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Apparatus for treating a workpiece with steam and ozone 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-00310
출원번호 US-0418695 (2003-04-18)
발명자 / 주소
  • Bergman, Eric J.
출원인 / 주소
  • Semitool, Inc.
대리인 / 주소
    Perkins Coie LLP
인용정보 피인용 횟수 : 8  인용 특허 : 53

초록

In a method for processing a workpiece to remove material from a first surface of the workpiece, steam is introduced onto the first surface under conditions so that at least some of the steam condenses and forms a liquid boundary layer on the first surface. The condensing steam helps to maintain the

대표청구항

1. An apparatus for processing a workpiece, comprising:a process chamber; a workpiece holder in the process chamber for holding the workpiece; a steam generator connecting with the process chamber for delivering steam into the process chamber; an ozone generator connecting with the process chamber f

이 특허에 인용된 특허 (53)

  1. Schwartzkopf George (Franklin Township ; Warren County NJ), Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened r.
  2. Toshima Masato, Apparatus and method for cleaning semiconductor wafers.
  3. Lyon Richard K. (Pittstown NJ), Apparatus and methods for incineration of toxic organic compounds.
  4. Nakajima Takahito (Yokohama JPX) Fukazawa Yuji (Yokohama JPX), Apparatus for subjecting a semiconductor substrate to a washing process.
  5. Matthews Robert Roger, Apparatus for the treatment of semiconductor wafers in a fluid.
  6. McConnell Christopher F. (Gulph Mills PA) Walter Alan E. (Exton PA), Apparatus for treating wafers with process fluids.
  7. Mashimo Noriyoshi (Tokyo JPX) Okumura Katsuya (Yokohama JPX), Arrangement for cleaning semiconductor wafers using mixer.
  8. Kaiser Robert (Winchester MA), Automatic precision cleaning apparatus with continuous on-line monitoring and feedback.
  9. Slinn David S. L. (Bristol GB3), Cleaning and drying of electronic assemblies.
  10. Ohmi Tadahiro,JPX ITX 980, Cleaning device and method.
  11. Sugihara Yasuo,JPX ; Tanaka Kazushige,JPX ; Sakuma Ikue,JPX, Cleaning fluid for semiconductor substrate.
  12. Inada Minoru,JPX ; Kabuki Kimiaki,JPX ; Imajo Yasutaka,JPX ; Yagi Noriaki,JPX ; Saitoh Nobuhiro,JPX, Cleaning method.
  13. Mori Shinichi (27-52 ; Kinugawa 1-chome Otsu-shi ; Shiga JPX) Nomura Tomohiro (1-1-10 ; Tsukamoto Yodogawa-ku ; Osaka-shi ; Osaka JPX), Cleaning process.
  14. Fujikawa Kazonori (Shiga JPX) Tanaka Masato (Shiga JPX) Muraoka Yusuke (Kyoto JPX), Device for rinsing and drying substrate.
  15. Bergman Eric J. (Kalispell MT), Dynamic semiconductor wafer processing using homogeneous mixed acid vapors.
  16. Yoneda Kenji,JPX, Equipment for cleaning, etching and drying semiconductor wafer and its using method.
  17. Ohno, Reiko; Matsuoka, Terumi, Film removing method and film removing agent.
  18. Blackwood Robert S. (Lubbock TX) Biggerstaff Rex L. (Lubbock TX) Clements L. Davis (Lincoln NE) Cleavelin C. Rinn (Lubbock TX), Gaseous process and apparatus for removing films from substrates.
  19. Lin Burn J. (Austin TX), In situ resist control during spray and spin in vapor.
  20. Chao Sidney C. ; Purer Edna M. ; Sorbo Nelson W., Liquid carbon dioxide cleaning using jet edge sonic whistles at low temperature.
  21. Nguyen Bang C. ; Vankataranan Shankar ; Liao Ruby ; Lee Peter W., Method and apparatus for elimination of TEOS/ozone silicon oxide surface sensitivity.
  22. Franca Daniel L. ; Ouimet ; Jr. George F. ; Ziemins Uldis A., Method and apparatus for ozone generation and surface treatment.
  23. Omi Tadahiro (Miyagi JPX) Shimada Makoto (Tokyo JPX) Sawamoto Isao (Kanagawa JPX), Method and apparatus for sterilization of and treatment with ozonized water.
  24. Stanford Thomas B. (San Pedro CA) George ; Jr. Richard C. (Topanga CA) Shinno Jennifer I. (Canoga Park CA) Mehta Dhiren C. (Cypress CA) Rodine Gifford W. (El Segundo CA), Method and system for removing contaminants.
  25. Kodama Hiroyuki (Yokohama JPX), Method for cleaning a substrate.
  26. Ham William E. (Mercerville NJ), Method for cleaning and drying semiconductors.
  27. Shinagawa Keisuke,JPX ; Fujimura Shuzo,JPX ; Matoba Yuuji,JPX ; Nakano Yoshimasa,JPX ; Takeuchi Tatsuya,JPX ; Miyanaga Takeshi,JPX, Method for controlling apparatus for supplying steam for ashing process.
  28. DeGendt, Stefan; Knotter, Dirk; Heyns, Marc; Meuris, Marc; Mertens, Paul, Method for removing organic contaminants from a semiconductor surface.
  29. Kashiwase Masaharu (Okayama JPX) Matsuoka Terumi (Okayama JPX), Method for removing organic film.
  30. Koizumi Kootaroo (Kodaira JPX) Tsunekawa Sukeyoshi (Tokorozawa JPX) Kawasumi Kenichi (Oume JPX) Kimura Takeshi (Higashimurayama JPX) Funatsu Keisuke (Hamura JPX), Method of and apparatus for removing an organic film.
  31. Kaneko Yoshio (Chiba JPX) Koda Munetaka (Chiba JPX) Shiraishi Tadayoshi (Chiba JPX) Murakami Takehiro (Chiba JPX), Method of cleaning semiconductor substrate and apparatus for carrying out the same.
  32. Kunze-Concewitz Horst,DEX, Method of cleaning surfaces with water and steam.
  33. Hasebe Keizo (Kofu JPX) Fujimoto Akihiro (Kumamoto-ken JPX) Inada Hiroichi (Kumamoto JPX) Iino Hiroyuki (Nirasaki JPX) Kitamura Shinzi (Kumamoto-ken JPX) Deguchi Masatoshi (Kumamoto JPX) Nambu Mitsuh, Method of forming coating film and apparatus therefor.
  34. Tanaka Masato (Shiga JPX), Method of treating surface of rotating wafer using surface treating gas.
  35. Bullock David M., Methods and apparatus for controlled partial ashing in a variable-gap plasma processing chamber.
  36. McNeilly Michael A. ; deLarios John M. ; Nobinger Glenn L. ; Krusell Wilbur C. ; Kao Dah-Bin ; Manriquez Ralph K. ; Fan Chiko, Organic preclean for improving vapor phase wafer etch uniformity.
  37. Kosofsky Howard B. ; Shrieber Lawrence A. ; Rhodes Richard O. ; Damron Michael D. ; Garcia Eduardo M., Pressure washing apparatus with ozone generator.
  38. Schellenberger Wilhelm,DEX ; Herrmannsdorfer Dieter,DEX, Procedure for the drying of silicon.
  39. Matthews Robert R. (Richmond CA), Process and apparatus for the treatment of semiconductor wafers in a fluid.
  40. Grant Robert W. (Excelsior MN) Torek Kevin (State College PA) Novak Richard E. (Plymouth MN) Ruzyllo Jerzy (State College PA), Process for etching oxide films in a sealed photochemical reactor.
  41. Lampert Ingolf (Burghausen DEX) Gratzl Christa (Neuotting DEX), Process for the wet-chemical surface treatment of semiconductor wafers.
  42. Matthews Robert Roger, Process for treatment of semiconductor wafers in a fluid.
  43. Bergman Eric J. (Kalispell MT) Reardon Timothy J. (Kalispell MT) Thompson Raymon F. (Lakeside MT) Owczarz Aleksander (Kalispell MT), Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization.
  44. Lorimer D\Arcy (Santa Clara CA), Steam generator.
  45. Kamikawa Yuji,JPX ; Kitahara Shigenori,JPX ; Ueno Kinya,JPX, Substrate processing apparatus and substrate processing method.
  46. Dobson Jesse C. (Oakland CA), Sulfuric acid reprocessor.
  47. Yamaguchi Sumio (Tokyo JPX) Inada Akio (Tokyo JPX) Kawasumi Kenichi (Ome JPX), Surface treatment apparatus.
  48. Grebinski Thomas J. (Sunnyvale CA), Surface treatment to remove impurities in microrecesses.
  49. Liu Benjamin Y. H. (North Oaks MN) Ahn Kang H. (Minneapolis MN), System for surface and fluid cleaning.
  50. Nelson Steven L. ; Christenson Kurt K., System to increase the quantity of dissolved gas in a liquid and to maintain the increased quantity of dissolved gas in.
  51. Kusuhara Masaki (Tokyo JPX), Vapor drying apparatus.
  52. Kurokawa Hideaki (Hitachi JPX) Ebara Katsuya (Mito JPX) Takahashi Sankichi (Hitachi JPX) Matsuzaki Harumi (Hitachi JPX) Yoda Hiroaki (Tsuchiura JPX) Nitta Takahisa (Fuchu JPX) kouchi Isao (Hitachi JP, Vapor washing process and apparatus.
  53. Miyazaki Takeshiro,JPX ; Tsubata Yoshikazu,JPX ; Kawakita Akio,JPX ; Katsumata Noboru,JPX ; Nakayama Akihiro,JPX ; Harada Toyokazu,JPX ; Takaku Mitsuo,JPX ; Yoshida Syunso,JPX, Wafer processing system.

이 특허를 인용한 특허 (8)

  1. Eilmsteiner, Gerhard; Ninaus, Johann, Etch apparatus and method of etching silicon nitride.
  2. Kashkoush, Ismail; Nolan, Thomas; Nemeth, Dennis; Novak, Richard, Method for cleaning substrates utilizing surface passivation and/or oxide layer growth to protect from pitting.
  3. Fucsko, Janos; Rana, Niraj B.; Tagg, Sandra; Hanson, Robert J.; Sabde, Gundu M.; Yates, Donald L.; Flynn, Patrick M.; Raghu, Prashant; Grant, Kyle, Methods of treating semiconductor substrates, methods of forming openings during semiconductor fabrication, and methods of removing particles from over semiconductor substrates.
  4. Fucsko, Janos; Rana, Niraj B.; Tagg, Sandra; Hanson, Robert J.; Sabde, Gundu M.; Yates, Donald L.; Flynn, Patrick M.; Raghu, Prashant; Grant, Kyle, Methods of treating semiconductor substrates, methods of forming openings during semiconductor fabrication, and methods of removing particles from over semiconductor substrates.
  5. Rosko, Michael Scot; Jonte, Patrick B.; DeVries, Adam M.; Thomas, Kurt J.; Sawaski, Joel D., Ozone distribution in a faucet.
  6. Lauerhaas, Jeffrey M., Process for removing carbon material from substrates.
  7. Christenson, Kurt K.; DeKraker, David, Process for treatment of semiconductor wafer using water vapor containing environment.
  8. Masui, Kenji; Kosaka, Akio; Watanabe, Hidehiro, Substrate cleaning method and substrate cleaning apparatus.

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