초록 ▼

A two-layer copper polyimide substrate includes a modified layer on the surface of a polyimide film having a thickness of not more than 200 Å, and preferably not less than 50 Å, as evaluated by a method by dyeing a section thereof with a silver nitrate aqueous solution and observing it by a transmis

A two-layer copper polyimide substrate includes a modified layer on the surface of a polyimide film having a thickness of not more than 200 Å, and preferably not less than 50 Å, as evaluated by a method by dyeing a section thereof with a silver nitrate aqueous solution and observing it by a transmission electron microscope (TEM). A metal seed layer is formed on the polyimide film surface, followed by forming a copper layer thereon by copper electroplating or copper electroless plating or a combination of the both, providing a two-layer copper polyimide substrate in which any of an initial adhesion, a heat resistant adhesion after standing in air at 150° C. for 168 hours, and a PCT adhesion after PCT test at 121° C. and at a humidity of 95% under 2 atmospheres for 100 hours are 400 N/m or more.

대표청구항 ▼

1. A two-layer copper polyimide substrate comprising at least a polyimide film, a single metal seed layer formed directly on the polylmide film, and a copper layer consisting of copper formed on the metal seed layer, wherein the surface of the polyimide film contacted by the metal seed layer include

1. A two-layer copper polyimide substrate comprising at least a polyimide film, a single metal seed layer formed directly on the polylmide film, and a copper layer consisting of copper formed on the metal seed layer, wherein the surface of the polyimide film contacted by the metal seed layer includes a polyimide modified layer having a thickness of not more than 200 Å as evaluated by the silver nitrate dyeing method, wherein the adhesion strength as evaluated by at least one of an initial adhesion, a heat resistant adhesion after standing in air at 150° C. for 168 hours, and a PCT adhesion after PCT test at 121° C. and at a humidity of 95% under 2 atmospheres for 100 hours is 400 N/m or more with a thickness of the copper layer of copper of 8 μm.2. The two-layer copper polyimide substrate according to claim 1, wherein the metal seed layer consists of at least one metal selected from the group consisting of nickel, chromium, and an alloy thereof.3. The two-layer copper polyimide substrate according to claim 1 or 2, wherein the polyimide film is one containing pyromelltic acid dianhydide (PMDA) and 4,4′-diaminodiphenyl ether (ODA) as major components, or one containing a component comprising containing pyromelltic acid dianhydride (PMDA) and 4,4′-diaminophenylether (ODA) and a component comprising biphenyltetracarboxylic acid dianhydride (BPDA) and 4,4′-diaminodiphenyl ether (ODA) as major components.4. The two-layer copper polyimide substrate according to claim 1 or 2, wherein the polyimide modified layer has a thickness of not less than 50 Å as evaluated by the silver nitrate dyeing method.5. The two-layer copper polyimide substrate according to claim 1 or claim 2, wherein the polyimide modified layer is produced by plasma treatment, corona discharge, or wet treatment of the polyimide film.