[특허]Co-bonded joint with Z-pins

Lockheed Martin Corporation

검색어에 아래의 연산자를 사용하시면 더 정확한 검색결과를 얻을 수 있습니다.
검색연산자

검색도움말
검색연산자	기능	검색시 예
()	우선순위가 가장 높은 연산자	예1) (나노 (기계 \| machine))
공백	두 개의 검색어(식)을 모두 포함하고 있는 문서 검색	예1) (나노 기계) 예2) 나노 장영실
\|	두 개의 검색어(식) 중 하나 이상 포함하고 있는 문서 검색	예1) (줄기세포 \| 면역) 예2) 줄기세포 \| 장영실
!	NOT 이후에 있는 검색어가 포함된 문서는 제외	예1) (황금 !백금) 예2) !image
*	검색어의 *란에 0개 이상의 임의의 문자가 포함된 문서 검색	예) semi*
""	따옴표 내의 구문과 완전히 일치하는 문서만 검색	예) "Transform and Quantization"

과학기술 지식인프라 ScienceON

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

특허 상세정보

MyON담기

내보내기 페이스북 공유 트위터 공유 카카오톡 공유

Co-bonded joint with Z-pins

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B32B-007/08 B32B-005/22
미국특허분류(USC)	156/092; 156/307.1
출원번호	US-0973208 (2001-10-09)
발명자 / 주소	Benson, Ross A. Sheahen, Patrick D. Bersuch, Larry R.
출원인 / 주소	Lockheed Martin Corporation
대리인 / 주소	Bracewell & Patterson, L.L.P.
인용정보	피인용 횟수 : 10 인용 특허 : 12

초록
▼

A method is provided for using a woven preform having a base and at least one leg extending from the base. The preform is used to assemble first and second composite laminate components formed from tape or fabric and a resin matrix. Z-pins are inserted into the first component prior to its being cured, forming a stubble extending above a surface of the first component. The uncured preform is placed on the surface of the first component, the stubble extending into the preform. The cured second component is attached to the preform. Over-wrap plies are optionally placed on the outer surfaces of preform. Adhesive is optionally placed between the preform and the first and second components. A vacuum bag and tooling are used while curing the preform to adhere the legs of the preform to the second component and the base of the preform to the first component.

대표
청구항
▼

1. A method of making a composite structure, the method comprising:(a) locating at least two peel two peel plies on the bonding surface of a component, with a first one of the peel plies being of a woven material and being in contact with the bonding surface; then(b) inserting pins through the peel plies and into the component prior to curing of the component; then(c) curling the component;(d) providing a woven preform having a base and two legs extending from the base, the legs defining a slot; then(e) removing the peel plies to expose a stubble created by the pins and placing the base of the preform against the bonding surface of the component, the pins extending into the base of the preform;(f) curing the preform to adhere the base of the preform to the component;wherein step (b) comprises placing a foam carrier containing the pins against the peel plies and exerting a downward force on the foam carrier, then removing the foam carrier before curing the component in step, (c); and wherein the method further comprisesleveling the pins to cause ends of the pins to be flush with an exterior surface of the peel plies after removal of the foam carrier. 2. The method of claim 1, further comprising:inserting a second component into the slot of the preform after step (e) and before step (f); andcompleting step (f) with the second component in the slot. 3. The method of claim 1, further comprising:inserting a rigid sizing tool into the slot of the preform after step (e) and before step (f);completing step (f) with the sizing tool in the slot;removing the sizing tool after step (f), the slot being sized for insertion of a second component; andinserting the second component into the slot and adhering the second component to the preform. 4. A method of joining first and second composite components the method comprising:(a) placing a stack of layers onto a bonding surface of the first component, a first layer of the stack of layers being in contact with the bonding surface and being a woven peel ply layer;(b) providing a plurality of Z-pins in a foam carrier and inserting the Z-pins through the stack of layers into the first component prior to coring the first component by placing the foam carrier in contact with the stack of layers and exerting a force on the foam carrier;(c) curing the first component;(d) leveling the Z-pins to cause ends of the Z-pins to be flush with an exterior surface of the stack of layers with the foam carrier removed;(e) providing a woven preform having a base and at least one leg extending front the base;(f) removing the stack of layers after the first component has been cured, creating a stubble of Z-pins above the bonding surface, then placing the base of the preform against the bonding surface of the first component, the stubble extending into the base of the preform;(g) placing the second component in contact with the leg of the preform; and(h) curing the preform to adhere the base of the preform to the first component and the leg of the preform to the second component, joining the components with the preform. 5. The method of claim 4, further comprising:in step (f), inserting adhesive between the base of the preform and tire first component. 6. The method of claim 4, further comprising:in step (g), inserting adhesive between the leg of the preform and the second component. 7. The method of claim 4, further comprising:removing the foam carrier before curing the panel in step (c). 8. The method of claim 4, wherein step (d) comprises:after curing the panel in step (c) removing at least one of the layers and trimming the stubble to a height equal to a height of the layers that remain on the bonding surface. 9. The method of claim 4, wherein step (d) comprises:before curing the panel in step (c), removing at least one of the layers to expose ends of the Z-pins and exerting an additional force on the ends of the Z-pins until the ends are flush with the exterior surface of the remaining layers. 10. The method of claim 4, wherein:the peel ply is formed from nylon fibers. 11. The method of claim 4, wherein:the peel ply is formed from glass fibers. 12. The method of claim 4, wherein the stack of layers comprises:an elastomeric spacer located above the first layer. 13. A method of joining a woven preform to a panel the method comprising:(a) placing at least one woven peel ply layer in contact with a bonding surface of a composite panel;(b) providing a plurality of Z-pins within a foam carrier and inserting Z-pins into the peel ply layer and the composite panel prior to curing the panel by placing the foam carrier on the peel ply layer and exerting a downward force on the foam carrier, then removing the foam carrier; then(c) curing the panel; then(d) after the panel is fully cured, removing the peel ply layer to expose the bonding surface and form a stubble of Z-pins protruding from the bonding surface;(e) providing a woven preform having a base and at least one leg that extends from the base, the preform being infused with uncured resin; then(f) placing the base of the preform against the bonding surface of the panel after the peel ply layer has been removed, the stubble extending into the base of the preform; then(g) curing the preform with the at least one leg in a desired orientation; and after application of the peel ply and before insertion of the Z-pins, beating the panel and the peel ply to hot debulk the panel and the peel ply. 14. The method of claim 13, whereinstep (a) further comprises locating an elastomeric spacer on the peel ply and removing the spacer along with the peel ply before step (f). 15. A method of joining a woven preform to a panel, the method comprising:(a) placing at least one woven peel ply layer in contact with a bonding surface of a composite panel;(b) providing a plurality of Z-pins within a foam carrier and inserting Z-pins into the peel ply layer and the composite panel prior to curing the panel by placing the foam carrier on the peel ply layer and exerting a downward force on the foam carrier, then removing the foam carrier; then(c) curing the panel; then(d) after the panel is fully cured, removing the peel ply layer to expose the bonding surface and form a stubble of Z-pins protruding from the bonding surface;(e) providing a woven preform having a base and at least one leg that extends from the base, the preform being infused with uncured resin; then(f) placing the base of the preform against the bonding surface of the panel after the peel ply layer has been removed, the stubble extending into the base of the preform; then(g) curing the preform with the at least one leg in a desired orientation; andshearing ends of the Z-pins flush with an exterior surface of the peel ply layer before step (f). 16. A method of joining a woven preform to a panel, the method comprising:(a) placing at least one woven peel ply layer in contact with a bonding surface of a composite panel;(b) providing a plurality of Z-pins within a foam carrier and inserting Z-pins into the peel ply layer and the composite panel prior to curing the panel by placing the foam carrier on the peel ply layer and exerting a downward force on the foam carrier, then removing the foam carrier; then(c) curing the panel; then(d) after the panel is fully cured, removing the peel ply layer to expose the bonding surface and form a stubble of Z-pins protruding from the bonding surface;(e) providing a woven preform having a base and at least one leg that extends from the base, the preform being infused with uncured resin; then(f) placing the base of the preform against the bonding surface of the panel after the peel ply layer has been removed, the stubble extending into the base of the preform; then(g) curing the preform with the at least one leg in a desired orientation; and whereinstep (a) comprises placing at least two of the woven-fabric peel plies on the bonding surface of the panel with a non-porous film between them and removing both of the peel plie s and the non-porous film before step (f). 17. A method of joining a woven preform to a panel, the method comprising:(a) placing at least one woven peel ply layer in contact with a bonding surface of a composite panel:(b) providing a plurality of Z-pins within a foam carrier and inserting Z-pins into the peel ply layer and the composite panel prior to curing the panel by placing the foam carrier on the peel ply layer and exerting a downward force on the foam carrier, then removing the foam carrier; then(c) curing the panel; then(d) after the panel is fully cured, removing the peel ply layer to expose the bonding surface and form a stubble of Z-pins protruding from the bonding surface;(e) providing a woven preform having a base and at least one leg that extends from the base, the preform being infused with uncured resin; then(f) placing the base of the preform against the bonding surface of the panel after the peel ply layer has been removed, the stubble extending into the base of the preform; then(g) curing the preform with the at least one leg in a desired orientation; andin step (a) placing additional layers on the woven peel ply before inserting the Z-pins; andafter insertion of the Z-pins, removing at least one of the additional layers along with the foam carrier, and leveling the Z-pins to cause ends of the Z-pins to be flush with the remaining layers on the bonding surface of the panel. 18. The method according to claim 17, wherein the Z-pins are leveled by shearing the ends of the Z-pins after the panel is cured in step (c). 19. A method of making a composite structure, the method comprising:(a) locating at least two peel plies on the bonding surface of a component, with a first one of the peel plies being of a woven material and being in contact with the bonding surface; then(b) inserting pins trough the peel plies and into the component prior to curing of the component; then(c) curing the component;(d) providing a woven preform having a base and two legs extending from the base, the legs defining a slot; then(e) removing the peel plies to expose a stubble created by the pins and placing the base of tire preform against the bonding surface of the component, the pins extending into the base of the preform;(f) curing the preform to adhere the base of the preform to the component;wherein step (b) comprises placing a foam carrier containing the pins against the peel plies and exerting a downward force on the foam carrier, then removing the foam carrier before curing the component in step (c); and wherein the method further comprisesafter removal of the foam carrier and after curing the component in step (c), removing at least one of the peel plies and shearing protruding ends of the pins to be flush with an exterior surface of a remaining one of the peel plies.

이 특허에 인용된 특허 (12)

이 특허를 인용한 특허 피인용횟수: 10

IPC 상위 출원인

내보내기

상세정보
내보내기 구분	파일저장 인쇄 메일전송
구성항목	관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	> 총 건의 자료가 검색되었습니다. > 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) > 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. > 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) > 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오 > ~ > Text(ASCII format) Excel format

과학기술 지식인프라 ScienceON

ScienceON Chatbot

연합인증

특허 상세정보

Co-bonded joint with Z-pins

초록
▼

대표
청구항
▼

이 특허에 인용된 특허 (12)

이 특허를 인용한 특허 피인용횟수: 10

IPC 상위 출원인

과제정보

상세정보조회

원문조회

IPC 상세정보(version : 201201)

연구과제 성과물(0)

참여연구원의 다른 문헌(0)

처리중입니다.

잠시만 기다려주세요.

ScienceON Chatbot

연합인증

특허 상세정보

Co-bonded joint with Z-pins

초록 ▼

대표청구항 ▼

이 특허에 인용된 특허 (12)

이 특허를 인용한 특허 피인용횟수: 10

IPC 상위 출원인

과제정보

상세정보조회

원문조회

IPC 상세정보(version : 201201)

연구과제 성과물(0)

참여연구원의 다른 문헌(0)

처리중입니다.

잠시만 기다려주세요.

초록
▼

대표
청구항
▼