having a spring member secured over said heat sink, said spring member flexing to permit said heat sink to move outward away from said guide frame when a transceiver is inserted, said clip having side rails that snap over said side walls of said guide frame. 18. The transceiver receptacle assembly of claim 15, wherein said engagement surface of said heat sink is stepped to extend into said interior cavity of said guide frame. 19. The transceiver receptacle assembly of claim 15, wherein said heat sink includes a peripheral surface surrounding said engagement surface, said peripheral surface being recessed with respect to a plane containing said engagement surface. 20. The transceiver receptacle assembly of claim 15, wherein, when the transceiver is removed, said engagement surface of said heat sink rests within said interior cavity of said guide frame at a level that interferes with an installation path of the transceiver, said heat sink being movable outward by the transceiver when the transceiver is installed to provide an abutting interface between the heat sink and transceiver. 21. The transceiver receptacle assembly of claim 15, wherein said engagement surface of said heat sink is flat and smooth to slide along a mating surface of a transceiver when installed.