[특허]Apparatus for and method of manufacturing a semiconductor die carrier

Silicon Bandwidth, Inc.

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특허 상세정보

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내보내기 페이스북 공유 트위터 공유 카카오톡 공유

Apparatus for and method of manufacturing a semiconductor die carrier

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B23P-019/00 H05K-013/00
미국특허분류(USC)	029/033.M; 029/564.6; 029/741; 029/837; 029/759; 901/009
출원번호	US-0705710 (2000-11-06)
발명자 / 주소	Crane, Jr., Stanford W. Larcomb, Daniel Krishnapura, Lakshminarasimha
출원인 / 주소	Silicon Bandwidth, Inc.
대리인 / 주소	Morgan, Lewis &
인용정보	피인용 횟수 : 2 인용 특허 : 72

초록
▼

A lead insertion machine includes a substrate supply, a conductive lead supply, and an lead insertion mechanism. The conductive leads are inserted into lead passages formed in side walls of the substrate. Also disclosed is a method of manufacturing a semiconductor die carrier including the steps of forming a plurality of conductive leads, forming a substrate for holding a semiconductor die, the substrate having a plurality of insulative side walls defining an exterior surface of the substrate, each of the side walls having a plurality of lead passages formed therethrough, and simultaneously inserting at least one of the conductive leads into the lead passage of one of the side walls for retention therein and at least one other of the conductive leads into the lead passage of another of the side walls for retention therein.

대표
청구항
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1. An apparatus for inserting conductive leads into a semiconductor die package housing, the housing having a plurality of side walls defining an exterior surface of said housing, each of the side walls having a plurality of lead passages formed therethrough, the apparatus comprising:a lead pusher for inserting conductive leads into lead passages on a side of the housing, said lead pusher including a groove for holding a conductive lead during insertion. 2. The apparatus of claim 1, wherein said lead pusher includes a plurality of grooves for simultaneously inserting a plurality of conductive leads into the housing.3. The apparatus of claim 1, wherein said lead pusher includes a plurality grooves on a first side thereof and a plurality of grooves on a second side thereof opposite the first side.4. The apparatus of claim 2, further comprising a mandrel for holding the housing during insertion of conductive leads.5. The apparatus of claim 4, further comprising:a punch for removing conductive leads from a strip and for placing the leads into the grooves of said lead pusher. 6. The apparatus of claim further comprising:a driver for extending and retracting said lead pusher to insert conductive leads into the housing; a monitoring system; and a controller for controlling said driver in accordance with signals received from said monitoring system. 7. The apparatus of claim 1, further comprising a second lead pusher for inserting leads into lead passages on a second side of the housing, said second lead pusher including a groove for holding a conductive lead during insertion.8. The apparatus of claim 7, wherein said lead pusher and said second lead pusher each include a plurality of grooves for simultaneously inserting a plurality of conductive leads into the housing.9. The apparatus of claim 8, wherein said lead pusher and said second lead pusher each include a plurality of grooves for simultaneously inserting multiple columns of conductive leads into the housing.10. The apparatus of claim 9, wherein at least one of said lead pusher grooves is substantially L-shaped and at least one of said second lead pusher grooves is substantially L-shaped.11. The apparatus of claim 8, wherein said lead pusher and said second lead pusher simultaneously insert conductive leads into the housing.12. The apparatus of claim 8, further comprising a mandrel for holding the housing during insertion of conductive leads.13. The apparatus of claim 12, further comprising:a first punch for removing conductive leads from a first strip and for placing the leads removed by the first punch into the grooves of said lead pusher; and a second punch for removing conductive leads from a second strip and for placing the leads removed by the second punch into the grooves of said second lead pusher. 14. The apparatus of claim 13, further comprising:a first driver for extending and retracting said lead pusher; a second driver for extending and retracting said second lead pusher; and a monitoring system; and a controller for controlling said first driver and said second driver in accordance with signals received from said monitoring system. 15. The apparatus of claim 1, wherein the groove is substantially L-shaped.16. An apparatus for inserting conductive leads into a substrate for holding a semiconductor die, the substrate having a plurality of insulative side walls defining an exterior surface of said substrate, each of the side walls having a plurality of lead passages formed therethrough in multiple, vertically-spaced rows, the apparatus comprising:means for supplying a plurality of L-shaped conductive leads for insertion into the substrate; means for supplying individual substrates to have conductive leads inserted therein; means for simultaneously inserting L-shaped conductive leads into the lead passages in at least two of the vertically-spaced rows on one of the side walls of the substrate. 17. An apparatus for inserting conductive leads into a semiconductor die carrier housing, the apparatus comprising:a mandrel for holding a semiconductor die carrier housing; a punch for removing individual conductive leads from a transport medium; and a lead pusher, receiving a supply of conductive leads from said punch, for inserting the conductive leads into lead passages in said semiconductor die carrier housing. 18. The apparatus of claim 17, further comprising a product carriage for receiving the semiconductor die carrier housing after insertion of the leads.19. The apparatus of claim 18, further comprising a robot arm, the robot arm adapted to move individual housings to the mandrel prior to insertion of the leads and from the mandrel to the product carriage after insertion of the leads.20. The apparatus of claim 19, further comprising a vision guidance assembly for guiding said robot arm.21. The apparatus of claim 17, wherein the punch removes L-shaped conductive leads from the transport medium.22. The apparatus of claim 17, wherein the transport medium comprises a substantially continuous strip containing the conductive leads and said punch removes the conductive leads from the substantially continuous strip.23. The apparatus of claim 17, further comprising a tube for holding a plurality of semiconductor die carrier housings therein and an ejector coupled to said tube for removing one housing from the tube at a time.24. The apparatus of claim 23, further comprising a robot arm adapted to move individual housings from the ejector to the mandrel.25. The apparatus of claim 24, further comprising a vision guidance assembly for guiding said robot arm.26. The apparatus of claim 17, further comprising a second lead pusher for inserting the conductive leads into lead passages in the semiconductor die carrier housing.27. The apparatus of claim 26, further comprising a lead pusher drive for simultaneously driving said lead pusher and said second lead pusher to simultaneously insert the conductive leads into lead passages through the semiconductor die carrier housing.28. The apparatus of claim 27, further comprising a drive controller for controlling said lead pusher drive to control an insertion depth of the conductive leads in the semiconductor die carrier housing.

인용문헌 (72)

이 특허를 인용한 특허 (2)

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Apparatus for and method of manufacturing a semiconductor die carrier

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인용문헌 (72)

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Apparatus for and method of manufacturing a semiconductor die carrier

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인용문헌 (72)

이 특허를 인용한 특허 (2)

IPC 상위 출원인

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IPC 상세정보(version : 201201)

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