[특허]Method for leveling and coating a substrate and an article formed thereby

[미국특허] Method for leveling and coating a substrate and an article formed thereby 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	C23C-014/34 B05D-003/02
출원번호	US-0833036 (2001-04-11)
발명자 / 주소	Gabriele, Alfred M. Dragone, Peter Avissar, Jacob Coxon, Timothy
출원인 / 주소	Metalbond Technologies, LLC
대리인 / 주소	Salter &
인용정보	피인용 횟수 : 4 인용 특허 : 51

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A method for providing a level surface onto which a metallic coating may be applied is provided. Articles formed using the method are also provided. The method involves leveling the surface of a substrate by applying an electrophoresis polymeric coating followed by a physical vapor deposition of a m

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1. A method of coating a substrate, comprising:providing a substrate having a surface; forming a polymeric layer on the surface of the substrate by electrophoretically applying a layer of a polymeric precursor to at least a portion of the surface; polymerizing the polymeric precursor to form a polymerized layer; and applying a metal coating to at least a portion of the polymerized layer; wherein the metal coating is applied under sub-atmospheric conditions, and wherein the step of forming the polymerized layer includes elevating the temperature of the polymeric precursor to a temperature of at least about 320° F. 2. The method of claim 1, wherein the polymeric precursor is selected from the group consisting of acrylics, epoxies, urethanes, and combinations thereof.3. The method of claim 1, wherein the substrate is porous, and further comprising leveling the surface of the substrate before the step of applying the metal coating.4. The method of claim 3, wherein the metal coating is applied using a physical vapor deposition method.5. The method of claim 4, further comprising the step of removing a portion of the polymerized layer before applying the metallic coating.6. The method of claim 5, further comprising cleaning at least the polymerized layer before the step of removing a portion of the polymerized layer.7. The method of claim 4, wherein the metal coating is applied in a pressure range of about 5×10?4 millitorr to about 2×10?3 millitorr.8. The method of claim 4, wherein the metal coating is applied by evaporation.9. The method of claim 1, further comprising maintaining the polymeric precursor at the temperature for at least about 12 minutes.10. A method of coating a surface comprising:providing a substrate; coating at least a portion of the substrate with a layer of an electrophoretically applied polymeric precursor; polymerizing the polymeric precursor to form a first polymeric coating; and elevating the temperature of the polymeric coating to at least about 400° F. for at least about 6 minutes. 11. The method of claim 10, further comprising applying a layer of metal over at least a portion of the polymeric coating.12. The method of claim 11, further comprising applying a second polymeric coating over the layer of metal.13. A method of coating a substrate, comprising:providing a substrate having a porous surface; forming a polymeric layer on the surface of the substrate by electrophoretically applying a layer of a polymeric precursor to at least a portion of the surface; polymerizing the polymeric precursor to farm a polymerized layer; and applying a metal coating to at least a portion of the polymerized layer; wherein the metal coating is applied under sub-atmospheric conditions; and wherein the surface of the substrate is leveled before the step of applying the metal coating. 14. The method of claim 13, wherein the step of forming the polymerized layer includes elevating the temperature of the polymeric precursor to a temperature of at least about 320° F.15. The method of claim 14, further comprising maintaining the polymeric precursor at the temperature for at least about 12 minutes.16. The method of claim 13, wherein the polymeric precursor is selected from the group consisting of acrylics, epoxies, urethanes, and combinations thereof.17. The method of claim 13, wherein the metal coating is applied using a physical vapor deposition method.18. The method of claim 13, further comprising the step of removing a portion of the polymerized layer before applying the metal coating.19. The method of claim 18, further comprising cleaning at least the polymerized layer before the step of removing a portion of the polymerized layer.20. The method of claim 13, wherein the metal coating is applied in a pressure range of about 5×10?4 millitorr to about 2×10?5 millitorr.21. The method of claim 13, wherein the metal coating is applied by evaporation.

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[미국특허] Method for leveling and coating a substrate and an article formed thereby 원문보기

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