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A method for depositing a passivation layer on a substrate surface using one or more electroplating techniques is provided. Embodiments of the method include selectively depositing an initiation layer on a conductive material by exposing the substrate surface to a first electroless solution, deposit

A method for depositing a passivation layer on a substrate surface using one or more electroplating techniques is provided. Embodiments of the method include selectively depositing an initiation layer on a conductive material by exposing the substrate surface to a first electroless solution, depositing a passivating material on the initiation layer by exposing the initiation layer to a second electroless solution, and cleaning the substrate surface with an acidic solution. In another aspect, the method includes applying ultrasonic or megasonic energy to the substrate surface during the application of the acidic solution. In still another aspect, the method includes using the acidic solution to remove between about 100 Å and about 200 Å of the passivating material. In yet another aspect, the method includes cleaning the substrate surface with a first acidic solution prior to the deposition of the initiation layer.

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1. A method of processing a substrate, comprising:selectively depositing an initiation layer on a conductive material by exposing the substrate surface to a first electroless solution consisting essentially of one or more boron based reducing agents;depositing a passivating material on the initiatio

1. A method of processing a substrate, comprising:selectively depositing an initiation layer on a conductive material by exposing the substrate surface to a first electroless solution consisting essentially of one or more boron based reducing agents;depositing a passivating material on the initiation layer by exposing the initiation layer to a second electroless solution; andcleaning the substrate surface with an acidic solution. 2. The method of claim 1, wherein the acidic solution comprises a mixture selected from a group consisting of nitric acid and deionized water at a ratio of about 1:2 to about 3:1; nitric acid and hydrogen peroxide at a ratio of about 1:2 to about 3:1; sulfuric acid and hydrogen peroxide at a ratio of about 2:1 to about 4:1; and hydrochloric acid and hydrogen peroxide at a ratio of about 2:1 to about 4:1. 3. The method of claim 1, wherein the substrate surface is exposed to the acidic solution for about 300 seconds or less at a temperature between about 15° C. and about 35° C. 4. The method of claim 1, further comprising applying ultrasonic or megasonic energy to the substrate surface during the application of the acidic solution. 5. The method of claim 1, wherein cleaning the substrate surface with the acidic solution comprises removing at least a portion of the passivating material. 6. The method of claim 1, wherein the acidic solution removes between about 100 Å and about 200 Å of the passivating material. 7. The method of claim 1, wherein the first electroless solution further comprises at least one noble metal salt, such as palladium chloride, palladium sulfate, and palladium ammonium chloride, and at least one inorganic acid, such as hydrochloric acid and hydrofluoric acid. 8. The method of claim 1, wherein the one or more boron-based reducing agents is selected from the group consisting of sodium borohydride, dimethylamine borane, trimethylamine borane, and combinations thereof. 9. The method of claim 1, wherein the passivating material includes cobalt or cobalt alloys selected from the group consisting of cobalt-tungsten alloys, cobalt-phosphorus alloys, cobalt-tin alloys, cobalt-boron alloys, cobalt-tungsten-phosphorus alloys and cobalt-tungsten-boron alloys. 10. A method of processing a substrate, comprising:polishing a substrate surface to expose a conductive material disposed in a dielectric material;selectively depositing an initiation layer on the conductive material by exposing the substrate surface to a first electroless solution consisting essentially of one or more boron based reducing agents;depositing a passivating material on the initiation layer by exposing the initiation layer to a second electroless solution; andcleaning the substrate surface with an acidic solution. 11. The method of claim 10, wherein the acidic solution comprises a mixture selected from a group consisting of nitric acid and deionized water at a ratio of about 1:2 to about 3:1; nitric acid and hydrogen peroxide at a ratio of about 1:2 to about 3:1; sulfuric acid and hydrogen peroxide at a ratio of about 2:1 to about 4:1; and hydrochloric acid and hydrogen peroxide at a ratio of about 2:1 to about 4:1. 12. The method of claim 10, further comprising applying ultrasonic or megasonic energy to the substrate surface during the application of the acidic solution. 13. The method of claim 10, wherein the one or more boron-based reducing agents is selected from the group consisting of sodium borohydride, dimethylamine borane, trimethylamine borane, and combinations thereof. 14. The method of claim 10, wherein the conductive material comprises copper and the passivating material comprises cobalt or cobalt alloys selected from the group consisting of cobalt-tungsten alloys, cobalt-phosphorus alloys, cobalt-tin alloys, cobalt-boron alloys, cobalt-tungsten-phosphorus alloys and cobalt-tungsten-boron alloys. 15. A method of processing a substrate, comprising:selectively depositing an initiation layer on a conductive material by exposing the substrate surface to a first electroless solution consisting essentially of one or more boron based reducing agents:depositing a passivating material on the initiation layer by exposing the initiation layer to a second electroless solution: andcleaning the substrate surface with an acidic solution selected from the group consisting of nitric acid and deionized water at a ratio of about 1:2 to about 3:1; nitric acid and hydrogen peroxide at a ratio of about 1:2 to about 3:1; sulfuric acid and hydrogen peroxide at a ratio of about 2:1 to about 4:1; and hydrochloric acid and hydrogen peroxide at a ratio of about 2:1 to about 4:1. 16. The method of claim 15, wherein the conductive layer comprises copper. 17. The method of claim 15, further comprising applying ultrasonic or megasonic energy to the substrate surface during the application of the acidic solution. 18. The method of claim 15, wherein the one or more boron-based reducing agents is selected from the group consisting of sodium borohydride, dimethylamine borane, trimethylamine borane, and combinations thereof. 19. The method of claim 15, wherein the passivating material includes cobalt or cobalt alloys selected from the group consisting of cobalt-tungsten alloys, cobalt-phosphorus alloys, cobalt-tin alloys, cobalt-boron alloys, cobalt-tungsten-phosphorus alloys and cobalt-tungsten-boron alloys. 20. The method of claim 1, further comprising rinsing the substrate surface with a rinsing agent after deposition of the initiation layer and before deposition of the passivating material. 21. The method of claim 10, further comprising rinsing the substrate surface with a rinsing agent after deposition of the initiation layer and before deposition of the passivating material. 22. The method of claim 1, wherein the conductive layer comprises copper.