초록 ▼

The present invention provides a solid-state imaging device comprising: a transparent substrate transmitting light therethrough; a first chip including a solid-state imaging element having a light receiving portion; a first resin providing airtight sealing between the first chip and the transparent

The present invention provides a solid-state imaging device comprising: a transparent substrate transmitting light therethrough; a first chip including a solid-state imaging element having a light receiving portion; a first resin providing airtight sealing between the first chip and the transparent substrate; a second chip opposite to the transparent substrate with respect to the first chip; and second resin die bonding the second chip to the first chip, wherein the first resin and the second resin are made of the same material.

대표청구항 ▼

1. A solid-state imaging device, comprising:a transparent substrate transmitting light therethrough; a first chip having sides, a top portion, and a periphery including a solid-state imaging element having a light receiving portion; a first resin providing airtight sealing between the first chip and

1. A solid-state imaging device, comprising:a transparent substrate transmitting light therethrough; a first chip having sides, a top portion, and a periphery including a solid-state imaging element having a light receiving portion; a first resin providing airtight sealing between the first chip and the transparent substrate; a second chip opposite to the transparent substrate with respect to the first chip; and a second resin die bonding the second chip to the first chip, wherein the first resin and the second resin are made of the same material, and wherein the airtight sealing of the first resin is formed along the periphery of the first chip so as to cover the sides of said first chip, edge portions of the top portion of said first chip, and gaps between said first chip and the transparent substrate.2. A solid-state imaging device according to claim 1, wherein the second chip includes a processing circuit for processing a signal converted by the solid-state imaging element.3. A solid-state imaging device according to claim 1, wherein the first chip further includes a protruding electrode electrically connecting the solid-state imaging element included in the first chip and the transparent substrate together.4. A solid-state imaging device according to claim 1, wherein the light receiving portion is opposed to the transparent substrate.5. A method for producing a solid-state imaging device, comprising the steps of:mounting a first chip on a transparent substrate transmitting light therethrough, the first chip including a solid-state imaging element having a light receiving portion, sides, a top portion, and a periphery; placing a mask, which includes a recess portion for housing the first chip therein, a first opening, and a second opening, on the transparent substrate, such that the first chip is housed in the recess portion and prevents passage between the first and second openings, and thereafter injecting the same resin through the first and second openings to form first and second resins such that the first resin provides airtight sealing between the first chip and the transparent substrate and the second resin is separated from the first resin; die bonding the second chip to the first chip using the second resin; and curing each of the first resin and the second resin after die bonding of the second chip, wherein the airtight sealing of the first resin is formed along the periphery of the first chip so as to cover the sides of said first chip, edge portions of the top portion of said first chip, and gaps between said first chip and the transparent substrate. 6. A mask covering a chip mounted on a transparent substrate, the chip having sides, a top portion, and a periphery, the mask comprising:a recess portion for housing the chip therein; a first opening through which a first resin for providing airtight sealing between the chip and the transparent substrate is injected into the recess portion; and a second opening through which a second resin is injected so as to be separated from the first resin, wherein the chip prevents passage between the first and second openings and wherein the airtight sealing of the first resin is formed along the periphery of the first chip so as to cover the sides of said first chip, edge portions of the top portion of said first chip, and gaps between said first chip and the transparent substrate. 7. A solid-state imaging device according to claim 1, wherein the second resin is formed between the top portion of the first chip and the bottom portion of the second chip.8. The method for producing a solid-state imaging device as recited in claim 5, wherein the step of die bonding the second chip to the first chip using the second resin includes forming said second resin between the top portion of said first chip and the bottom portion of said second chip.9. The mask as recited in claim 6, wherein the second resin is formed between the top portion of the first chip and the bottom portion of the second chip.