A method is provided for using a woven preform having a base and at least one leg extending from the base. The preform is used to assemble first and second composite laminate components formed from tape or fabric and a resin matrix. Z-pins are inserted into the first component prior to its being cur
A method is provided for using a woven preform having a base and at least one leg extending from the base. The preform is used to assemble first and second composite laminate components formed from tape or fabric and a resin matrix. Z-pins are inserted into the first component prior to its being cured, forming a stubble extending above a surface of the first component. The uncured preform is placed on the surface of the first component, the stubble extending into the preform. The cured second component is attached to the preform. Over-wrap plies are optionally placed on the outer surfaces of preform. Adhesive is optionally placed between the preform and the first and second components. A vacuum bag and tooling are used while curing the preform to adhere the legs of the preform to the second component and the base of the preform to the first component.
대표청구항▼
1. A method of making a composite structure, the method comprising:(a) locating at least two peel two peel plies on the bonding surface of a component, with a first one of the peel plies being of a woven material and being in contact with the bonding surface; then(b) inserting pins through the peel
1. A method of making a composite structure, the method comprising:(a) locating at least two peel two peel plies on the bonding surface of a component, with a first one of the peel plies being of a woven material and being in contact with the bonding surface; then(b) inserting pins through the peel plies and into the component prior to curing of the component; then(c) curling the component;(d) providing a woven preform having a base and two legs extending from the base, the legs defining a slot; then(e) removing the peel plies to expose a stubble created by the pins and placing the base of the preform against the bonding surface of the component, the pins extending into the base of the preform;(f) curing the preform to adhere the base of the preform to the component;wherein step (b) comprises placing a foam carrier containing the pins against the peel plies and exerting a downward force on the foam carrier, then removing the foam carrier before curing the component in step, (c); and wherein the method further comprisesleveling the pins to cause ends of the pins to be flush with an exterior surface of the peel plies after removal of the foam carrier. 2. The method of claim 1, further comprising:inserting a second component into the slot of the preform after step (e) and before step (f); andcompleting step (f) with the second component in the slot. 3. The method of claim 1, further comprising:inserting a rigid sizing tool into the slot of the preform after step (e) and before step (f);completing step (f) with the sizing tool in the slot;removing the sizing tool after step (f), the slot being sized for insertion of a second component; andinserting the second component into the slot and adhering the second component to the preform. 4. A method of joining first and second composite components the method comprising:(a) placing a stack of layers onto a bonding surface of the first component, a first layer of the stack of layers being in contact with the bonding surface and being a woven peel ply layer;(b) providing a plurality of Z-pins in a foam carrier and inserting the Z-pins through the stack of layers into the first component prior to coring the first component by placing the foam carrier in contact with the stack of layers and exerting a force on the foam carrier;(c) curing the first component;(d) leveling the Z-pins to cause ends of the Z-pins to be flush with an exterior surface of the stack of layers with the foam carrier removed;(e) providing a woven preform having a base and at least one leg extending front the base;(f) removing the stack of layers after the first component has been cured, creating a stubble of Z-pins above the bonding surface, then placing the base of the preform against the bonding surface of the first component, the stubble extending into the base of the preform;(g) placing the second component in contact with the leg of the preform; and(h) curing the preform to adhere the base of the preform to the first component and the leg of the preform to the second component, joining the components with the preform. 5. The method of claim 4, further comprising:in step (f), inserting adhesive between the base of the preform and tire first component. 6. The method of claim 4, further comprising:in step (g), inserting adhesive between the leg of the preform and the second component. 7. The method of claim 4, further comprising:removing the foam carrier before curing the panel in step (c). 8. The method of claim 4, wherein step (d) comprises:after curing the panel in step (c) removing at least one of the layers and trimming the stubble to a height equal to a height of the layers that remain on the bonding surface. 9. The method of claim 4, wherein step (d) comprises:before curing the panel in step (c), removing at least one of the layers to expose ends of the Z-pins and exerting an additional force on the ends of the Z-pins until the ends are flush with the exterior surface of the remaining layers. 10. The method of claim 4, wherein:the peel ply is formed from nylon fibers. 11. The method of claim 4, wherein:the peel ply is formed from glass fibers. 12. The method of claim 4, wherein the stack of layers comprises:an elastomeric spacer located above the first layer. 13. A method of joining a woven preform to a panel the method comprising:(a) placing at least one woven peel ply layer in contact with a bonding surface of a composite panel;(b) providing a plurality of Z-pins within a foam carrier and inserting Z-pins into the peel ply layer and the composite panel prior to curing the panel by placing the foam carrier on the peel ply layer and exerting a downward force on the foam carrier, then removing the foam carrier; then(c) curing the panel; then(d) after the panel is fully cured, removing the peel ply layer to expose the bonding surface and form a stubble of Z-pins protruding from the bonding surface;(e) providing a woven preform having a base and at least one leg that extends from the base, the preform being infused with uncured resin; then(f) placing the base of the preform against the bonding surface of the panel after the peel ply layer has been removed, the stubble extending into the base of the preform; then(g) curing the preform with the at least one leg in a desired orientation; and after application of the peel ply and before insertion of the Z-pins, beating the panel and the peel ply to hot debulk the panel and the peel ply. 14. The method of claim 13, whereinstep (a) further comprises locating an elastomeric spacer on the peel ply and removing the spacer along with the peel ply before step (f). 15. A method of joining a woven preform to a panel, the method comprising:(a) placing at least one woven peel ply layer in contact with a bonding surface of a composite panel;(b) providing a plurality of Z-pins within a foam carrier and inserting Z-pins into the peel ply layer and the composite panel prior to curing the panel by placing the foam carrier on the peel ply layer and exerting a downward force on the foam carrier, then removing the foam carrier; then(c) curing the panel; then(d) after the panel is fully cured, removing the peel ply layer to expose the bonding surface and form a stubble of Z-pins protruding from the bonding surface;(e) providing a woven preform having a base and at least one leg that extends from the base, the preform being infused with uncured resin; then(f) placing the base of the preform against the bonding surface of the panel after the peel ply layer has been removed, the stubble extending into the base of the preform; then(g) curing the preform with the at least one leg in a desired orientation; andshearing ends of the Z-pins flush with an exterior surface of the peel ply layer before step (f). 16. A method of joining a woven preform to a panel, the method comprising:(a) placing at least one woven peel ply layer in contact with a bonding surface of a composite panel;(b) providing a plurality of Z-pins within a foam carrier and inserting Z-pins into the peel ply layer and the composite panel prior to curing the panel by placing the foam carrier on the peel ply layer and exerting a downward force on the foam carrier, then removing the foam carrier; then(c) curing the panel; then(d) after the panel is fully cured, removing the peel ply layer to expose the bonding surface and form a stubble of Z-pins protruding from the bonding surface;(e) providing a woven preform having a base and at least one leg that extends from the base, the preform being infused with uncured resin; then(f) placing the base of the preform against the bonding surface of the panel after the peel ply layer has been removed, the stubble extending into the base of the preform; then(g) curing the preform with the at least one leg in a desired orientation; and whereinstep (a) comprises placing at least two of the woven-fabric peel plies on the bonding surface of the panel with a non-porous film between them and removing both of the peel plie s and the non-porous film before step (f). 17. A method of joining a woven preform to a panel, the method comprising:(a) placing at least one woven peel ply layer in contact with a bonding surface of a composite panel:(b) providing a plurality of Z-pins within a foam carrier and inserting Z-pins into the peel ply layer and the composite panel prior to curing the panel by placing the foam carrier on the peel ply layer and exerting a downward force on the foam carrier, then removing the foam carrier; then(c) curing the panel; then(d) after the panel is fully cured, removing the peel ply layer to expose the bonding surface and form a stubble of Z-pins protruding from the bonding surface;(e) providing a woven preform having a base and at least one leg that extends from the base, the preform being infused with uncured resin; then(f) placing the base of the preform against the bonding surface of the panel after the peel ply layer has been removed, the stubble extending into the base of the preform; then(g) curing the preform with the at least one leg in a desired orientation; andin step (a) placing additional layers on the woven peel ply before inserting the Z-pins; andafter insertion of the Z-pins, removing at least one of the additional layers along with the foam carrier, and leveling the Z-pins to cause ends of the Z-pins to be flush with the remaining layers on the bonding surface of the panel. 18. The method according to claim 17, wherein the Z-pins are leveled by shearing the ends of the Z-pins after the panel is cured in step (c). 19. A method of making a composite structure, the method comprising:(a) locating at least two peel plies on the bonding surface of a component, with a first one of the peel plies being of a woven material and being in contact with the bonding surface; then(b) inserting pins trough the peel plies and into the component prior to curing of the component; then(c) curing the component;(d) providing a woven preform having a base and two legs extending from the base, the legs defining a slot; then(e) removing the peel plies to expose a stubble created by the pins and placing the base of tire preform against the bonding surface of the component, the pins extending into the base of the preform;(f) curing the preform to adhere the base of the preform to the component;wherein step (b) comprises placing a foam carrier containing the pins against the peel plies and exerting a downward force on the foam carrier, then removing the foam carrier before curing the component in step (c); and wherein the method further comprisesafter removal of the foam carrier and after curing the component in step (c), removing at least one of the peel plies and shearing protruding ends of the pins to be flush with an exterior surface of a remaining one of the peel plies.
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이 특허에 인용된 특허 (12)
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