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Three dimensional scanning camera 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01B-011/24
출원번호 US-0800319 (2004-03-11)
발명자 / 주소
  • Freifeld, Daniel
출원인 / 주소
  • Visicon Inspection Technologies, LLC
대리인 / 주소
    Wiggin and Dana LLP
인용정보 피인용 횟수 : 31  인용 특허 : 18

초록

A system for measuring the spatial dimensions of a three-dimensional object employs a lens and at least two detectors. The combination of which defines two or more object planes. The combination of the lens and the detectors define an optical axis that is normal to the object planes and passes throu

대표청구항

1. A system for measuring the spatial dimensions of a three-dimensional object positioned on an object plane, comprising:a light source for emitting wavelengths of light, said light source being positioned so as to direct said wavelengths of light at said object without any intermediate structures t

이 특허에 인용된 특허 (18)

  1. Yanagisawa Munehisa (Gunma-ken JPX), Apparatus for measuring surface shape.
  2. Kelderman Herman F. (Berkeley CA) Fein Michael E. (Mountain View CA) Loh Alan E. (Sunnyvale CA) Adams Arnold (Goleta CA) Neukermans Armand P. (Palo Alto CA), Confocal measuring microscope with automatic focusing.
  3. Scheruebl, Thomas; Czarnetzki, Norbert, Confocal microscopic device.
  4. Strater Hans-Dieter (Frankfurt am Main DEX) Gross Daniel (Carouge CHX) Jauch Karl M. (Le Lignon CHX), Device for measuring distances using an optical element of large chromatic aberration.
  5. Freifeld Daniel, High precision three dimensional mapping camera.
  6. Svetkoff Donald J. ; Rohrer Donald K. ; Noblett David A. ; Jackson Robert L., Method and system for triangulation-based, 3-D imaging utilizing an angled scanning beam of radiant energy.
  7. Picard Bernard (Saint Martin D\Heres FRX), Method for the scanning confocal light-optical microscopic and indepth examination of an extended field and devices for.
  8. Gross Daniel (Carouge CHX) Dhne Claus (Onex CHX), Method of and apparatus for determining the position of a device relative to a reference.
  9. Freifeld Daniel, Microscope illuminator for cylindrical objects.
  10. Sirat Gabriel Y.,ILX ; Malet Yann,FRX, Optical ball grid array inspection system.
  11. Freifeld Daniel, Optical coordinate measuring machines and optical touch probes.
  12. Horijon Joseph L. (Eindhoven NLX) Velzel Christiaan H. F. (Eindhoven NLX) Kooijman Cornelis S. (Eindhoven NLX), Optical height detector with coaxial irradiation and image axes and plural detectors spaced along the image axis.
  13. Hori Kenji (Tokyo JPX), Optical three-dimensional shape measuring apparatus.
  14. Fowler Guy Richard John,GBX ; Flockhart Christopher Peter,GBX, Scanning arrangement and method.
  15. Bieman Leonard H. (Farmington Hills MI), Scanning phase measuring method and system for an object at a vision station.
  16. Hallerman Gregory R. ; Ludlow Jonathan E. ; Stern Howard K., System and method for three-dimensional inspection using patterned light projection.
  17. Rioux Marc (Ottawa CAX), Three dimensional color imaging.
  18. Wakai Hideyuki (Hiratsuka JPX) Suzuki Toru (Hiratsuka JPX) Terada Keiji (Hiratsuka JPX) Moriya Masato (Hiratsuka JPX) Ando Manabu (Hiratsuka JPX), Three-dimensional image measuring device.

이 특허를 인용한 특허 (31)

  1. Park, Allen; Chang, Ellis, Alteration for wafer inspection.
  2. Hoenke, Mark S.; Hulbert, Jack A.; Lehman, James R.; Menkveld, Todd K.; Momber, Gregory J.; Smith, Thomas D., Apparatus and method for determining the orientation of an object such as vehicle wheel alignment.
  3. Leung, Wing Hong; Deng, Jiangwen; Zhang, Zhuanyun, Apparatus and method for inspecting an object with increased depth of field.
  4. Cao, Hong Xi; Liao, Jen Chuen; Hsu, Ricky; Cheng, Sheng Jang; Horng, Ji Bin, Apparatus and method for measuring displacement, surface profile and inner radius.
  5. Freifeld, Daniel; Roberts, John; Burnett, John B.; Linscott, George, Automated stent inspection system.
  6. Kurada, Satya; Babulnath, Raghav; Ng, Kwok; Gao, Lisheng, Based sampling and binning for yield critical defects.
  7. Choi, SunYong; Pae, YeonHo; Chang, Ellis, Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer.
  8. Kulkarni, Ashok V.; Chen, Chien-Huei (Adam), Design-based inspection using repeating structures.
  9. Huang, Junqing; Zhang, Yong; Chen, Stephanie; Luo, Tao; Gao, Lisheng; Wallingford, Richard, Detecting defects on a wafer.
  10. Lang, Jun; Chen, Kan; Gao, Lisheng; Huang, Junqing, Detecting defects on a wafer.
  11. Wu, Kenong; Gao, Lisheng; Chen, Grace Hsiu-Ling; Shortt, David W., Detecting defects on a wafer using defect-specific and multi-channel information.
  12. Wu, Kenong; Wu, Meng-Che; Gao, Lisheng, Detecting defects on a wafer using defect-specific information.
  13. Chu, Xing; Lauber, Jan A.; Runyon, J. Rex, Detecting defects on a wafer using template image matching.
  14. Ramachandran, Vijayakumar, Determining a position of inspection system output in design data space.
  15. Chang, Ellis; Van Riet, Michael J.; Park, Allen; Zafar, Khurram; Bhattacharyya, Santosh, Determining design coordinates for wafer defects.
  16. Kulkarni, Ashok V.; Chen, Chien-Huei Adam, Dynamic care areas.
  17. Jayaraman, Thirupurasundari; Babulnath, Raghav, Dynamic design attributes for wafer inspection.
  18. Que,Ling Hua; Yuan,Zhong Kui; Xu,Wei; Xin,Xiao Bo; Lin,Kuei Yang, Method for verifying scan precision of a laser measurement machine.
  19. Peterson, Ingrid B.; Yum, Ed, Methods and systems for detecting defects in a reticle design pattern.
  20. Park, Allen; Rose, Peter; Chang, Ellis; Duffy, Brian; McCord, Mark; Abbott, Gordon, Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions.
  21. Zafar, Khurram; Kekare, Sagar; Chang, Ellis; Park, Allen; Rose, Peter, Methods and systems for utilizing design data in combination with inspection data.
  22. Bhaskar, Kris; McCord, Mark; Bhattacharyya, Santosh; Liang, Ardis; Wallingford, Richard; Altendorfer, Hubert; Maayah, Kais, Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer.
  23. De Sloovere, Kris; Beghuin, Didier; Verhaert, Koen, Non contact wheel alignment sensor and method.
  24. De Sloovere, Kris; Beghuin, Didier; Verhaert, Koen, Non contact wheel alignment sensor and method.
  25. De Sloovere, Kris; Beghuin, Didier; Verhaert, Koen, Non contact wheel alignment sensor and method.
  26. Ohren, Dennis L.; Voges, Christopher J.; Rotering, Andrew E., On-axis focus sensor and method.
  27. Rosengaus,Eliezer, Resolution enhancement for macro wafer inspection.
  28. Watanabe,Kenji; Otaka,Tadashi; Nakagaki,Ryo; Shishido,Chie; Takahashi,Masakazu; Toyoshima,Yuya, Sample dimension-measuring method and charged particle beam apparatus.
  29. Luo, Tao; Zhang, Yong; Chen, Stephanie, Segmentation for wafer inspection.
  30. Freifeld, Daniel; Burnett, John B., System and method to illuminate and image the inside diameter of a stent.
  31. Mulligan, Vincent P., Z-axis optical detection of mechanical feature height.
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