IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0201268
(2002-07-24)
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우선권정보 |
JP-0223433 (2001-07-24); JP-0282423 (2001-09-17); JP-0282424 (2001-09-17) |
발명자
/ 주소 |
- Shimoda, Tatsuya
- Utsunomiya, Sumio
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
77 인용 특허 :
5 |
초록
▼
A transfer method comprising a step of forming a plurality of transferred bodies on a transfer origin substrate, and a step of applying energy to partial regions corresponding to the transferred bodies to be transferred, and transferring these transferred bodies corresponding to the partial regions
A transfer method comprising a step of forming a plurality of transferred bodies on a transfer origin substrate, and a step of applying energy to partial regions corresponding to the transferred bodies to be transferred, and transferring these transferred bodies corresponding to the partial regions onto a transfer destination substrate. A plurality of transferred bodies such as devices or circuits that are to be disposed on a transfer destination substrate with spaces therebetween can be manufactured integrated together on a transfer origin substrate, and hence compared with the case that the transferred bodies are formed on the transfer destination substrate directly, the amount of materials used in the manufacture of the transferred bodies can be reduced, the area efficiency can be greatly improved, and a transfer destination substrate on which a large number of devices or circuits are disposed in scattered locations can be manufactured efficiently and cheaply.
대표청구항
▼
1. A transfer method for transferring a transferred body, comprising:forming a transfer layer on a transfer origin substrate; forming a plurality of transferred bodies on the transfer layer, each of the plurality of transferred bodies including a circuit device; applying energy to a partial region o
1. A transfer method for transferring a transferred body, comprising:forming a transfer layer on a transfer origin substrate; forming a plurality of transferred bodies on the transfer layer, each of the plurality of transferred bodies including a circuit device; applying energy to a partial region of the transfer layer corresponding to each of said transferred bodies to be transferred; and transferring said transferred bodies corresponding to the partial region onto a transfer destination substrate. 2. The transfer method according to claim 1, further comprising dividing the plurality of said transferred bodies into a plurality of regions, and the transferring of said transferred bodies comprising applying said energy to one or more of said plurality of regions.3. The transfer method according to claim 1, the transferring of said transferred bodies onto said transfer destination substrate comprising making said transfer origin substrate face the transfer destination substrate, and forming an adhesive layer on at least either said said transferred bodies or said transfer destination substrate.4. The transfer method according to claim 1, further comprising:before the forming of said transferred bodies, forming a peeling layer on said transfer origin substrate; and after the forming of said transferred bodies, dividing at least either said transferred bodies or said peeling layer into a plurality of regions. 5. The transfer method according to claim 1, transferring of said transferred bodies onto said transfer destination substrate comprising irradiating light as said energy.6. The transfer method according to claim 1, further comprising:shifting the relative position between nozzles that discharge a material and said substrate; and discharging said material from said nozzles. 7. The transfer method according to claim 1, the forming of said transferred bodies comprising forming region dividing sections that guide said transferred bodies during said transfer such that said transferred bodies are divided along outer peripheries of said partial regions.8. The transfer method according to claim 7, the forming of said transferred bodies further comprising forming a projecting structure that demarcates the regions of said transferred bodies as said region dividing sections.9. The transfer method according to claim 7, the forming of said transferred bodies further comprising forming grooves at boundaries between the regions of said transferred bodies as said region dividing sections.10. The transfer method according to claim 1, the forming of said transferred bodies comprising forming devices or circuits having the same constitution as one another as said plurality of said transferred bodies.11. The transfer method according to claim 1, the forming of said transferred bodies comprising forming devices or circuits having a different constitution to one another as said plurality of said transferred bodies.12. A method of manufacturing thin film devices comprising the transfer method according to claim 1, the thin film devices including thin film devices as said transferred bodies.13. A method of manufacturing integrated circuits comprising the transfer method according to claim 1, the integrated circuits including integrated circuits as said transferred bodies.14. A method of manufacturing a circuit board, comprising the transfer method according to claim 1.15. A method of manufacturing an electro-optical apparatus, comprising the transfer method according to claim 1.16. A transfer method for transferring a transferred body, comprising:forming a transfer layer on a transfer origin substrate; forming a plurality of transferred bodies on the transfer layer, each of the plurality of transferred bodies including a circuit device; applying energy to partial regions of the transfer layer corresponding to said transferred bodies to be transferred; and transferring said transferred bodies corresponding to the partial regions onto transfer destination substrates; the transferring onto said transfer destination substrates comprising, after transferring said transferred bodies onto one of said transfer destination substrates, repeating the applying of energy to other partial regions corresponding to other said transferred bodies on said transfer origin substrate, and transferring said other said transferred bodies corresponding to the other partial regions onto other said transfer destination substrates. 17. A transfer method for transferring transferred bodies, comprising:forming a transfer layer on a transfer origin substrate; forming a plurality of transferred bodies on the transfer layer, each of the plurality of transferred bodies including a circuit device; transferring said transferred bodies from said transfer origin substrate onto an intermediate transfer substrate; and transferring said transferred bodies from said intermediate transfer substrate onto a transfer destination substrate; at least either the transferring of said transferred bodies onto said intermediate transfer substrate or the transferring of said transferred bodies onto said transfer destination substrate, comprising applying energy to partial regions of the transfer layer corresponding to said transferred bodies to be transferred, and transferring said transferred bodies formed in the partial regions. 18. The transfer method according to claim 17, further comprising:dividing the plurality of said transferred bodies into a plurality of regions, and at least either the transferring onto said intermediate transfer substrate or the transferring onto said transfer destination substrate comprising applying said energy to one or more of said plurality of regions. 19. The transfer method according to claim 17, the transferring of said transferred bodies onto said intermediate transfer substrate comprising making said transfer origin substrate face said intermediate transfer substrate, and forming an adhesive layer on at least either said transferred bodies or said intermediate transfer substrate.20. The transfer method according to claim 17, the transferring of said transferred bodies onto said transfer destination substrate comprising making said intermediate transfer substrate face said transfer destination substrate, and forming an adhesive layer on at least either said transferred bodies or said transfer destination substrate.21. The transfer method according to claim 17, further comprising:before the forming of said transferred bodies, forming a peeling layer on said transfer origin substrate; and after the forming of said transferred bodies, dividing at least either said transferred bodies or said peeling layer into said plurality of regions. 22. The transfer method according to claim 17, at least either the transferring onto said intermediate transfer substrate or the transferring onto said transfer destination substrate comprising irradiating light is as said energy.23. The transfer method according to claim 17, further comprising:shifting the relative position between nozzles that discharge a material and said substrate; and discharging said material from said nozzles. 24. The transfer method according to claim 17, the forming of said transferred bodies comprising forming region dividing sections that guide said transferred bodies during said transfer such that said transferred bodies are divided along outer peripheries of said partial regions.25. The transfer method according to claim 24, the forming of said transferred bodies further comprising forming a projecting structure that demarcates the regions of said transferred bodies as said region dividing sections.26. The transfer method according to claim 24, the forming of said transferred bodies further comprising forming grooves at boundaries between the regions of said transferred bodies as said region dividing sections.27. The transfer method according to claim 17, the forming of said transferred bodies comprising forming devices or circuits having the same constitution as one another as said transferred bodies.28. The transfer method according to claim 17, the forming of said transferred bodies comprising forming devices or circuits having a different constitution to one another as said transferred bodies.29. A method of manufacturing thin film devices comprising the transfer method according to claim 17, the thin film devices including thin film devices as said transferred bodies.30. A method of manufacturing integrated circuits comprising the transfer method according to claim 17, the integrated circuits including integrated circuits as said transferred bodies.31. A method of manufacturing a circuit board, comprising the transfer method according to claim 17.32. A method of manufacturing an electro-optical apparatus, comprising the transfer method according to claim 17.33. A transfer method for transferring transferred bodies, comprising:forming a transfer layer on a transfer origin substrate; forming a plurality of transferred bodies on the transfer layer, each of the plurality of transferred bodies including a circuit device; transferring said transferred bodies from said transfer origin substrate onto an intermediate transfer substrate; and transferring said transferred bodies from said intermediate transfer substrate onto transfer destination substrates; at least either the transferring of said transferred bodies onto said intermediate transfer substrate or the transferring of said transferred bodies onto said transfer destination substrates, comprising applying energy to partial regions of the transfer layer corresponding to said transferred bodies to be transferred, and transferring said transferred bodies formed in the partial regions; and the transferring onto said transfer destination substrates comprising, after transferring said transferred bodies onto one of said transfer destination substrates, repeating the applying of energy to other partial regions corresponding to other said transferred bodies on said transfer origin substrate, and transferring said other transferred bodies corresponding to the other partial regions onto another one of said transfer destination substrates. 34. A transfer method for transferring a transferred body, comprising:forming a transfer layer on a transfer origin substrate; forming a plurality of transferred bodies by patterning the transfer layer on the transfer origin substrate; applying energy to a partial region of the transfer layer corresponding to each of said transferred bodies to be transferred; and transferring said transferred bodies corresponding to the partial region onto a transfer destination substrate. 35. A transfer method for transferring a transferred body, comprising:forming a transfer layer on a transfer origin substrate; forming a plurality of transferred bodies by patterning the transfer layer on the transfer origin substrate; and applying energy to partial regions of the transfer layer corresponding to said transferred bodies to be transferred; and transferring said transferred bodies corresponding to the partial regions onto transfer destination substrates; the transferring onto said transfer destination substrates comprising, after transferring said transferred bodies onto one of said transfer destination substrates, repeating the applying of energy to other partial regions corresponding to other said transferred bodies on said transfer origin substrate, and transferring said other said transferred bodies corresponding to the other partial regions onto other said transfer destination substrates.
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