[특허]Tooling fixture for packaged optical micro-mechanical devices

[미국특허] Tooling fixture for packaged optical micro-mechanical devices 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G02B-006/00
출원번호	US-0912147 (2001-07-24)
발명자 / 주소	Carpenter, Barry S.
출원인 / 주소	3M Innovative Properties Co.
인용정보	피인용 횟수 : 1 인용 특허 : 38

초록 ▼

A tooling system for handling optical micro-mechanical devices. A tooling fixture is attached to the MEMS die, preferably before the optical micro-mechanical devices are released. The tooling fixture does not interfere with removal of the sacrificial material, facilitates handling of the MEMS die and ultimately becomes an integral part of the packaged optical micro-mechanical device. The tooling fixture can be a heat sink, a compliant thermally conductive material and/or a tooling post.

대표청구항 ▼

1. A package for optical micro-mechanical devices, comprising:one or more optical micro-mechanical devices on a first surface of a die, the first surface of the die including a die reference surface;a tooling fixture attached to a second surface of the die;a package frame comprising an aperture and a first surface, the first surface of the package frame comprising a package frame reference surface proximate the aperture, wherein the package frame reference surface is adapted to allow the die reference surface to be mounted to the package frame reference surface such that the optical micro-mechanical devices are located in the aperture;one or more optical interconnect alignment mechanisms located on the first surface of the package frame and terminating adjacent to the aperture; anddistal ends of one or more optical interconnects located in the optical interconnect alignment mechanisms and optically coupled with one or more of the optical micro-mechanical devices. 2. The apparatus of claim 1 wherein the tooling fixture comprises a heat sink. 3. The apparatus of claim 1 wherein the tooling fixture comprises a compliant thermally conductive material. 4. The apparatus of claim 1 wherein the tooling fixture comprises a tooling post. 5. The apparatus of claim 1 comprising a cover sealing the die and the tooling fixture to the package frame. 6. The apparatus of claim 5 wherein the tooling fixture engages with the cover. 7. The apparatus of claim 1 comprising an encapsulating material sealing the die and the tooling fixture to the package frame. 8. The apparatus of claim 1 comprising one or more contact pads interposed between the die reference surface and the package frame reference surface. 9. The apparatus of claim 8 wherein the contact pads electrically couple one or more optical micro-mechanical devices with external electrical contacts. 10. The apparatus of claim 8 wherein the contact pads electrically couple one or more optical micro-mechanical devices with a flexible circuit member. 11. The apparatus of claim 8 wherein the contact pads electrically couple one or more optical micro-mechanical devices with contact pads located on the package frame reference surface. 12. A method of packaging optical micro-mechanical devices, comprising:preparing a die comprising one or more optical micro-mechanical devices on a first surface of the die, the first surface of the die including a die reference surface;attaching a tooling fixture to a second surface of the die;preparing a package frame including an aperture and a first surface, the first surface of the package frame comprising a package frame reference surface proximate the aperture, wherein the package frame reference surface is adapted to allow the die reference surface to be mounted to the package frame reference surface such that the optical micro-mechanical devices are located in the aperture; andpreparing one or more optical interconnect alignment mechanisms on the first surface of the package frame, the optical interconnect alignment mechanisms on the package frame being positioned to align with corresponding optical micro-mechanical devices on the die when the die reference surface is mounted to the package frame reference surface. 13. The method of claim 12 comprising the steps of:positioning one or more optical interconnects in the optical interconnect alignment mechanisms on the package frame; andengaging the die reference surface with the package frame reference surface to capture the optical interconnects. 14. The method of claim 12 comprising the step of capturing one or more optical interconnects between in the optical interconnect alignment mechanisms on the package frame and the corresponding optical interconnect alignment mechanisms on the die. 15. The method of claim 12 wherein the step of attaching the tooling fixture occurs before the optical micro-mechanical devices are released from the substrate. 16. The method of claim 12 wherein the step of attaching the t ooling fixture occurs before the step of preparing a die including one or more optical micro-mechanical devices. 17. The method of claim 12 wherein the tooling fixture comprises a heat sink. 18. The method of claim 12 wherein the tooling fixture comprises a tooling post. 19. The method of claim 12 wherein the tooling fixture comprises a compliant thermally conductive material. 20. The method of claim 12 comprising sealing the die and the tooling fixture to the package frame using an encapsulating material. 21. The method of claim 12 comprising sealing the die and the tooling fixture to the package frame using a cover. 22. The method of claim 21 comprising the step of engaging the tooling fixture with the cover.

이 특허에 인용된 특허 (38) 인용/피인용 타임라인 분석

Zhang Xia ; McIntyre David G. ; Tang William Chi-Keung, Fabrication method for encapsulated micromachined structures.
상세보기
Douglas P. Mortenson ; Howard P. Wilson, Fiber optic switch package and a method of assembling a fiber optic switch package.
상세보기
Grencavich Robert, Hermetic solder lid closure.
상세보기
Maynard Ronald S., Hybrid-optical multi-axis beam steering apparatus.
상세보기
Pan Jing-Jong ; Shih Ming ; Xu Jingyu, Integrable fiberoptic coupler and resulting devices and systems.
상세보기
Haake John M. ; Beranek Mark W., Integrated microelectromechanical alignment and locking apparatus and method for fiber optic module manufacturing.
상세보기
Schumacher William L. (Camp Hill PA), Light device, lens, and fiber optic package.
상세보기
Kovats Tibor F. I. (Ottawa CAX) Devenyi Tibor F. (Nepean CAX) Look Christopher M. (Nepean CAX), Light emitting device package having combined heater/cooler.
상세보기
Stitt Robert M. (Tucson AZ) Albaugh Neil P. (Tucson AZ), Low profile optical coupling for an optoelectronic module.
상세보기
Albaugh Neil P. (Tucson AZ) Stitt Robert M. (Tucson AZ), Low profile optical coupling to planar-mounted optoelectronic device.
상세보기
Berg Howard M. (Scottsdale AZ) Lewis Gary L. (Peoria AZ) Mitchell Curtis W. (Phoenix AZ), Low thermal impedance plastic package.
상세보기
Fasanella Kenneth W. ; Li Yao ; Wang Ting, Low-cost planar star-coupling structure for large-core polymer optical fibers.
상세보기
Wen Cheng P., MEMS based tile assemblies and methods of fabrication.
상세보기
Mike E. Hamerly ; Robert G. Smith ; Terry L. Smith ; Silva K. Theiss ; Billy L. Weaver, MEMS-based polarization mode dispersion compensator.
상세보기
Koh Seungug, Method and apparatus for providing a seamless electrical/optical multi-layer micro-opto-electro-mechanical system asse.
상세보기
Najafi Nader ; Massoud-Ansari Sonbol, Method for packaging microsensors.
상세보기
Kao Pai-Hsiang ; Mathew Ranjan J. ; De Vera Cornelio, Methods and apparatuses for singulation of microelectromechanical systems.
상세보기
Ford Joseph Earl ; Goossen Keith Wayne ; Walker James Albert, Micro-mechanical, anti-reflection, switched optical modulator array and fabrication method.
상세보기
Riza Nabeel A. (Clifton Park NY) Polla Dennis L. (Brooklyn Park MN), Microdynamical fiber-optic switch and method of switching using same.
상세보기
Dickensheets David L. ; Kino Gordon S., Miniature scanning confocal microscope.
상세보기
Dickensheets David L. ; Kino Gordon S., Miniature scanning confocal microscope.
상세보기
Zory Peter S. (Ossining NY) Scholl Frederick W. (Riverdale NY) Lockwood Harry F. (New York NY), Mounting arrangement for semiconductor optoelectronic devices.
상세보기
Anderson Keith D. (Nepean CAX) Burbidge Douglas S. (Ottawa CAX), Multi-path optical fiber and electro-optic transducer connector.
상세보기
Engelberth Jon W., Optical fiber grating packages.
상세보기
Kovats Tibor F. I. (Ottawa CAX), Optical fiber hermetic seal.
상세보기
Joyce William B., Optical module with stress compensated ferrule-clip assembly.
상세보기
Hamerly, Mike E.; Smith, Robert G.; Theiss, Silva K.; Weaver, Billy L., Optical switch based on rotating vertical micro-mirror.
상세보기
Yui Dai,JPX ; Saitou Masahide,JPX, Optical waveguide module with reinforcing member and buffer protector.
상세보기
Noguchi Shozo (Tokyo JPX) Oshima Yasunobu (Tokyo JPX) Kamata Tohru (Tokyo JPX), Optoelectronic semiconductor devices in hermetically sealed packages.
상세보기
Camlibel ; Irfan ; Rich ; Theodore Charles, Package for optical devices including optical fiber-to-metal hermetic seal.
상세보기
Bhalla Kulbir Singh, Packaged microelectromechanical devices and systems.
상세보기
Blonder Greg E. (Summit NJ), Radiation switching arrangement with moving deflecting element.
상세보기
Gaebe Carl F. (Fleetwood PA) Yeh Xian-Li (Macungie Township ; Lehigh County both of PA), Silicon-based optical subassembly.
상세보기
Jacobowitz Lawrence (Poughkeepsie NY) Ecker Mario E. (Poughkeepsie NY) DeCusatis Casimer M. (Lake Katrine NY), Substrate-embedded pluggable receptacles for connecting clustered optical cables to a module.
상세보기
Jin Sungho ; Lemaire Paul Joseph ; Vengsarkar Ashish Madhukar, Tunable long-period optical grating device and optical systems employing same.
상세보기
McDonald Terrance G., Using an asymmetric element to create a 1XN optical switch.
상세보기
Huang Kai-Feng,TWX ; Tai Kuochou,TWX ; Lin San-Bao,TWX, Vertical cavity surface-emitting laser package.
상세보기
Pan Jing-Jong (Milpitas CA) Shih Ming (Milpitas CA) Xu Jingyu (San Jose CA), Wavelength division multiplexed coupler with low crosstalk between channels and integrated coupler/isolator device.
상세보기

이 특허를 인용한 특허 (1) 인용/피인용 타임라인 분석

Carralero, Michael A.; Chan, Eric Y.; Koshinz, Dennis G., Ruggedized photonic crystal sensor packaging.
상세보기

활용도 분석정보

상세보기

다운로드

내보내기

활용도 Top5 특허

해당 특허가 속한 카테고리에서 활용도가 높은 상위 5개 콘텐츠를 보여줍니다.
더보기 버튼을 클릭하시면 더 많은 관련자료를 살펴볼 수 있습니다.

IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

[미국특허] Tooling fixture for packaged optical micro-mechanical devices 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

이 특허에 인용된 특허 (38) 인용/피인용 타임라인 분석

이 특허를 인용한 특허 (1) 인용/피인용 타임라인 분석

활용도 분석정보

활용도 Top5 특허

관련 콘텐츠

특허 원문 보기

IPC 상위 출원인

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

선택된 텍스트

연합인증

[미국특허] Tooling fixture for packaged optical micro-mechanical devices 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

전체(0) 논문(0) 특허(0) 보고서(0)

전체(0) 논문(0) 특허(0) 보고서(0)

이 특허에 인용된 특허 (38) 인용/피인용 타임라인 분석

이 특허를 인용한 특허 (1) 인용/피인용 타임라인 분석

활용도 분석정보

활용도 Top5 특허 더보기

관련 콘텐츠

특허 원문 보기

IPC 상위 출원인

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

선택된 텍스트

활용도 Top5 특허