초록 ▼

A substrate 9 is carried by a carry system in sequence, via a direction-altering chamber 8 to which a plurality of vacuum chambers comprising processing chambers 21 to 24 are hermetically-connected in the perimeter, to the plurality of processing chambers 21 to 24 . The carry system carries the subs

A substrate 9 is carried by a carry system in sequence, via a direction-altering chamber 8 to which a plurality of vacuum chambers comprising processing chambers 21 to 24 are hermetically-connected in the perimeter, to the plurality of processing chambers 21 to 24 . The carry system carries the substrate 9 horizontally by moving, using a horizontal moving mechanism, a substrate holder 92 which holds two substrate 9 upright in such a way that the plate surface thereof forms a holding angle to the horizontal of between 45° or more and 90° or less. The direction-altering chamber 8 includes a direction altering mechanism 80 that alters the direction of movement by the horizontal movement mechanism. The direction altering mechanism 80 alters the direction of movement by rotating the substrate holder 92 and the horizontal movement mechanism about the vertical rotating axis coincident with the center axis of the direction-altering chamber 8.

대표청구항 ▼

1. A substrate processing device, comprising:a plurality of vacuum process chambers, each of which administers a prescribed process to a substrate therein;a through-chamber which constitutes a vacuum chamber, the plurality of vacuum process chambers are hermetically-connected to a perimeter of the t

1. A substrate processing device, comprising:a plurality of vacuum process chambers, each of which administers a prescribed process to a substrate therein;a through-chamber which constitutes a vacuum chamber, the plurality of vacuum process chambers are hermetically-connected to a perimeter of the through-chamber;a carry system which carries a substrate in sequence, via the through-chamber, to the plurality of vacuum process chambers, the carry system comprises a substrate holder which holds the substrate upright in such a way that a plate surface thereof forms an angle to the horizontal of between 45° and 90°;a horizontal movement mechanism which moves the substrate holder via the through-chamber to the plurality of vacuum process chambers; andan alignment chamber hermetically connected to the through-chamber;wherein when the substrate holder is in the alignment chamber, the horizontal movement mechanism is able to move the substrate holder such that a substrate being held in the substrate holder is able to move sideways with respect to a longitudinal direction of the plate surface thereof, as well as in the longitudinal direction thereof so as to align the carry system with the through-chamber; andwherein the alignment chamber is arranged between the through-chamber and one or more load-lock chambers. 2. The substrate processing device described in claim 1, wherein the through-chamber constitutes a direction-altering chamber comprising a direction-altering mechanism which alters the direction of movement of the substrate holder using the horizontal movement mechanism, wherein the direction-altering mechanism alters the direction of movement by rotating the substrate holder and the horizontal movement mechanism about a vertical rotating axis. 3. The substrate processing device described in claim 2, wherein the direction-altering mechanism rotates the substrate holder and the horizontal movement mechanism about a rotating axis coincident with a center axis of the direction-altering chamber. 4. The substrate processing device described in claim 1, wherein the substrate holder holds two substrates simultaneously. 5. The substrate processing device described in claim 4, wherein the substrate holder holds the substrates upright in such a way that the plate surface thereof forms an angle to the horizontal of between 60° and 90°. 6. A substrate processing device, comprising:a plurality of through-chambers, each of which includes a hermetically-connected vacuum chamber;a plurality of processing chambers that are hermetically-connected to the plurality of through-chambers;a carry system that carries a substrate in sequence to the processing chambers, the carry system comprises a substrate holder which holds the substrate upright in such a way that a plate surface thereof forms an angle to the horizontal of between 45° and 90°;a horizontal movement mechanism which moves the substrate holder to each of the processing chambers via at least a plurality of the through-chambers; andan alignment chamber hermetically connected to one of the through chambers;wherein when the substrate holder is in the alignment chamber, the horizontal movement mechanism is able to move the substrate holder such that a substrate being held in the substrate holder is able to move sideways with respect to a longitudinal direction of the plate surface thereof, as well as in the longitudinal direction thereof so as to align the carry system with the one through-chamber; andwherein the alignment chamber is arranged between the through-chamber and one or more load-lock chambers. 7. The substrate processing device described in claim 6, wherein the through-chambers each constitutes a direction-altering chamber comprising a direction-altering mechanism which alters the direction of movement of the substrate holder using the horizontal movement mechanism, wherein the direction-altering mechanism alters the direction of movement by rotating the substrate holder and the horizontal movement mechanism about a vertical rotating axis. 8. The substrate processing device described in claim 7, wherein the direction-altering mechanism rotates the substrate holder and the horizontal movement mechanism about a rotating axis coincident with a center axis of the direction-altering chamber. 9. The substrate processing device described in claim 6, wherein the substrate holder holds two substrates simultaneously. 10. The substrate processing device described in claim 9, wherein the substrate holder holds the substrates upright in such a way that the plate surface thereof forms an angle to the horizontal of between 60° and 90°. 11. A through-chamber having a perimeter to which a plurality of vacuum processing chambers are hermetically-connected, the through chamber comprising:a vacuum chamber;a horizontal movement mechanism including a substrate holder for holding a substrate, the horizontal movement mechanism horizontally moves the substrate holder through the vacuum chamber, and the substrate holder holds the abovementioned substrate upright in such a way that the plate surface thereof forms a holding angle to the horizontal of between 45° and 90°,a direction-altering mechanism which alters the direction of movement of the substrate holder by rotating the substrate holder and horizontal movement mechanism about a vertical rotating axis; andan alignment chamber hermetically connected to the through chamber;wherein when the substrate holder is in the alignment chamber, the horizontal movement mechanism is able to move the substrate holder such that a substrate being held in the substrate holder is able to move sideways with respect to a longitudinal direction of the plate surface thereof, as well as in the longitudinal direction thereof so as to align the carry system with the through-chamber;and wherein the alignment chamber is arranged between the through-chamber and one more load-lock chambers. 12. The through-chamber as described in claim 11, wherein the direction-altering mechanism rotates the substrate holder and the horizontal movement mechanism about a rotating axis coincident with-a center axis of the through-chamber. 13. The substrate processing device described in claim 1, further comprising a heater in the alignment chamber. 14. The substrate processing device described in claim 6, further comprising a heater in the alignment chamber. 15. The substrate processing device described in claim 11, further comprising a heater in the alignment chamber.