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Augmenting air cooling of electronics systems using a cooling fluid to cool air entering the electronics system, and to remove a portion of the heat dissipated by the electronics. A cooled electronics system includes a frame, electronics drawers, fans or air moving devices, and an inlet heat exchang

Augmenting air cooling of electronics systems using a cooling fluid to cool air entering the electronics system, and to remove a portion of the heat dissipated by the electronics. A cooled electronics system includes a frame, electronics drawers, fans or air moving devices, and an inlet heat exchanger. A cooling fluid such as chilled water is supplied to the inlet heat exchanger, to cool incoming air below ambient temperature. Fans cause ambient air to enter the system, flow through the inlet heat exchanger, through electronic devices, and exit the system. An optional exhaust heat exchanger further transfers heat dissipated by electronic devices to the cooling fluid. Heat exchangers are pivotally mounted, providing drawer access. Segmented heat exchangers provide access to individual drawers. Heat exchangers are integrated into cover assemblies. Airflow guides such as louvers are provided at inlets and outlets. Cover assemblies provide a degree of acoustic and electromagnetic shielding.

대표청구항 ▼

1. A cooled electronics system comprising:a frame, said frame having:an air inlet and an air outlet, said inlet and outlet respectively enabling ingress and egress of external air;at least one electronics drawer;at least one air moving device, said air moving device being capable of causing external

1. A cooled electronics system comprising:a frame, said frame having:an air inlet and an air outlet, said inlet and outlet respectively enabling ingress and egress of external air;at least one electronics drawer;at least one air moving device, said air moving device being capable of causing external air to flow from said inlet, across said drawer, and to said outlet,an inlet fluid-to-air heat exchanger movably mounted to said frame at said air inlet, said inlet heat exchanger capable of cooling air entering said frame below ambient temperature when said heat exchanger is in a first position, said heat exchanger capable of being moved into at least a second position thereby providing access to said at least one electronics drawer. 2. The system of claim 1, comprising a plurality of said electronics drawers and a plurality of said air moving devices. 3. The system of claim 2, wherein said inlet heat exchanger includes a plurality of segments. 4. The system of claim 1, wherein said inlet heat exchanger is pivotally mounted on said frame. 5. The system of claim 4, wherein said inlet heat exchanger extends vertically substantially along the inlet of said frame. 6. The system of claim 4, wherein said inlet heat exchanger extends vertically along a portion of the inlet of said frame. 7. The system of claim 1, further comprising an inlet cover pivotally mounted to said frame, said inlet cover including an air-permeable portion. 8. The system of claim 7, further comprising louvers on said inlet cover. 9. The system of claim 8, wherein said louvers face downward. 10. The system of claim 7, wherein said inlet heat exchanger is integrated into said inlet cover. 11. The system of claim 1, further comprising an outlet fluid-to-air heat exchanger movably mounted to said frame at said air outlet, said outlet heat exchanger capable of cooling air exiting said frame when said heat exchanger is in a first position, said heat exchanger capable of being moved into at least a second position thereby providing access to said at least one electronics drawer. 12. The system of claim 11, wherein said outlet heat exchanger is pivotally mounted on said frame. 13. The system of claim 11, further comprising an outlet cover pivotally mounted to said frame, said outlet cover including an air-permeable portion. 14. The system of claim 13, further comprising louvers on said outlet cover. 15. The system of claim 14, wherein said louvers face upward. 16. The system of claim 13, wherein said outlet heat exchanger is integrated into said outlet cover. 17. A cooled electronics system comprising:a frame, said frame having an air inlet and an air outlet;a plurality of electronics drawers within said frame;a plurality of air moving devices within said frame, said air moving devices being capable of causing air to flow from said inlet, across said drawer, and to said outlet; andan inlet heat exchanger located at said air inlet, said inlet heat exchanger capable of cooling air entering said frame below ambient temperature, said inlet heat exchanger including a plurality of segments, wherein said segments are pivotally mounted on said frame, each segment capable of being pivoted independently of any others of said segments. 18. The system of claim 17, wherein each of said plurality of segments is associated with one drawer, thereby allowing removal of one of said drawers while cooling others of said drawers. 19. The system of claim 17, wherein at least one of said plurality of segments is associated with a plurality of said drawers. 20. The system of claim 17, further comprising an outlet heat exchanger located at said air outlet, said outlet heat exchanger capable of cooling air exiting said frame, said outlet heat exchanger including a plurality of segments, wherein said outlet heat exchanger segments are pivotally mounted on said frame, each outlet heat exchanger segment capable of being pivoted independently of any others of said outlet heat exchanger segments. 21. A method of cooling an electronics system, the method comprising:causing external air to enter said electronics system;providing a first heat exchanger movably connected to said electronics system to cool incoming air to a temperature below ambient temperature;causing air exiting the first heat exchanger to flow through and then exit the electronics system. 22. The method of claim 21, further comprising:providing a second heat exchanger movably connected to said electronics system;causing air exiting the electronics system to flow through the second heat exchanger;exhausting air from the second heat exchanger at near ambient temperature. 23. The method of claim 22, wherein exhausted air is at a temperature no more than 10° C. higher than ambient temperature. 24. A cooled electronics system comprising:a frame, said frame having:an air inlet and an air outlet, said inlet and outlet respectively enabling ingress and egress of external air;a plurality of electronics drawers;a plurality of air moving devices, said air moving devices being capable of causing external air to flow from said inlet, across said drawers, and to said outlet;an inlet cover pivotally mounted to said frame at said air inlet, said inlet cover including an air-permeable portion, said inlet cover having louvers to direct incoming airflow;an inlet fluid-to-air heat exchanger integrated into said inlet cover, said inlet heat exchanger capable of cooling air entering said frame below ambient temperature when in a first position, said inlet heat exchanger further capable of pivoting as a single unit along with said inlet cover to a second position thereby providing access to said plurality of electronics drawers;wherein said inlet cover, said louvers, and said inlet heat exchanger provide acoustic insulation and electromagnetic shielding. 25. The system of claim 24, further comprising:an outlet cover pivotally mounted to said frame at said air outlet, said outlet cover including an air-permeable portion, said outlet cover having louvers to direct outgoing airflow;an outlet fluid-to-air heat exchanger integrated into said outlet cover, said outlet heat exchanger capable of cooling air exiting said frame when in a first position,said outlet heat exchanger further capable of pivoting as a single unit along with said outlet cover to a second position thereby providing access to said plurality of electronics drawers;wherein said outlet cover, said louvers, and said outlet heat exchanger provide acoustic insulation and electromagnetic shielding.