초록 ▼

An improved spatial light modulator package comprising a spatial light modulator 1006 attached to a central region of a substrate 1004 , a sealing ring 1002 on said substrate 1004 around the central region thereof, a window frame 402 attached to the sealing ring 1002 , and a window 404 glued to the

An improved spatial light modulator package comprising a spatial light modulator 1006 attached to a central region of a substrate 1004 , a sealing ring 1002 on said substrate 1004 around the central region thereof, a window frame 402 attached to the sealing ring 1002 , and a window 404 glued to the window frame 402 . Gluing the window 404 to the window frame 402 avoids distortion of the glass that occurs when the window is heat bonded to the window frame, and avoids having to grind and polish the glass window after it is bonded to the window frame.

대표청구항 ▼

1. A method of packaging a device, said method comprising the steps of:providing a ceramic package substrate, said ceramic package substrate defining a central region;attaching a metal sealing ring to said ceramic package substrate;bonding said device to said central region of said ceramic package s

1. A method of packaging a device, said method comprising the steps of:providing a ceramic package substrate, said ceramic package substrate defining a central region;attaching a metal sealing ring to said ceramic package substrate;bonding said device to said central region of said ceramic package substrate;providing a metal window frame having a first face and an opposing second face;gluing a window to a central portion of said first face of said window frame, leaving a perimeter portion of said first face extending beyond said window; andwelding said perimeter portion of said second face of said window frame to said sealing ring. 2. The method of claim 1, further comprising the step of electrically connecting said device to interconnections in said ceramic substrate. 3. The method of claim 1, further comprising the step of applying an anti-reflective coating to said window. 4. The method of claim 1, said gluing step comprising the step of epoxying said window to said window frame. 5. The method of claim 1, further comprising the step of depositing an aperture on said window. 6. The method of claim 5, wherein said step of depositing an aperture on said window comprises the steps of:depositing a metal layer on said window; andpatterning said metal layer to form said aperture. 7. The method of claim 6, wherein said step of depositing a metal layer comprises the step of depositing a metal selected from the group consisting of aluminum, chrome, and silver. 8. The method of claim 5, wherein said step of depositing an aperture on said window comprises the steps of:depositing an oxide layer on said window;depositing a metal layer on said oxide layer; andpatterning said metal layer to form said aperture. 9. The method of claim 8, wherein said step of depositing a metal layer comprises the step of depositing a metal selected from the group consisting of aluminum, chrome, and silver. 10. A micromechanical package lid comprising:a flat metal window frame having opposing first and second faces; anda glass window glued to a central region of said first face of said metal window frame leaving a perimeter of said metal window frame extending beyond said glass window, said second face of said perimeter suitable for attaching said micromechanical package lid to a micromechanical package. 11. The micromechanical package lid of claim 10, further comprising at least one anti-reflective coating on said glass window. 12. The micromechanical package lid of claim 10, further comprising a metal aperture deposited on said glass window. 13. The micromechanical package lid of claim 12, said metal aperture comprised of a metal selected from the group consisting of aluminum, chrome, and silver. 14. The micromechanical package lid of claim 12, said metal aperture comprised of a metal layer deposited on an oxide layer on said glass window. 15. A device package comprising:a substrate having a central region;a sealing ring on said substrate around said central region;a device attached to said central region of said substrate;a window frame having a first face attached to said sealing ring by a perimeter portion of said window frame extending beyond a central region and a second face opposing said first face; anda window glued to said central portion of said second face of said window frame, said substrate, said sealing ring, said window frame, and said window forming a chamber enclosing said device. 16. The device package of claim 15, further comprising a getter inside said chamber. 17. The device package of claim 15, wherein said device is electrically connected to contacts on the surface of said substrate outside said chamber via interconnections within said substrate. 18. A projection display system comprising:a light source for projecting a beam of light along a light path;a spatial light modulator device in said light path, said spatial light modulator device comprised of a micromechanical spatial light modulator packaged within a chamber created by a c eramic substrate, a scaling ring attached to said ceramic substrate, a window frame having a first face welded to said sealing ring, and a glass window glued to a central portion of a second face of said window frame opposing said first face, leaving a perimeter portion of said window frame extending beyond said glass window to allow said window frame to be welded to said sealing ring, said spatial light modulator for selectively reflecting portions of said beam of light along a projection light path;projection optics along said projection light path for focusing said selectively reflected portions of said beam of light onto an image plane.