초록 ▼

This disclosure describes one-chip micro-integrated optoelectronic sensors and methods for fabricating and using the same. The sensors may include an optical emission source, optical filter and a photodetector fabricated on the same transparent substrate using the same technological processes. Optic

This disclosure describes one-chip micro-integrated optoelectronic sensors and methods for fabricating and using the same. The sensors may include an optical emission source, optical filter and a photodetector fabricated on the same transparent substrate using the same technological processes. Optical emission may occur when a bias voltage is applied across a metal-insulator-semiconductor Schottky contact or a p-n junction. The photodetector may be a Schottky contact or a p-n junction in a semiconductor. Some sensors can be fabricated on optically transparent substrate and employ back-side illumination. In the other sensors provided, the substrate is not transparent and emission occurs from the edge of a p-n junction or through a transparent electrode. The sensors may be used to measure optical absorption, optical reflection, scattering or fluorescence. The sensors may be fabricated and operated to provide a selected spectrum of light emitted and a multi-quantum well heterostructure may be fabricated to filter light reaching the photodetector.

대표청구항 ▼

1. An optoelectronic device, comprising:a first ohmic contact on a first surface of a silicon wafer and a second ohmic contact on a first area of a second surface of the silicon wafer; an aluminum nitride layer deposited on a second area of the second surface of the silicon wafer, a portion of the a

1. An optoelectronic device, comprising:a first ohmic contact on a first surface of a silicon wafer and a second ohmic contact on a first area of a second surface of the silicon wafer; an aluminum nitride layer deposited on a second area of the second surface of the silicon wafer, a portion of the aluminum nitride having diffused into the silicon layer to form a p-n junction in the silicon wafer; a first layer of gallium nitride deposited on the aluminum nitride layer; a layer of indium gallium nitride deposited on the first layer of gallium nitride, the layer of indium gallium nitride having a top surface; a second layer of gallium nitride deposited on a first area of the top surface of the indium gallium nitride layer and an ohmic contact on the second layer of gallium nitride; and a second ohmic contact on a second area of the top surface of the layer of indium gallium nitride. 2. The device of claim 1 wherein the thickness of the first and the second gallium nitride layers and the indium gallium nitride layer is in the range from about 0.5 to about 1 micrometers.3. The device of claim 1 further comprising a multi-quantum well heterostructure between the first layer of gallium nitride and the silicon wafer.4. An optoelectronic device, comprising:a silicon substrate; a layer of semiconductor deposited on the silicon substrate; an ohmic contact with a first area of the layer of semiconductor; a metal-insulator layer on a second area of the layer of semiconductor to form an M-I-S Schottky contact; a layer of a transparent electrode on the metal-insulator layer to form a metal-insulator-semiconductor Schottky contact on the second area of the layer of semiconductor, the layer of transparent electrode having an ohmic contact thereon; a multi-quantum well heterostructure on a third area of the layer of semiconductor; a gallium nitride layer deposited on the multi-quantum well heterostructure and having an ohmic contact; and a layer of a transparent electrode deposited on a part of the layer of gallium nitride, the layer of transparent electrode having an ohmic contact. 5. The device of claim 4 wherein the transparent electrode is comprised of fluorine-doped tin oxide.