[특허]Prefabricated semiconductor chip carrier

Prefabricated semiconductor chip carrier 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-001/16
출원번호	US-0964542 (2001-09-28)
발명자 / 주소	Crane, Jr., Stanford W. Portuondo, Maria M.
출원인 / 주소	Silicon Bandwidth Inc.
대리인 / 주소	Morgan, Lewis & Bockius LLP
인용정보	피인용 횟수 : 0 인용 특허 : 57

초록 ▼

A semiconductor die carrier includes a plurality of electrically insulative side walls; a plurality of electrically conductive leads extending from at least one of the side walls, each of the leads being individually manufactured without use of a lead frame; a semiconductor die positioned such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and structure for providing electrical connection between the semiconductor die and corresponding ones of the electrically conductive leads. A method of manufacturing a semiconductor die carrier includes the steps of individually manufacturing a plurality of electrically conductive leads without use of a lead frame; extending a plurality of the electrically conductive leads from at least one of a plurality of electrically insulative side walls; positioning a semiconductor die such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and electrically connecting the semiconductor die to corresponding ones of the electrically conductive leads.

대표청구항 ▼

1. A semiconductor die carrier comprising:a housing for holding at least one semiconductor die and including:an end surface having a perimeter;a peripheral side wall connected to the end surface, extending about the perimeter of the end surface and including an outer peripheral surface and an inner peripheral surface; andan inner wall within the perimeter of the end surface and including an outer surface spaced from and opposing the inner peripheral surface of the peripheral side wall, and an inner surface facing the center of the housing; anda plurality of conductive leads inserted through the peripheral side wall and the inner wall. 2. The semiconductor die carrier according to claim 1, further comprising a cavity extending between the inner peripheral surface of the peripheral side wall and the outer surface of the inner wall. 3. The semiconductor die carrier according to claim 2, further comprising a filler in the cavity to seal an interior of said housing. 4. The semiconductor die carrier according to claim 3, further comprising a semiconductor die received on the end surface; andthe inner wall encircles the semiconductor die. 5. The semiconductor die carrier according to claim 1, wherein the leads are arranged in multiple spaced apart rows. 6. The semiconductor die carrier according to claim 1, wherein the plurality of leads each comprise a substantially L-shape. 7. The semiconductor die carrier according to claim 1, wherein the peripheral side wall comprises a first material and the end surface comprises a second material different from the first material. 8. A semiconductor die carrier comprising:a housing for holding at least one semiconductor die and including:an end surface having a perimeter;a peripheral side wall connected to the end surface, extending about the perimeter of the end surface and including an outer peripheral surface and an inner peripheral surface; andan inner wall within the perimeter of the end surface and including an outer surface spaced from and opposing the inner peripheral surface of the peripheral side wall, and an inner surface facing the center of the housing;a plurality of conductive leads inserted through the peripheral side wall and the inner wall;a cavity extending between the inner peripheral surface of the peripheral side wall and the outer surface of the inner wall; anda filler in the cavity to seal an interior of said housing, wherein the filler comprises an adhesive. 9. A semiconductor die carrier comprising:a housing for holding at least one semiconductor die and including:an end surface having perimeter;a peripheral side wall connected to the end surface, extending about the perimeter of the end surface and including an outer peripheral surface and an inner peripheral surface;an inner wall within the perimeter of the end surface and including an outer surface spaced from and opposing the inner peripheral surface of the peripheral side wall, and an inner surface facing the center of the housing; anda plurality of spaced-apart ledges extending from the inner surface of the inner wall;a plurality of conductive leads inserted through the peripheral side wall and the inner wall;a cavity extending between the inner peripheral surface of the peripheral side wall and the outer surface of the inner wall;a filler in the cavity to seal an interior of said housing; anda semiconductor die received on the end surface and encircled by the inner wall.

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Nelson Gregory H. (Gilbert AZ) Lebow Sanford (Westlake CA) Nogavich Eugene (Gilbert AZ), Interconnect device and method of manufacture thereof.
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Shaffer Howard R. (Millersburg PA), Limited insertion force contact terminals and connectors.
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Gregoire George D. (9927 Aviary Dr. San Diego CA 92131), Method and apparatus for making printed circuit boards.
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Koepke Richard A. (New Bedford MA) Koepke George O. (Rochester NY), Method for fabricating a fold-up frame.
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Gregoire George D. (9927 Aviary Dr. San Diego CA 92131), Method for making printed circuit boards.
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Crane ; Jr. Stanford W. (Boca Raton FL) Portuondo Maria M. (Delray Beach FL), Method of manufacturing a semiconductor chip carrier affording a high-density external interface.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Prefabricated semiconductor chip carrier 원문보기

초록 ▼

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Prefabricated semiconductor chip carrier 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

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이 특허에 인용된 특허 (57)

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