초록 ▼

A method and an apparatus for removing a liquid, i.e. a wet processing liquid, from at least one surface of at least one substrate is disclosed. A liquid is supplied on a surface of substrate. Simultaneously or thereafter the liquid or the substrate is locally heated to thereby reduce the surface te

A method and an apparatus for removing a liquid, i.e. a wet processing liquid, from at least one surface of at least one substrate is disclosed. A liquid is supplied on a surface of substrate. Simultaneously or thereafter the liquid or the substrate is locally heated to thereby reduce the surface tension of said liquid. By doing so, at least locally a sharply defined liquid-ambient boundary is created. According to the invention, the substrate is subjected to a rotary movement at a speed to guide said liquid-ambient boundary over the surface of the substrate thereby removing said liquid from said surface.

대표청구항 ▼

1. A method of removing a liquid from at least one surface of at least one substrate comprising the steps of:subjecting said substrate to a rotary movement;supplying a liquid on at least a part of said surface of said substrate; andlocally heating said liquid on said part of said surface to remove a

1. A method of removing a liquid from at least one surface of at least one substrate comprising the steps of:subjecting said substrate to a rotary movement;supplying a liquid on at least a part of said surface of said substrate; andlocally heating said liquid on said part of said surface to remove at least a portion of said liquid and create a sharply defined liquid-ambient boundary, at least locally, while subjecting said substrate to said rotary movement and supplying said liquid, said liquid-ambient boundary separating a liquid-covered region and a liquid-removed region on said substrate,wherein said rotary movement is performed at a speed to guide the sharply defined liquid-ambient boundary over the substrate. 2. A method as recited in claim 1, wherein said rotary movement is applied to a single substrate such that said substrate rotates around its own center. 3. A method as in claim 2, wherein the rotation speed is in the range from 2 to 40 revolutions per second. 4. A method as recited in claim 1, wherein said heating is accomplished by one of dispensing a heated gas; dispensing a heated vapor; and dispensing a heated mixture of a gas and a vapor. 5. A method as recited in claim 1, wherein said liquid comprises one of an etching liquid, a cleaning liquid and a rinsing liquid. 6. A method as recited in claim 1, wherein said liquid comprises a dilute aqueous solution. 7. A method as recited in claim 5, wherein said cleaning liquid comprises one of a mixture of NH 4 OH, H 2 O 2 and H 2 O; a mixture of HCI, H 2 O 2 and H 2 O; diluted HCI; and a mixture comprising O 3 . 8. A method as recited in claim 5, wherein said rinsing liquid comprises one of H 2 O; and a mixture of H 2 O and an acid, said mixture having a pH between 2 and 6. 9. The method of claim 1, wherein said liquid is supplied within said liquid-covered region of said liquid-ambient boundary. 10. A method of removing a liquid from a first surface and a second surface of at least one substrate comprising the steps of:subjecting said substrate to a rotary movement;supplying a liquid on at least a part of said first surface and at least a part of said second surface of said substrate; andlocally heating said liquid on said part of said first surface and on said part of said second surface to remove at least a portion of said liquid, such that the surface tension of said liquid is locally reduced due to a surface tension gradient being formed in the liquid, the gradient being in a direction away from a sharply defined liquid-ambient boundary that is created, at least locally, during the steps of subjecting said substrate to a rotary movement, locally heating and supplying said liquid, said liquid-ambient boundary separating a liquid-covered region and a liquid-removed region on said substrate, andwherein said rotary movement is performed at a speed to guide the sharply defined liquid-ambient boundary over the substrate. 11. An apparatus for removing a liquid from at least one surface of at least one substrate, said apparatus comprising:a substrate holder which is subjectable to a rotary movement, said substrate being releasably held by said substrate holder;at least one liquid supply system for applying a liquid on at least a part of said surface of said substrate;at least one heat source for locally heating and removing at least a portion of said liquid; andsaid heat source and said liquid supply system being positioned such that said heating is applied closer to the center of said rotary movement of said substrate holder than said liquid and wherein said heat source and said liquid are positioned such that, at least locally, a sharply defined liquid-ambient boundary is created on said surface of said substrate, said liquid-ambient boundary separating a liquid-covered region and a liquid-removed region on said substrate. 12. An apparatus as recited in claim 11, further comprising a chamber wherein said substrate holder is positioned, said chamber being des igned in a manner to avoid back splashing of said liquid onto said surface of said substrate. 13. An apparatus as recited in claim 11, wherein said heating source comprises at least one nozzle for dispensing one of a heated gas; a heated vapor; and a heated mixture of a vapor and a gas onto said surface of said substrate, and said liquid supply system comprises at least one nozzle for applying said liquid on said part of said surface of said substrate, said nozzles are positioned such that said heating is applied closer to the center of the rotary movement of the substrate holder than said liquid. 14. An apparatus as recited in claim 13, where said nozzles are mounted on an arm, said arm being movable relative to said substrate holder.