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Heated filling device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-037/00
  • B23K-031/02
  • B67D-005/00
출원번호 US-0026135 (2001-12-20)
발명자 / 주소
  • Pedigo, Jesse
  • Meyer, Timothy
출원인 / 주소
  • TTM Advanced Circuits, Inc.
대리인 / 주소
    Greenberg Traurig, LLP
인용정보 피인용 횟수 : 0  인용 특허 : 66

초록 ▼

A filling system includes a pressurized source of fill material and a pressure fill head wherein the fill head also includes a beating element positioned so as to transfer heat to fill material passing through the fill head. A method of filling holes using a fill material passing through a pressure

대표청구항 ▼

1. A heated filling system with reduced heat loss comprising:a pressurized source of fill material; and,a pressure fill head wherein the fill head also comprises heating element, adapted to transfer heat from a heated fluid flowing through the heating element to the fill material in the flow pathway

이 특허에 인용된 특허 (66)

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