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Compact thermosiphon for dissipating heat generated by electronic components 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-00720
출원번호 US-0374346 (2003-02-25)
발명자 / 주소
  • Ghosh, Debashis
  • Bhatti, Mohinder Singh
  • Reyzin, Ilya
출원인 / 주소
  • Delphi Technologies, Inc.
인용정보 피인용 횟수 : 32  인용 특허 : 14

초록

A compact thermosiphon assembly for dissipating heat generated by electronic components using a working fluid includes a tube having a first end and a second end and a flat cross section defining an elongated chamber is disclosed. The tube has an evaporation region for receiving heat to evaporate th

대표청구항

1. A compact thermosiphon assembly having a minimum package height and for dissipating heat generated by electronic components using a working fluid, said assembly comprising:a tube having a first end and a second end and a flat cross section defining an elongated chamber and defining a surface area

이 특허에 인용된 특허 (14)

  1. Tajima Makoto,JPX, Cooling device for electronic component.
  2. Yamamoto Masaaki,JPX ; Niekawa Jun,JPX ; Ueki Tatuhiko,JPX ; Ikeda Masami,JPX ; Sasaki Ken,JPX, Cooling device with heat pipe.
  3. Akira Ueda JP; Masumi Suzuki JP; Minoru Hirano JP, Electronic apparatus having a heat dissipation member.
  4. Grover George M. (Los Alamos NM) Chrisman Robert H. (Los Alamos NM), Heat pipe.
  5. McCready Raymond George (South Bend IN) Eggers Philip Eugene (Worthington OH), Heat pipe cooling system for electronic devices.
  6. Saaski Elric (Kirkland WA) Hannemann Robert J. (Wellesley MA) Fox Leslie R. (Acton MA), Integral heat pipe module.
  7. Brzezinski Dennis (Sunnyvale CA), Integrated multi-chip module having a conformal chip/heat exchanger interface.
  8. Andresen Rolf (Tucson AZ) Bellar Robert J. (Tucson AZ) Kim Sung J. (Tucson AZ) Murphy Alan L. (Tucson AZ), Method and apparatus for immersion cooling or an electronic board.
  9. Mundinger David C. (Dublin CA) Scifres Donald R. (San Jose CA), Micropost waste heat removal system.
  10. Mermet-Guyennet, Michel, Power converter enclosure.
  11. Brunet Patrice (Courbevoie FRX) Avignon Gilles (Argenteuil FRX) Heron Franck (Antony FRX), System for dissipating heat energy generated by an electronic component and sealed enclosure used in a system of this ki.
  12. Reyzin, Ilya; Bhatti, Mohinder Singh; Ghosh, Debashis; Joshi, Shrikant Mukund, Thermosiphon for electronics cooling with high performance boiling and condensing surfaces.
  13. Larson Ralph I. ; Phillips Richard L., Two phase component cooler.
  14. Larson Ralph I. ; Phillips Richard L., Two-phase thermal bag component cooler.

이 특허를 인용한 특허 (32)

  1. Bhatti,Mohinder Singh; Reyzin,Ilya; Ghosh,Debashis, Capillary-assisted compact thermosiphon.
  2. Gradinger, Thomas; Agostini, Francesco, Cooling apparatus for cooling a power electronic device.
  3. Prest, Christopher D.; Sanford, Emery A., Glass enclosure.
  4. Zadesky, Stephen Paul; Lynch, Stephen Brian, Handheld computing device.
  5. Zadesky, Stephen Paul; Lynch, Stephen Brian, Handheld computing device.
  6. Zadesky, Stephen Paul; Lynch, Stephen Brian, Handheld computing device.
  7. Zadesky, Stephen Paul; Lynch, Stephen Brian, Handheld computing device.
  8. Zadesky, Stephen Paul; Lynch, Stephen Brian, Handheld computing device.
  9. Zadesky, Stephen Paul; Lynch, Stephen Brian, Handheld computing device.
  10. Meyer, IV, George Anthony; Sun, Chien-Hung, Heat dissipation device.
  11. Shih,Jung Sung; Wu,Wei Fang; Huang,Yu Hung; Chen,Chin Ming, Heat dissipation module.
  12. Garrett, Gerald Bruce, Liquid storage and cooling computer case.
  13. Alex,Belits; Valeriy,Belits, Low-profile thermosyphon-based cooling system for computers and other electronic devices.
  14. Rice, Jeremy; Nguyen, Huan D.; Spaulding, Jeffrey S., Manufacturing process for thermosiphon heat exchanger.
  15. Rice, Jeremy; Nguyen, Huan D.; Spaulding, Jeffrey S., Manufacturing process for thermosiphon heat exchanger.
  16. Zadesky, Stephen Paul; Lynch, Stephen Brian, Method for manufacturing a portable computing device.
  17. Zadesky, Stephen Paul; Lynch, Stephen Brian, Method of manufacturing a handheld computing device.
  18. Zadesky, Stephen Paul; Lynch, Stephen Brian, Method of manufacturing a handheld computing device.
  19. Pfahnl,Andreas C., Modular liquid cooling of electronic assemblies.
  20. Agostini, Bruno, Multi-row thermosyphon heat exchanger.
  21. Bhatti, Mohinder Singh; Reyzin, Ilya; Joshi, Shrikant Mukund, Orientation insensitive thermosiphon capable of operation in upside down position.
  22. Wan, Cheng-Chien; Wan, Cheng-Feng; Lin, Hao-Hui, Refrigerant heat dissipating apparatus.
  23. Schuette, Franz Michael, Sealed self-contained fluidic cooling device.
  24. Pfahnl,Andreas C.; Griffith,Peter, Thermally enhanced pressure regulation of electronics cooling system.
  25. Bhatti,Mohinder Singh; Reyzin,Ilya; Joshi,Shrikant Mukund, Thermosiphon for laptop computer.
  26. Bhatti, Mohinder Singh; Reyzin, Ilya; Bright, James Alan; Vetter, Stephen Michael; Joshi, Shrikant Mukund, Thermosiphon for laptop computers comprising a boiling chamber with a square wave partition.
  27. Rice, Jeremy; Spaulding, Jeffrey S.; Nguyen, Huan D., Thermosiphon systems for electronic devices.
  28. Rice, Jeremy; Spaulding, Jeffrey S.; Nguyen, Huan D., Thermosiphon systems for electronic devices.
  29. Rice, Jeremy, Thermosiphon systems with nested tubes.
  30. Rice, Jeremy, Thermosiphon systems with nested tubes.
  31. Agostini, Bruno, Twisted tube thermosyphon.
  32. Douglas, David C.; Copeland, David W.; Guenin, Bruce M., Winged heat sink.
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