초록 ▼

A CCD unit is provided on the surface side of a thin shape section that is formed on a first substrate. In the CCD unit, first cells are provided and disposed in the form of an array in a direction in which the thin shape section extends. An InGaAs photodiode unit is provided at a second substrate i

A CCD unit is provided on the surface side of a thin shape section that is formed on a first substrate. In the CCD unit, first cells are provided and disposed in the form of an array in a direction in which the thin shape section extends. An InGaAs photodiode unit is provided at a second substrate in the InGaAs photodiode unit, second cells are provided and disposed in an array in the same direction as the first cells while having equal pitches to the first cells. The first substrate and second substrate are stacked over each other in such a manner that the surface of the first substrate and a second incidence plane of the second substrate oppose each other to ensure that part of a first photoelectric conversion region of the CCD unit correspondingly overlap part of a second photoelectric conversion region of the InGaAs photodiode unit when seen in plan view.

대표청구항 ▼

1. A semiconductor device comprising:a first back-illuminated semiconductor image pickup element, having a front and a back and a first photosensitive region which is closer to said front than said back thereof; and a second semiconductor image pickup element also having a front and a back and a sec

1. A semiconductor device comprising:a first back-illuminated semiconductor image pickup element, having a front and a back and a first photosensitive region which is closer to said front than said back thereof; and a second semiconductor image pickup element also having a front and a back and a second photosensitive region which is closer to said front than back thereof, said second semiconductor image pickup element being made of a semiconductor material different from that of said first back-illuminated semiconductor image pickup element, wherein said first back-illuminated semiconductor image pickup element and said second semiconductor image pickup element are secured such that respective fronts of said first back-illuminated semiconductor image pickup element and said second semiconductor image pickup element are closer to each other than their respective backs; wherein mutually opposite faces of said first back-illuminated semiconductor image pickup element and said second semiconductor image pickup element are adhered via at least three or more bumps; wherein said first back-illuminated semiconductor image pickup element comprises a shift register as formed over said first back-illuminated semiconductor image pickup element; wherein said shift register is electrically connected via said bumps to said second semiconductor image pickup element, and that a signal from said second semiconductor image pickup element is read by driving said shift register; and wherein said first back-illuminated semiconductor image pickup element is made of a wider energy band gap material than that of said second semiconductor image pickup element, the wider energy band gap material forming a thin shape portion for receiving light. 2. The semiconductor device as recited in claim 1, characterized in that mutually opposite faces of said first back-illuminated semiconductor image pickup element and said second semiconductor image pickup element are adhered via a resin.3. The semiconductor device as recited in claim 1, characterized in that said first back-illuminated semiconductor image pickup element contains Si.4. The semiconductor device as recited in claim 3, characterized in that said second semiconductor image pickup element contains a compound semiconductor.5. The semiconductor device as recited in claim 4, characterized in that said compound semiconductor includes InGaAs.6. The semiconductor device as recited in claim 1, characterized in that a cooler is in contact with a face of the second semiconductor image pickup element on the opposite side to said first back-illuminated semiconductor image pickup element.7. The semiconductor device as recited in claim 6, characterized in that:said first back-illuminated semiconductor image pickup element and said second semiconductor image pickup element partly overlap; and a substrate containing the same material as said second semiconductor image pickup element is contacted with a region at of said first back-illuminated semiconductor image pickup element, wherein this region does not overlap said second semiconductor image pickup element.