초록 ▼

A micromechanical structure is described which is disposed on a base body and requires protection from environmental influences by a covering body. Furthermore, electrical contacts are necessary for establishing contacts for the micromechanical structure. By skillfully carrying out a sawing-into ope

A micromechanical structure is described which is disposed on a base body and requires protection from environmental influences by a covering body. Furthermore, electrical contacts are necessary for establishing contacts for the micromechanical structure. By skillfully carrying out a sawing-into operation and a sawing-through operation, it is possible to expose the electrical contact.

대표청구항 ▼

1. A method of producing a micromechanical structure, which comprises the steps of:joining a base body to a covering body along a common boundary surface to form a composite body having a cavity formed in the composite body along the common boundary surface; disposing the composite body with a surfa

1. A method of producing a micromechanical structure, which comprises the steps of:joining a base body to a covering body along a common boundary surface to form a composite body having a cavity formed in the composite body along the common boundary surface; disposing the composite body with a surface of the base body on a support for a sawing of the covering body; forming an opening to the cavity by removing material in a region of one surface of the composite body; and disposing the composite body with a surface of the covering body on the support for a sawing of the base body. 2. The method according to claim 1, which comprises forming the opening to the cavity by at least partially sawing the material in the region of the one surface of the composite body using a circular saw.3. The method according to claim 2, which comprises providing an electrical contact in the cavity and the electrical contact is at least partially exposed during the sawing.4. The method according to claim 3, which comprises laminating the base body onto a film functioning as the support and severing the covering body with the sawing.5. The method according to claim 3, which comprises laminating the composite body having the covering body onto a film functioning as the support and performing further sawing cuts through the composite body, with an individually separated chip being sawn out.6. The method according to claim 5, which comprises detaching the individually separated chip from the film by a vacuum pipette and parts of the covering body that were disposed above the electrical contact remain on the film.7. The method according to claim 5, which comprises providing a plurality of electrical contacts in the cavity and after a sawing-up of the composite body, the individually separated chip has the electrical contacts on at least one side.8. The method according to claim 5, which comprises providing a plurality of electrical contacts in the cavity, and after a sawing-up of the composite body, the individually separated chip has the electrical contacts on a first side and at least one second side adjacent to the first side.9. The method according to claim 5, which comprises providing a plurality of electrical contacts in the cavity, and after a sawing-up of the composite body, the individually separated chip has the electrical contacts on a first side and a second side lying opposite the first side.10. The method according to claim 1, which comprises forming a depression in the covering body, the depression forms the cavity after the base body and the covering body have been joined together.11. The method according to claim 1, which comprises forming a depression in the base body, the depression forms the cavity after the base body and the covering body have been joined together.12. The method according to claim 1, which comprises forming the base body from a material selected from the group consisting of silicon, gallium arsenide, ceramic and glass.13. The method according to claim 1, which comprises using at least one method selected from the group consisting of a eutectic bonding method, a silicon-fusion bonding method, an anodic bonding method, an adhesive bonding method, and a soldering method for joining the covering body to the base body.14. The method according to claim 1, which comprises forming the covering body from a material selected from the group consisting of silicon, glass and plastic.