IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0617673
(2003-07-14)
|
우선권정보 |
DE-0014420 (1995-04-19) |
발명자
/ 주소 |
- Kunzel, Hartwig
- Grosskinsky, Theo
|
출원인 / 주소 |
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
|
대리인 / 주소 |
Oblon, Spivak, McClelland, Maier &
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인용정보 |
피인용 횟수 :
25 인용 특허 :
12 |
초록
▼
The invention relates to a vapor barrier for use in cthe thermal insulation of buildings which can be used, in particular, for thermal insulation procedures in new buildings or in the renovation of old buildings. The vapor barrier in accordance with the invention is thereby capable of achieving wate
The invention relates to a vapor barrier for use in cthe thermal insulation of buildings which can be used, in particular, for thermal insulation procedures in new buildings or in the renovation of old buildings. The vapor barrier in accordance with the invention is thereby capable of achieving water vapor exchange under different ambient conditions. This is achieved by using a material which has a water vapor diffusion resistance which is dependent on the ambient humidity and which also has adequate tensile strength and tear resistance.
대표청구항
▼
1. A wall of a building, comprising a film attached to the wall of the building, wherein the film has a water vapor diffusion resistance (sd-value) at a relative humidity of an atmosphere surrounding the vapor retarder in the region of 30% to 50% of 2 to 5 meters diffusion-equivalent air layer thick
1. A wall of a building, comprising a film attached to the wall of the building, wherein the film has a water vapor diffusion resistance (sd-value) at a relative humidity of an atmosphere surrounding the vapor retarder in the region of 30% to 50% of 2 to 5 meters diffusion-equivalent air layer thickness, and, at a relative humidity in the region of 60% to 80% which is <1 meter diffusion-equivalent air layer thickness.2. The wall of the building according to claim 1, which further comprises a carrier material attached to the film.3. The wall of the building according to claim 2, wherein the carrier material has a water vapor diffusion resistance which is less than the water vapor diffusion resistance of the film.4. The wall of the building according to claim 2, wherein the carrier material is selected from the group consisting of particle board, chip board, oriented strand board, plywood paneling, gypsum board, fiber reinforced gypsum board, fiber board, cement board, cementitious wood wool board, calcium silica board, fiber insulation batts, fiber insulation slabs, foam insulation slabs, wall paper, and cloth.5. The wall of the building according to claim 2, wherein the carrier material is a fiber-reinforced cellulose material.6. The wall of the building according to claim 1, further comprising at least two layers of a carrier material, wherein the film is sandwiched between two layers of carrier material, the two layers of carrier material having a water vapor diffusion resistance which is less than the water vapor diffusion resistance of the film.7. The wall of the building according to claim 1, wherein the film comprises polyamide.8. The wall of the building according to claim 7, wherein the polyamide is selected from the group consisting of polyamide 6, polyamide 4, and polyamide 3.9. The wall of the building according to claim 8, wherein the polyamide is polyamide 6.10. The wall of the building according to claim 1, wherein the film has a thickness of 10 μm to 2 mm.11. The wall of the building according to claim 1, wherein the film has a thickness of 20 μm to 100 μm.12. The wall of the building according to claim 1, wherein the film comprises a pattern.13. The wall of the building according to claim 12, wherein the film comprises a printed color pattern.14. A roof of a building, comprising a film attached to the roof of the building, wherein the film has a water vapor diffusion resistance (sd-value) at a relative humidity of an atmosphere surrounding the vapor retarder in the region of 30% to 50% of 2 to 5 meters diffusion-equivalent air layer thickness, and, at a relative humidity in the region of 60% to 80% which is <1 meter diffusion-equivalent air layer thickness.15. The roof of a building according to claim 14, which further comprises a carrier material attached to the film.16. The roof of a building according to claim 15, wherein the carrier material has a water vapor diffusion resistance which is less than the water vapor diffusion resistance of the film.17. The roof of a building according to claim 15, wherein the carrier material is selected from the group consisting of particle board, chip board, oriented strand board, plywood paneling, gypsum board, fiber reinforced gypsum board, fiber board, cement board, cementitious wood wool board, calcium silica board, fiber insulation batts, fiber insulation slabs, foam insulation slabs, wall paper, and cloth.18. The roof of a building according to claim 15, wherein the carrier material is a fiber-reinforced cellulose material.19. The roof of a building according to claim 14, further comprising at least two layers of a carrier material, wherein the film is sandwiched between two layers of carrier material, the two layers of carrier material having a water vapor diffusion resistance which is less than the water vapor diffusion resistance of the film.20. The roof of a building according to claim 14, wherein the film comprises polyamide.21. The roof of a building according to claim 20, wherein the polyamide is selected from the group consisting of polyamide 6, polyamide 4, and polyamide 3.22. The roof of a building according to claim 21, wherein the polyamide is polyamide 6.23. The roof of a building according to claim 14, wherein the film component has a thickness of 10 μm to 2 mm.24. The roof of a building according to claim 14, wherein the film component has a thickness of 20 μm to 100 μm.25. The roof of a building according to claim 14, wherein the film comprises a pattern.26. The roof of a building according to claim 14, wherein the film comprises a printed color pattern.27. The roof of a building according to claim 14, wherein the film is positioned between at least two rafters of said roof of the building.28. A building structure comprising the wall of a building according to claim 1.29. A building structure comprising the wall of a building according to claim 14.30. A method of constructing a wall of a building, comprising applying to the wall, a film having a water vapor diffusion resistance (sd-value) at a relative humidity of an atmosphere surrounding the vapor retarder in the region of 30% to 50% of 2 to 5 meters diffusion-equivalent air layer thickness, and, at a relative humidity in the region of 60% to 80% which is <1 meter diffusion-equivalent air layer thickness.31. The method according to claim 30, wherein the film is attached to a carrier material.32. The method according to claim 31, wherein the carrier material has a water vapor diffusion resistance which is less than the water vapor diffusion resistance of the film.33. The method according to claim 31, wherein the carrier material is selected from the group consisting of particle board, chip board, oriented strand board, plywood paneling, gypsum board, fiber reinforced gypsum board, fiber board, cement board, cementitious wood wool board, calcium silica board, fiber insulation batts, fiber insulation slabs, foam insulation slabs, wall paper, and cloth.34. The method according to claim 31, wherein the carrier material is a fiber-reinforced cellulose material.35. The method according to claim 30, further comprising at least two layers of a carrier material, wherein the film is sandwiched between two layers of carrier material, the two layers of carrier material having a water vapor diffusion resistance which is less than the water vapor diffusion resistance of the film.36. The method according to claim 30, wherein the film comprises polyamide.37. The method according to claim 36, wherein the polyamide is selected from the group consisting of polyamide 6, polyamide 4, and polyamide 3.38. The method according to claim 37, wherein the polyamide is polyamide 6.39. The method according to claim 30, wherein the film component has a thickness of 10 μm to 2 mm.40. The method according to claim 30, wherein the film component has a thickness of 20 μm to 100 μm.41. The method according to claim 30, wherein the film comprises a pattern.42. The method according to claim 30, wherein the film comprises a printed color pattern.43. A method of constructing a roof of a building, comprising applying to the roof, a film having a water vapor diffusion resistance (sd-value) at a relative humidity of an atmosphere surrounding the vapor retarder in the region of 30% to 50% of 2 to 5 meters diffusion-equivalent air layer thickness, and, at a relative humidity in the region of 60% to 80% which is <1 meter diffusion-equivalent air layer thickness.44. The method according to claim 43, wherein the film is attached to a carrier material.45. The method according to claim 44, wherein the carrier material has a water vapor diffusion resistance which is less than the water vapor diffusion resistance of the film.46. The method according to claim 45, wherein the carrier material is selected from the group consisting of particle board, chip board, oriented strand board, plywood paneling, gypsum board, fiber reinforced gypsum board, fiber board, cement board, cementitious wood wool board, calcium silica board, fiber insulation batts, fiber insulation slabs, foam insulation slabs, wall paper, and cloth.47. The method according to claim 44, wherein the carrier material is a fiber-reinforced cellulose material.48. The method according to claim 43, further comprising at least two layers of a carrier material, wherein the film is sandwiched between two layers of carrier material, the two layers of carrier material having a water vapor diffusion resistance which is less than the water vapor diffusion resistance of the film.49. The method according to claim 43, wherein the film comprises polyamide.50. The method according to claim 49, wherein the polyamide is selected from the group consisting of polyamide 6, polyamide 4, and polyamide 3.51. The method according to claim 50, wherein the polyamide is polyamide 6.52. The method according to claim 43, wherein the film component has a thickness of 10 μm to 2 mm.53. The method according to claim 43, wherein the film component has a thickness of 20 μm to 100 μm.54. The method according to claim 43, wherein the film comprises a pattern.55. The method according to claim 43, wherein the film comprises a printed color pattern.56. The method according to claim 43, wherein the film is applied between at least two rafters of the roof.57. The wall of the building according to claim 1, which further comprises an insulation material between the wall and said film.58. The roof of a building according to claim 4, which further comprises an insulation material between the roof and said film.59. The method according to claim 30, which further comprises installing an insulation material between the wall of a building and said film.60. The method according to claim 43, which further comprises installing an insulation material between the roof of a building and said film.61. A method of insulating a building, comprising installing a film component and an insulation material onto the building, wherein the film component has a water vapor diffusion resistance (sd-value) at a relative humidity of an atmosphere surrounding the vapor retarder in the region of 30% to 50% of 2 to 5 meters diffusion-equivalent air layer thickness, and, at a relative humidity in the region of 60% to 80% which is <1 meter diffusion-equivalent air layer thickness.62. The method of claim 61, wherein the film component is attached to a carrier material.63. The method of claim 62, wherein the carrier material has a water vapor diffusion resistance which is less than the water vapor diffusion resistance of the film.64. The method of claim 61, wherein the film component comprises polyamide.65. The method of claim 64, wherein the polyamide is selected from the group consisting of polyamide 6, polyamide 4, and polyamide 3.66. The method of claim 65, wherein the polyamide is polyamide 6.67. The method of claim 61, wherein the film component has a thickness of 10 μm to 2 mm.68. The method of claim 61, wherein the film component has a thickness of 20 μm to 100 μm.69. The method of claim 61, wherein the installing the film comprises spraying or painting the film component onto the building.70. The method of claim 61, wherein the film component is a formed film.71. The method of claim 70, wherein the film component comprises polyamide.72. The method of claim 71, wherein the polyamide is selected from the group consisting of polyamide 6, polyamide 4, and polyamide 3.73. The method of claim 72, wherein the polyamide is polyamide 3.74. The method of claim 70, wherein the thickness of the formed film is 10 μm to 2 mm.75. The method of claim 70, wherein the thickness of the formed film is 20 μm to 100 μm.76. The method of claim 70, wherein the formed film comprises a pattern.77. The method of claim 70, wherein the formed film comprises a printed color pattern.
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