[특허]Wiring board provided with passive element and cone shaped bumps

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-001/03 H05K-007/12
출원번호	US-0160179 (2002-06-04)
우선권정보	JP-0170020 (2001-06-05); JP-0170019 (2001-06-05)
발명자 / 주소	Fukuoka, Yoshitaka Serizawa, Tooru Yagi, Hiroshi Shimada, Osamu Hirai, Hiroyuki Yamaguchi, Yuji
출원인 / 주소	Dai Nippon Printing Co., Ltd. D.T. Circuit Technology Co., Ltd.
대리인 / 주소	Finnegan, Henderson, Farabow, Garrett &
인용정보	피인용 횟수 : 30 인용 특허 : 16

초록 ▼

A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a

A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.

대표청구항 ▼

1. A wiring board comprising:an insulating board having a first surface and a second surface; a stratified resistive element and/or stratified dielectrics embedded in the insulating board so as to appear in the first surface and/or the second surface of the insulating board; a first wiring layer and

1. A wiring board comprising:an insulating board having a first surface and a second surface; a stratified resistive element and/or stratified dielectrics embedded in the insulating board so as to appear in the first surface and/or the second surface of the insulating board; a first wiring layer and a second wiring layer that are, respectively, disposed on the first surface and the second surface of the insulating board, and each of which has a connection with the stratified resistive element and/or the stratified dielectrics in the corresponding first/second surface; and a conductive bump that penetrates through the insulating board and has an electrical connection with each of the first and second wiring layers, the conductive bump having a shape of a substantially truncated cone whose axis faces the first and second wiring layers. 2. A wiring board as set forth in claim 1:wherein at least one of the first and second wiring layers has an inductor that is vortically formed due to a pattern and/or a loop antenna that is formed loop-like due to a pattern. 3. A wiring board as set forth in claim 1, further comprising:a second insulating board disposed in contact with the first wiring layer side of the insulating board; a second conductive bump that penetrates through a second insulating board; and a third wiring layer disposed on a side different from the insulating board side of the second insulating board; wherein the first wiring layer of the insulating board is disposed so as to sink in a thickness direction of the second insulating board; and each of the first and third wiring layers having an electrical connection with the second conductive bump. 4. A wiring board as set forth in claim 3, further comprising:a second stratified resistive element and/or second stratified dielectrics embedded in the second insulating board so as to appear in the third wiring layer side of the second insulating board; wherein the third wiring layer has a connection with the second stratified resistive element/the second stratified dielectrics. 5. A wiring board as set forth in claim 3:wherein the third wiring layer has an inductor that is vortically formed due to a pattern and/or a loop antenna that is formed loop-like due to a pattern. 6. A wiring board as set forth in claim 3, further comprising:a third insulating board disposed in contact with the second wiring layer side of the insulating board; a third conductive bump that penetrates through the third insulating board; and a fourth wiring layer disposed on a side different from the insulating board side of the third insulating board; wherein the second wiring layer of the insulating board is disposed so as to sink in a thickness direction of the third insulating board; and each of the second and fourth wiring layers has an electrical connection with the third conductive bump. 7. A wiring board as set forth in claim 6, further comprising:a second stratified resistive element and/or a second stratified dielectrics embedded in the third insulating board so as to appear in the fourth wiring layer side of the third insulating board; wherein the fourth wiring layer has a connection with the second stratified resistive element/the second stratified dielectrics. 8. A wiring board as set forth in claim 6:wherein the fourth wiring layer has an inductor that is vortically formed due to a pattern and/or a loop antenna that is formed loop-like due to a pattern. 9. A wiring board, comprising:an insulating board having a first surface and a second surface; a stratified resistive element and/or stratified dielectrics embedded in the insulating board so as to appear in the first surface and/or the second surface of the insulating board; a first wiring layer and a second wiring layer that are, respectively, disposed on the first surface and the second surface of the insulating board, and each of which has a connection with the stratified resistive element and/or the stratified dielectrics in the corresponding first/second surface; and a conductive bump that penetrates through the insulating board and has an electrical connection with each of the first and second wiring layers, the conductive bump being a shape having an axis facing the first and second wiring layers and having a diameter varying along the axis. 10. A wiring board as set forth in claim 9:wherein at least one of the first and second wiring layers has an inductor that is vortically formed due to a pattern and/or a loop antenna that is formed loop-like due to a pattern. 11. A wiring board as set forth in claim 9, further comprising:a second insulating board disposed in contact with the first wiring layer side of the insulating board; a second conductive bump that penetrates through the second insulating board; and a third wiring layer disposed on a side different from the insulating board side of the second insulating board; wherein the first wiring layer of the insulating board is disposed so as to sink in a thickness direction of the second insulating board; and each of the first and third wiring layers having an electrical connection with the second conductive bump. 12. A wiring board as set forth in claim 11, further comprising:a second stratified resistive element and/or second stratified dielectrics embedded in the second insulating board so as to appear in the third wiring layer side of the second insulating board; wherein the third wiring layer has a connection with the second stratified resistive element/the second stratified dielectrics. 13. A wiring board as set forth in claim 11:wherein the third wiring layer has an inductor that is vortically formed due to a pattern and/or a loop antenna that is formed loop-like due to a pattern. 14. A wiring board as set forth in claim 11, further comprising:a third insulating board disposed in contact with the second wiring layer side of the insulating board; a third conductive bump that penetrates through the third insulating board; and a fourth wiring layer disposed on the third insulating board on a side different from the insulating board side of the third insulating board; wherein the second wiring layer of the insulating board is disposed so as to sink in a thickness direction of the third insulating board; and each of the second and fourth wiring layers having an electrical connection with the third conductive bump. 15. A wiring board as set forth in claim 14, further comprising:a second stratified resistive element and/or second stratified dielectrics embedded in the third insulating board so as to appear in the fourth wiring layer side of the third insulating board; wherein the fourth wiring layer has a connection with the second stratified resistive element/the second stratified dielectrics. 16. A wiring board as set forth in claim 14:wherein the fourth wiring layer has an inductor that is vortically formed due to a pattern and/or a loop antenna that is formed loop-like due to a pattern.

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