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[미국특허] Interconnection element with contact blade 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/16
출원번호 US-0174455 (2002-06-17)
발명자 / 주소
  • Eldridge, Benjamin N.
  • Grube, Gary W.
  • Khandros, Igor Y.
  • Madsen, Alec
  • Mathieu, Gaetan L.
출원인 / 주소
  • Formfactor, Inc.
대리인 / 주소
    Buraston N. Kenneth
인용정보 피인용 횟수 : 77  인용 특허 : 38

초록 ▼

An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such

대표청구항 ▼

1. An apparatus comprising:a substrate;an interconnect element disposed on said substrate;a tip structure disposed at an end of said interconnect element, said tip structure comprising a blade oriented such that a length of said blade is within approximately 745 degrees of an axis parallel to a wipi

이 특허에 인용된 특허 (38) 인용/피인용 타임라인 분석

  1. Driller Hubert (Schmitten DEX) Mang Paul (Schmitten DEX), Adapter arrangement for electrically connecting flat wire carriers.
    상세보기
  2. Roberts Joseph A. (Hudson NH), Circuit board with self-locking terminals.
    상세보기
  3. Pendse Rajendra D., Cost effective structure and method for interconnecting a flip chip with a substrate.
    상세보기
  4. Baumberger John G. (Johnson City NY) Kershaw James J. (Endwell NY) Petrozello James R. (Endicott NY), Dual element electrical contact and connector assembly utilizing same.
    상세보기
  5. Baumberger John G. (Johnson City NY) Donlan ; Jr. Fraser P. (Endicott NY) Petrozello James R. (Endicott NY), Electrical interconnector with helical contacting portion and assembly using same.
    상세보기
  6. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L., Fabricating interconnects and tips using sacrificial substrates.
    상세보기
  7. Khandros Igor Y. ; Mathieu Gaetan L., Flexible contact structure with an electrically conductive shell.
    상세보기
  8. Grabbe Dimitry G. (Middletown PA), High density electrical connector system.
    상세보기
  9. Babuka, Robert; Piechota, John L.; Poch, Leonard J., High density planar interconnected integrated circuit package.
    상세보기
  10. Ardezzone Frank J. (Santa Clara CA), High density probe-head with isolated and shielded transmission lines.
    상세보기
  11. Jones Mark R. ; Khoury Theodore A., High performance integrated circuit chip package.
    상세보기
  12. Kwon On-Kyong (Plano TX) Hashimoto Masashi (Garland TX) Malhi Satwinder (Garland TX), High performance test head and method of making.
    상세보기
  13. Ozawa Kazuhisa (Kawagoe JPX) Harada Hiroaki (Kawagoe JPX), IC socket and its contact pin.
    상세보기
  14. Beaman Brian S. (3 Stoutenburgh Dr. Hyde Park NY 12538), Integral elastomeric card edge connector.
    상세보기
  15. Smith Randall Kent, Low profile electrical distribution center and method of making a bus subassembly therefor.
    상세보기
  16. Littlebury Hugh W. (Chandler AZ) Simmons Marion I. (Tempe AZ), Low resistance probe for semiconductor.
    상세보기
  17. Leedy Glenn J. (1061 E. Mountain Dr. Santa Barbara CA 93108), Making and testing an integrated circuit using high density probe points.
    상세보기
  18. Kasukabe Susumu (Yokohama JPX) Takagi Ryuichi (Tokyo JPX), Manufacturing method of a probe head for semiconductor LSI inspection apparatus.
    상세보기
  19. Tonti William R. ; Williams Richard Q., Method and apparatus for interconnecting multiple circuit chips.
    상세보기
  20. Farnworth Warren ; Wood Alan, Method and apparatus for manufacturing known good semiconductor die.
    상세보기
  21. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y ; Mathieu Gaetan L., Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method.
    상세보기
  22. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of mounting resilient contact structures to semiconductor devices.
    상세보기
  23. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.
    상세보기
  24. Palagonia Anthony Michael ; Pikna Paul Joseph ; Maddix John Thomas, Micro probe assembly and method of fabrication.
    상세보기
  25. Rothenberger Richard E. (5 State Dr. Harrisburg PA 17112), Micro-power connector.
    상세보기
  26. Fjelstad Joseph (Sunnyvale CA) Smith John W. (Palo Alto CA) Distefano Thomas H. (Monte Sereno CA) Zaccardi James (Sunnyvale CA) Walton A. Christian (Belmont CA), Microelectronic contacts with asperities and methods of making same.
    상세보기
  27. Swapp Mavin (Mesa AZ), Micromachined semiconductor probe card.
    상세보기
  28. Jones Mark R. ; Khoury Theodore A., Packaging and interconnection of contact structure.
    상세보기
  29. Smith Donald Leonard ; Alimonda Andrew Sebastian, Photolithographically patterned spring contact.
    상세보기
  30. Nakano Shoukichi (Kawasaki JPX), Prober for semiconductor integrated circuit element wafer.
    상세보기
  31. Wark James M. ; Akram Salman, Projected contact structure for bumped semiconductor device and resulting articles and assemblies.
    상세보기
  32. Yanof Arnold W. (Tempe AZ) Dauksher William (Mesa AZ), Semiconductor structure and method of manufacture.
    상세보기
  33. Ruf Alexander (Mainz DEX) Abraham Michael (Mainz DEX) Lacher Manfred (Mainz DEX) Zetterer Thomas (Schwabenheim DEX) Dietrich Thomas R. (Frankfurt DEX), Sensor head for use in atomic force microscopy and method for its production.
    상세보기
  34. Briggs Merton Darrell ; Miller Alfred H., Socket including centrally distributed test tips for testing unpackaged singulated die.
    상세보기
  35. Ueno Toshiaki,JPX ; Saito Mitsuchika,JPX, Structure for providing an electrical connection between circuit members.
    상세보기
  36. Grabbe Dimitry G. (Middletown PA) Korsunsky Iosif (Harrisburg PA) Ringler Daniel R. (Elizabethville PA), Surface mount electrical connector.
    상세보기
  37. Grabbe Dimitry G. (Middletown PA) Korsunsky Iosif (Harrisburg PA), Tandem loop contact for an electrical connector.
    상세보기
  38. Arnaudov Konstantin (Wertheim-Bettingen DEX) Prokopp Manfred (Wertheim DEX), Testing device for testing electrical or electronic test specimens.
    상세보기

이 특허를 인용한 특허 (77) 인용/피인용 타임라인 분석

  1. Strid, Eric; Gleason, K. Reed, Active wafer probe.
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  2. Strid,Eric; Gleason,K. Reed, Active wafer probe.
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  3. Strid, Eric; Campbell, Richard, Calibration structures for differential signal probing.
    상세보기
  4. Lee,Oug Ki, Contact tip structure of a connecting element.
    상세보기
  5. Campbell, Richard; Strid, Eric W.; Andrews, Mike, Differential signal probe with integral balun.
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  6. Strid, Eric; Campbell, Richard, Differential signal probing system.
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  7. Campbell, Richard L.; Andrews, Michael, Differential waveguide probe.
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  8. Burcham, Terry; McCann, Peter; Jones, Rod, Double sided probing structures.
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  9. Burcham,Terry; McCann,Peter; Jones,Rod, Double sided probing structures.
    상세보기
  10. Beaman,Brian S.; Chiu,George Liang Tai; Fogel,Keith; Lauro,Paul A.; Morris,Daniel P.; Shih,Da Juan, Electrical connector design and contact geometry and method of use thereof and methods of fabrication thereof.
    상세보기
  11. Andrews, Peter; Hess, David; New, Robert, Interface for testing semiconductors.
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  12. Kister, January, Knee probe having reduced thickness section for control of scrub motion.
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  13. Kister, January, Layered probes with core.
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  14. Kister, January, Low profile probe having improved mechanical scrub and reduced contact inductance.
    상세보기
  15. Tervo,Paul A.; Cowan,Clarence E., Low-current pogo probe card.
    상세보기
  16. Tervo,Paul A.; Cowan,Clarence E., Low-current pogo probe card.
    상세보기
  17. Schwindt,Randy J., Low-current probe card.
    상세보기
  18. Gleason, K. Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
    상세보기
  19. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
    상세보기
  20. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing structure with laterally scrubbing contacts.
    상세보기
  21. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing system.
    상세보기
  22. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth; Lesher,Timothy; Koxxy,Martin, Membrane probing system.
    상세보기
  23. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth; Lesher,Timothy; Koxxy,Martin, Membrane probing system.
    상세보기
  24. Smith,Kenneth; Gleason,Reed, Membrane probing system.
    상세보기
  25. Smith,Kenneth; Gleason,Reed, Membrane probing system.
    상세보기
  26. Tervo,Paul A.; Smith,Kenneth R.; Cowan,Clarence E.; Dauphinais,Mike P.; Koxxy,Martin J., Membrane probing system.
    상세보기
  27. Tervo,Paul A.; Smith,Kenneth R.; Cowan,Clarence E.; Dauphinais,Mike P.; Koxxy,Martin J., Membrane probing system.
    상세보기
  28. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing system with local contact scrub.
    상세보기
  29. Gleason,K. Reed; Smith,Kenneth R.; Bayne,Mike, Membrane probing system with local contact scrub.
    상세보기
  30. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth, Method for constructing a membrane probe using a depression.
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  31. Hayden, Leonard; Martin, John; Andrews, Mike, Method of assembling a wafer probe.
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  32. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth, Method of constructing a membrane probe.
    상세보기
  33. Smith, Kenneth R., Method of replacing an existing contact of a wafer probing assembly.
    상세보기
  34. Kister, January, Multiple contact probes.
    상세보기
  35. Kister, January, Multiple contact probes.
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  36. Strid,Eric; Campbell,Richard, On-wafer test structures for differential signals.
    상세보기
  37. Tervo,Paul A.; Cowan,Clarence E., POGO probe card for low current measurements.
    상세보기
  38. Kister, January, Probe bonding method having improved control of bonding material.
    상세보기
  39. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
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  40. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
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  41. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
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  42. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
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  43. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
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  44. Campbell,Richard L.; Andrews,Michael; Bui,Lynh, Probe for high frequency signals.
    상세보기
  45. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Probe for testing a device under test.
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  46. Smith, Kenneth; Jolley, Michael; Van Syckel, Victoria, Probe head having a membrane suspended probe.
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  47. Smith,Kenneth; Jolley,Michael; Van Syckel,Victoria, Probe head having a membrane suspended probe.
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  48. Schwindt,Randy, Probe holder for testing of a test device.
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  49. Kister, January; Shtarker, Alex, Probe retention arrangement.
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  50. Kister, January; Shtarker, Alex, Probe retention arrangement.
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  51. Kister, January, Probe skates for electrical testing of convex pad topologies.
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  52. Kister, January, Probes with high current carrying capability and laser machining methods.
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  53. Kister, January, Probes with offset arm and suspension structure.
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  54. Smith, Kenneth R.; Hayward, Roger, Probing apparatus with impedance optimized interface.
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  55. Smith, Kenneth R., Replaceable coupon for a probing apparatus.
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  56. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Madsen, Alex; Mathieu, Gaetan L., Sharpened, oriented contact tip structures.
    상세보기
  57. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for high-frequency testing of a device under test.
    상세보기
  58. Gleason, K. Reed; Lesher, Tim; Strid, Eric W.; Andrews, Mike; Martin, John; Dunklee, John; Hayden, Leonard; Safwat, Amr M. E., Shielded probe for testing a device under test.
    상세보기
  59. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
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  60. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
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  61. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
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  62. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
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  63. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for testing a device under test.
    상세보기
  64. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for testing a device under test.
    상세보기
  65. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe with low contact resistance for testing a device under test.
    상세보기
  66. Kister, January, Space transformers employing wire bonds for interconnections with fine pitch contacts.
    상세보기
  67. Andrews, Peter; Hess, David, System for testing semiconductors.
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  68. Campbell, Richard, Test structure and probe for differential signals.
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  69. Campbell,Richard, Test structure and probe for differential signals.
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  70. Kister, January, Vertical guided layered probe.
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  71. Kister, January, Vertical probe array arranged to provide space transformation.
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  72. Kister, January, Vertical probe array arranged to provide space transformation.
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  73. Hayden, Leonard; Martin, John; Andrews, Mike, Wafer probe.
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  74. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
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  75. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
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  76. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
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  77. Campbell, Richard, Wideband active-passive differential signal probe.
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