초록 ▼

A method of treating an electrically non-conductive tunnel barrier layer through an overlayer of a tunnel junction device with ultra-violet light is disclosed. The method includes irradiating a tunnel barrier layer with ultra-violet light through at least one overlayer that covers the tunnel barrier

A method of treating an electrically non-conductive tunnel barrier layer through an overlayer of a tunnel junction device with ultra-violet light is disclosed. The method includes irradiating a tunnel barrier layer with ultra-violet light through at least one overlayer that covers the tunnel barrier layer to activate oxygen or nitrogen atoms disposed in the barrier layer so that those atoms will react with a target material of the tunnel barrier layer to form a uniformly oxidized or nitridized tunnel barrier layer having minimal or no defects therein and/or a desired breakdown voltage. The ultra violet light can irradiate the tunnel barrier layer during or after the formation of the overlayer. Heat can be applied before, during, or after the irradiation step to increase the activation rate and to further reduce defects. The method is applicable to any tunnel junction device including a magnetic field sensitive memory device such as a MRAM.

대표청구항 ▼

1. A method of treating a tunnel barrier layer of a tunnel junction device, comprising:forming an overlayer of a predetermined thickness on a previously formed tunnel barrier layer;irradiating the tunnel barrier layer through the overlayer with ultra-violet light, the ultra-violet light penetrates t

1. A method of treating a tunnel barrier layer of a tunnel junction device, comprising:forming an overlayer of a predetermined thickness on a previously formed tunnel barrier layer;irradiating the tunnel barrier layer through the overlayer with ultra-violet light, the ultra-violet light penetrates the predetermined thickness of the overlayer and is incident on a reactant disposed in the tunnel barrier layer, andthe ultra-violet light is operative to activate the reactant so that the reactant reacts with a material of the tunnel barrier layer and transforms the material into an electrically non-conductive material; andheating the tunnel barrier layer using a separate heat source, the heating occurring during the irradiating and the heating is operative to increase an activation rate of the reactant with the material of the tunnel barrier layer. 2. The method as set forth in claim 1 and further comprising:continuing the irradiating with the ultra-violet light for a predetermined time until a desired property of the tunnel barrier layer is obtained. 3. The method as set forth in claim 2, wherein the desired property of the tunnel barrier layer is a property selected from the group consisting of a predetermined defect density in the tunnel barrier layer, a predetermined breakdown voltage of the tunnel barrier layer, a change in a crystal structure of the tunnel barrier layer, and a change in a texture of a grain orientation of tunnel barrier layer. 4. The method as set forth in claim 1, wherein the reactant is a material selected from the group consisting of oxygen, ozone, and nitrogen. 5. The method as set forth in claim 1, wherein the material for the tunnel barrier layer comprises a material selected from the group consisting of aluminum, magnesium, boron, and tantalum. 6. The method as set forth in claim 1, wherein the irradiating occurs at a time selected from the group consisting of during the forming of the overlayer and after the forming of the overlayer. 7. The method as set forth in claim 1, wherein the ultra-violet light has a wavelength from about 200 nm to about 400 nm. 8. The method as set forth in claim 1, wherein the heating with the separate heat source occurs during the forming of the overlayer. 9. The method as set forth in claim 1 and further comprising:heating the tunnel barrier layer with a separate heat source after the irradiating to increase an activation rate of the reactant with the material of the tunnel barrier layer. 10. The method as set forth in claim 1 and further comprising:heating the tunnel barrier layer with a separate heat source before the forming of the overlayer to increase an activation rate of the reactant with the material of the tunnel barrier layer. 11. The method as set forth in claim 10 and further comprising:reapplying the heating at a time selected from the group consisting of during the forming of the overlayer and after the forming of the overlayer.