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A semiconductor device includes a semiconductor chip with a functional surface, a substrate opposing the functional surface of the semiconductor chip at a space formed between the substrate and the functional surface, a power supplying device electrically connected to a part of the functional surfac

A semiconductor device includes a semiconductor chip with a functional surface, a substrate opposing the functional surface of the semiconductor chip at a space formed between the substrate and the functional surface, a power supplying device electrically connected to a part of the functional surface of the semiconductor chip and separated by a slight gap from the substrate, a fixing member that fixes the semiconductor chip to the substrate, and a sealing member that seals the space formed between the substrate and the functional surface of the semiconductor chip other than a space formed between the substrate and the functional surface of the semiconductor chip that are fixed to each other through the fixing member and other than the gap formed between the power supplying device and the substrate. The sealing member has greater elasticity than the fixing member.

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1. A semiconductor device comprising:a semiconductor chip including a functional surface; a substrate configured to support the semiconductor chip, the substrate opposing the functional surface of the semiconductor chip at a space formed between the substrate and the functional surface; a power supp

1. A semiconductor device comprising:a semiconductor chip including a functional surface; a substrate configured to support the semiconductor chip, the substrate opposing the functional surface of the semiconductor chip at a space formed between the substrate and the functional surface; a power supplying device configured to supply electric power to the semiconductor chip while being electrically connected to a part of the functional surface of the semiconductor chip, wherein the power supplying device is interposed between the functional surface of the semiconductor chip and the substrate, and the power supplying device is in close proximity with substrate; a fixing member configured to fix the semiconductor chip to the substrate, the fixing member being disposed beside a part of the functional surface of the semiconductor chip other than a part of the functional surface of the semiconductor chip connected to the power supplying device; and a sealing member configured to seal the space formed between the substrate and the functional surface of the semiconductor chip other than a space formed between the substrate and the functional surface of the semiconductor chip that are fixed to each other through the fixing member and other than a gap formed between the power supplying device and the substrate, wherein the sealing member has greater elasticity than the fixing member. 2. The semiconductor device according to claim 1, wherein the fixing member comprises an adhesive material, and the sealing member comprises an adhesive material having greater elasticity than the adhesive material of the fixing member.3. The semiconductor device according to claim 1, wherein the sealing member comprises a foaming material.4. The semiconductor device according to claim 1, wherein a contact angle of at least one of a surface of the substrate and a surface of the power supplying device that form the gap between the substrate and the power supplying device relative to the sealing member is greater than a contact angle of a part of the surface of the substrate not facing the gap relative to the sealing member.5. The semiconductor device according to claim 1, wherein the sealing member comprises a film adhesive material.6. The semiconductor device according to claim 1, wherein at least one of the fixing member and the sealing member comprises a photo-curing type adhesive material.7. The semiconductor device according to claim 1, wherein at least one of the fixing member and the sealing member comprises a heat-curing type adhesive material having a curing temperature lower than a temperature causing breakage of electrical connection between the semiconductor chip and the power supplying device.8. The semiconductor device according to claim 1, wherein at least one of the fixing member and the sealing member comprises a thermoplastic type adhesive material having a softening temperature lower than a temperature causing breakage of electrical connection between the semiconductor chip and the power supplying device.9. The semiconductor device according to claim 1, wherein the sealing member comprises an adhesive material coated with a cured adhesive material.10. The semiconductor device according to claim 9, wherein the sealing member has a circular-shaped cross-section.11. The semiconductor device according to claim 9, wherein the sealing member has a polygonal-shaped cross-section.12. The semiconductor device according to claim 1, wherein the sealing member comprises an adhesive material holding element and an adhesive material held by the adhesive material holding element.13. The semiconductor device according to claim 12, wherein the adhesive material holding element comprises a sponge material.14. The semiconductor device according to claim 13, wherein the adhesive material holding element has a light transparent property.15. The semiconductor device according to claim 12, wherein the adhesive material holding element comprises an aggregated body of fibers.16. The semiconductor device according to claim 15, wherein the adhesive material holding element has a light transparent property.17. The semiconductor device according to claim 1, wherein the substrate comprises a light transparent material, and the functional surface of the semiconductor chip comprises an optical functional surface, and a light incident space is formed between the optical functional surface of the semiconductor chip and the substrate.18. The semiconductor device according to claim 17, wherein at least one of the fixing member and the sealing member comprises a photo-curing type adhesive material.19. The semiconductor device according to claim 17, wherein at least one of the fixing member and the sealing member comprises a heat-curing type adhesive material having a curing temperature lower than a temperature causing breakage of electrical connection between the semiconductor chip and the power supplying device.20. The semiconductor device according to claim 17, wherein at least one of the fixing member and the sealing member comprises a thermoplastic type adhesive material having a softening temperature lower than a temperature causing breakage of electrical connection between the semiconductor chip and the power supplying device.21. The semiconductor device according to claim 17, wherein the semiconductor chip comprises a solid-state imaging device.22. An image scanning unit, comprising: an optical element; and the semiconductor device of claim 21.23. An image forming apparatus, comprising: an image carrier configured to carry an image; and the image scanning unit of claim 22.24. The semiconductor device according to claim 1, wherein a surface of the semiconductor chip on the opposite side of the functional surface is exposed to outside for radiating heat.25. The semiconductor device according to claim 24, wherein the semiconductor chip comprises a solid-state imaging device.26. An image scanning unit, comprising: an optical element; and the semiconductor device of claim 25.27. An image forming apparatus, comprising: an image carrier configured to carry an image; and the image scanning unit of claim 26.28. The semiconductor device according to claim 1, further comprising a heat radiating device on a surface of the semiconductor chip on the opposite side of the functional surface.29. The semiconductor device according to claim 28, wherein the semiconductor chip comprises a solid-state imaging device.30. An image scanning unit, comprising: an optical element; and the semiconductor device of claim 29.31. An image forming apparatus, comprising: an image carrier configured to carry an image; and the image scanning unit of claim 30.32. A semiconductor device comprising:a semiconductor chip including a functional surface; a substrate configured to support the semiconductor chip, the substrate opposing the functional surface of the semiconductor chip at a space formed between the substrate and the functional surface; a power supplying device configured to supply electric power to the semiconductor chip while being electrically connected to a part of the functional surface of the semiconductor chip, wherein the power supplying device is interposed between the functional surface of the semiconductor chip and the substrate, and the power supplying device is in intimate contact with the substrate; a fixing member configured to fix the semiconductor chip to the substrate, the fixing member being disposed beside a part of the functional surface of the semiconductor chip other than a part of the functional surface of the semiconductor chip connected to the power supplying device; and a sealing member configured to seal the space formed between the substrate and the functional surface of the semiconductor chip other than a space formed between the substrate and the functional surface of the semiconductor chip that are fixed to each other through the fixing member, wherein the sealing member has greater elasticity than the fixing member. 33. A semiconductor device comprising:a semiconductor chip including a functional surface; supporting means for supporting the semiconductor chip, the supporting means opposing the functional surface of the semiconductor chip at a space formed between the supporting means and the functional surface; power supplying means for supplying electric power to the semiconductor chip while being electrically connected to a part of the functional surface of the semiconductor chip, wherein the power supplying means is interposed between the functional surface of the semiconductor chip and the supporting means, and the power supplying means is in close proximity with the supporting means; fixing means for fixing the semiconductor chip to the supporting means, the fixing means being disposed beside a part of the functional surface of the semiconductor chip other than a part of the functional surface of the semiconductor chip connected to the power supplying means; and sealing means for sealing the space formed between the supporting means and the functional surface of the semiconductor chip other than a space formed between the supporting means and the functional surface of the semiconductor chip that are fixed to each other through the fixing means and other than a gap formed between the power supplying means and the supporting means, wherein the sealing means has greater elasticity than the fixing means.