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A butt joined electronic assembly has first and second coplanar transmission structures that are independently aligned in a proximate abutting relationship. The coplanar transmission structures are formed on at least a first standoff dielectric substrate and on first and second electrical elements.

A butt joined electronic assembly has first and second coplanar transmission structures that are independently aligned in a proximate abutting relationship. The coplanar transmission structures are formed on at least a first standoff dielectric substrate and on first and second electrical elements. The standoff dielectric substrate is positioned in an abutting relationship with one of the electrical elements. The standoff dielectric substrate and the first and second electrical elements are secured on respective independently positioned and mechanically joined first and second open end face carriers. The first and second coplanar transmission structures are electrically coupled together via substantially flat electrical conductors.

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1. A butt joined opto-electronic assembly for millimeter wavelength frequencies comprising:a first carrier having an open end face and an opto-electrical element positioned on the carrier with the opto-electrical element having an end face and at least a first horizontal surface with an opto-electri

1. A butt joined opto-electronic assembly for millimeter wavelength frequencies comprising:a first carrier having an open end face and an opto-electrical element positioned on the carrier with the opto-electrical element having an end face and at least a first horizontal surface with an opto-electrical device formed on the horizontal surface and coupled to receive an optical signal from an optical waveguide secured to the carrier;a second carrier having an open end face and an electrical element positioned on the carrier with the electrical element having an end face and at least a first horizontal surface with an electrical device formed on the horizontal surface;first and second coplanar transmission structures with one of the coplanar transmission structures formed on at least one horizontal surface of the opto-electrical element and the other coplanar transmission structure formed on at least one horizontal surface of the electrical element with each of the first and second coplanar transmission structures being electrically coupled to one of the respective opto-electrical and electrical devices;at least a first standoff dielectric substrate having opposing vertical end walls and at least one horizontal surface with a coplanar transmission structure formed on at least horizontal surface and extending to the vertical end walls with one of the vertical end walls of the standoff dielectric substrate abutting the end face of one of the opto-electrical and electrical elements, the coplanar transmission structure of the abutting opto-electrical and electrical element and the coplanar transmission structure on the standoff dielectric substrate being coplanar and electrically coupled via substantially flat electrical conductors with the coplanar transmission structure of the standoff dielectric substrate and the coplanar transmission structure of the other element of the opto-electrical and electrical elements being independently aligned in three mutually perpendicular planes and in a proximate abutting relationship;the first and second carriers being independently positioned in a proximate abutting relationship at the open end faces and mechanically joined together as a single assembly by a securing member with the first and second carriers being linearly and rotationally positionable in three mutually perpendicular planes relative to each other to align the coplanar transmission structures of the standoff dielectric substrate and the other element of the opto-electrical and electrical elements; andsubstantially flat electrical conductors electrically coupling the coplanar transmission structures of the standoff dielectric substrate and the other element of the opto-electrical and electrical elements together. 2. The butt joined opto-electronic assembly as recited in claim 1 wherein coplanar transmission structures of the standoff dielectric substrate and the other element of the opto-electrical and electrical elements have sub-millimeter lateral separation. 3. The butt joined opto-electronic assembly as recited in claim 1 further comprising at least a first mounting dielectric substrate having an end face, with the first mounting dielectric substrate mounted on at least one of the open end face carriers and having one of the standoff dielectric substrate and abutting one of the opto-electrical and electrical elements and the other of the opto-electrical and electrical elements positioned thereon. 4. The butt joined opto-electronic assembly as recited in claim 3 further comprising at least a second mounting dielectric substrate having an end face, with the second mounting dielectric substrate mounted on the other open end face carrier having the other one of the standoff dielectric substrate and abutting one of the opto-electrical and electrical elements and the other of the opto-electrical and electrical elements positioned thereon. 5. The butt joined opto-electronic assembly as recited in claim 1 wherein the first and second c arriers further comprise first and second housings with each housing having sidewalls and end walls and a cavity formed in the housing bounded on three sides by the sidewalls and one of the end walls with the cavity intersecting the other end wall defining an open end face on the housing with the standoff dielectric substrate abutting one of the opto-electrical and electrical elements positioned in the cavity of one of the first and second housings and the other element of the opto-electrical and electrical elements positioned in the cavity of the other of the first and second housings. 6. The butt joined opto-electronic assembly as recited in claim 1 wherein the securing member comprises first and second removable attachment members with the first removable attachment member secured to one of the side surfaces of the first and second carriers adjacent to their open end faces and the second removable attachment member secured to the other side surfaces of the first and second carriers adjacent to their open end faces with each removable attachment member having first and second links secured to the respective side surfaces of the first and second carriers with each link having a base and at least a first extension member, two of the extension members projecting past one of the open end faces to overlap the other two extension members, the overlapping extension members being secured together to join the carriers together as a single assembly. 7. A butt joined opto-electronic module for millimeter wavelength frequencies comprising:a first housing having sidewalls and end walls and a cavity formed in the housing bounded on three sides by the sidewalls and one of the end walls with the cavity intersecting the other end wall defining an open end face on the housing with an opto-electrical element positioned in the cavity of the housing having an end face and at least one horizontal surface with an opto-electrical device formed on of the horizontal surface and coupled to receive an optical signal from an optical waveguide secured to the first housing;a second housing having sidewalls and end walls and a cavity formed in the housing bounded on three sides by the sidewalls and one of the end walls with the cavity intersecting the other end wall defining an open end face on the housing with an electrical element positioned in the cavity of the housing having an open end face and at least one horizontal surface with an electrical device formed on of the horizontal surface;first and second coplanar transmission structures with one of the coplanar transmission structures formed on at least one horizontal surface of the opto-electrical element and the other coplanar transmission structure formed on at least one horizontal surface of the electrical element with each of the first and second coplanar transmission structures being electrically coupled to one of the respective opto-electrical and electrical elements;at least a first standoff dielectric substrate having opposing vertical end walls and at least one horizontal surface with a coplanar transmission structure formed on at least horizontal surface and extending to the vertical end walls with one of the vertical end walls of the standoff dielectric substrate abutting the end face of one of the opto-electrical and electrical elements, the coplanar transmission structure of the abutting opto-electrical and electrical element and the coplanar transmission structure on the standoff dielectric substrate being coplanar and electrically coupled via substantially flat electrical conductors with the coplanar transmission structure of the standoff dielectric substrate and the coplanar transmission structure of the other element of the opto-electrical and electrical elements independently aligned in a proximate abutting relationship;the first and second housings being independently positioned in a proximate abutting relationship at the open end faces and mechanically joined together as a single m odule by a securing member with the first and second housings being linearly and rotationally positionable in three mutually perpendicular planes relative to each other to align the coplanar transmission structures of the standoff dielectric substrate and the other element of the opto-electrical and electrical elements; andsubstantially flat electrical conductors electrically coupling the coplanar transmission structures of the standoff dielectric substrate and the other element of the opto-electrical and electrical elements together. 8. The butt joined opto-electronic module as recited in claim 7 wherein the securing member comprises first and second removable attachment members with the first removable attachment member secured to the one of the sidewalls of the first and second housings adjacent to their open end faces and the second removable attachment member secured to the other sidewalls of the first and second housings adjacent to their open end face with each removable attachment member having first and second links secured to the respective sidewalls of the first and second housings with each link having a base and at least a first extension member, two of the extension members projecting past the open end faces to overlap the other two extension members, the overlapping extension members being secured together to join the housings together as a single module. 9. A butt joined opto-electronic module for millimeter wavelength frequencies comprising:a first housing having sidewalls and end walls and a cavity formed in the housing bounded on three sides by the sidewalls and one of the end walls with the cavity intersecting the other end wall defining an open end face on the housing with an opto-electrical element positioned in the cavity of the housing having an end face and at least one horizontal surface with an opto-electrical device formed on of the horizontal surface and coupled to receive an optical signal from an optical waveguide secured to the first housing;a second housing having sidewalls and end walls and a cavity formed in the housing bounded on three sides by the sidewalls and one of the end walls with the cavity intersecting the other end wall defining an open end face on the housing with an electrical element positioned in the cavity of the housing having an open end face and at least one horizontal surface with an electrical device formed on of the horizontal surface;first and second coplanar transmission structures with one of the coplanar transmission structures formed on at least one horizontal surface of the opto-electrical element and the other coplanar transmission structure formed on at least one horizontal surface of the electrical element with each of the first and second coplanar transmission structures being electrically coupled to one of the respective opto-electrical and electrical elements;at least a first standoff dielectric substrate having opposing vertical end walls and at least one horizontal surface with a coplanar transmission formed on at least one horizontal surface and extending to the vertical end walls with one of the vertical end walls of the standoff dielectric substrate abutting the end face of one of the opto-electrical and electrical elements, the coplanar transmission structure of the abutting opto-electrical and electrical element and the coplanar transmission structure on the standoff dielectric substrate being coplanar and electrically coupled via substantially flat electrical conductors with the coplanar transmission structure of the standoff dielectric substrate and the coplanar transmission structure of the other element of the opto-electrical and electrical elements independently aligned in a proximate abutting relationship;first and second removable attachment members with the first removable attachment member secured to the one of the sidewalls of the first and second housings adjacent to their open end faces and the second removable attachment member secured to the other sidewalls of the first and second housings adjacent to their open end faces with each removable attachment member having first and second links secured to the respective sidewalls of the first and second housings with each link having a base and at least a first extension member, two of the extension members projecting past the open end faces to overlap the other two extension members, the overlapping extension members being secured together to join the housings together as a single module;the first and second housings being independently positioned in a proximate abutting relationship at the open end faces and mechanically joined together as a single module by the first and second removable attachment members with the first and second housings being linearly and rotationally positionable in three mutually perpendicular planes relative to each other to align the coplanar transmission structures of the standoff dielectric substrate and the other element of the opto-electrical and electrical elements; andsubstantially flat electrical conductors electrically coupling the coplanar transmission structures of the standoff dielectric substrate and the other element of the opto-electrical and electrical elements together. 10. The butt joined opto-electronic module as recited in claim 7 or 9 wherein coplanar transmission structures of the standoff dielectric substrate and the other element of the opto-electrical and electrical elements have sub-millimeter lateral separation. 11. The butt joined opto-electronic module as recited in claim 7 or 9 further comprising at least a first mounting dielectric substrate having an end face, with the first mounting dielectric substrate mounted on at least one of the first and second housings having one of the standoff dielectric substrate and abutting one of the opto-electrical and electrical elements and the other of the opto-electrical and electrical elements positioned thereon. 12. The butt joined opto-electronic module as recited in claim 11 further comprising at least a second mounting dielectric substrate having an end face, the second mounting dielectric substrate mounted on the other of the first and second housings having the other one of the standoff dielectric substrate and abutting one of the opto-electrical and electrical elements and the other of the opto-electrical and electrical elements positioned thereon. 13. The butt joined opto-electronic module as recited in claim 7 or 9 wherein each of the first and second housings further comprise a removable top cover mounted on the end wall and the sidewalls bounding the cavity. 14. The butt joined opto-electronic module as recited in claim 7 or 9 further comprising a removable top cover mounted on the end walls and the sidewalls bounding the cavities of the first and second housings. 15. The butt joined opto-electronic assembly/module as recited in claim 1 or 7 or 9 wherein the opto-electrical element comprises an optical-to-electrical converter. 16. The butt joined opto-electronic assembly/module as recited in claim 15 wherein the optical-to-electrical converter comprises a photodiode. 17. The butt joined opto-electronic assembly/module as recited in claim 1 or 7 or 9 wherein the opto-electrical element comprises a semiconductor laser. 18. The butt joined opto-electronic assembly/module as recited in claim 1 or 7 or 9 wherein the opto-electrical element comprises an optical modulator. 19. The butt joined opto-electronic assembly/module as recited in claim 1 or 7 or 9 wherein the electrical element comprises at least a first sampling diode. 20. The butt joined opto-electronic assembly/module as recited in claim 1 or 7 or 9 wherein the electrical element comprises a laser driver. 21. The butt joined opto-electronic assembly/module as recited in claim 6 or 8 or 9 herein solder is applied to the overlapping extension members. 22. The butt joined opto-electronic assembly/module as recited in claim 6 or 8 or 9 wherein an adhesiv e is applied to the overlapping extension members. 23. The butt joined opto-electronic assembly/module as recited in claim 22 wherein the adhesive is an epoxy. 24. The butt joined opto-electronic assembly/module as recited in claim 23 wherein the epoxy is an ultraviolet cured epoxy. 25. The butt joined opto-electronic assembly/module as recited in claim 6 or 8 or 9 wherein strong adhesion low melting temperature metal is applied to the overlapping extension members. 26. The buff joined opto-electronic assembly/module as recited in claim 1 or 7 or 9 wherein the substantially flat electrical conductors are wedge bonded electrical conductors. 27. The butt joined opto-electronic assembly/module as recited in claim 1 or 7 or 9 wherein first and second coplanar transmission structures and the standoff dielectric coplanar transmission structure are impedance and dimensionally matched. 28. The butt joined opto-electronic assembly/module as recited in claim 1 or 7 or 9 wherein first and second coplanar transmission structures are dimensionally mismatched and the coplanar transmission structure of the standoff dielectric substrate is an impedance maintaining dimensional transition coplanar waveguide structure.