A thermoelectric module with a simple structure with less breakage by thermal stress is provided. For this purpose, the thermoelectric module includes p-type and n-type thermoelectric elements (13, 14) which are alternately placed, and outer electrodes (15) and inner electrodes (16), which are alter
A thermoelectric module with a simple structure with less breakage by thermal stress is provided. For this purpose, the thermoelectric module includes p-type and n-type thermoelectric elements (13, 14) which are alternately placed, and outer electrodes (15) and inner electrodes (16), which are alternately placed between the thermoelectric elements (13, 14), and at least part of at least either one of the outer electrode (15) or the inner electrode (16) has a shape approximately along an object which exchanges heat with the electrodes (15, 16). The inner electrodes (16) surround an object which exchanges heat with the electrodes (15, 16).
대표청구항▼
1. A thermoelectric module, comprising;at least one first p-type thermoelectric unit which is provided along an object and which comprises a plurality of p-type thermoelectric elements and a first electrode in contact with the plurality of p-type thermoelectric elements; at least one second n-type t
1. A thermoelectric module, comprising;at least one first p-type thermoelectric unit which is provided along an object and which comprises a plurality of p-type thermoelectric elements and a first electrode in contact with the plurality of p-type thermoelectric elements; at least one second n-type thermoelectric unit which is adjacent to the first thermoelectric unit along the object, and which comprises a plurality of n-type thermoelectric elements and a second electrode in contact with the plurality of n-type thermoelectric elements; wherein at least a part of one of the first electrode and the second electrode has a shape which approxiately conforms to a shape of the object such that the first electrode and the second electrode exchange heat with the object. 2. The thermoelectric module according to claim 1, wherein the at least one first thermoelectric unit comprises a plurality of first thermoelectric units, and the at least one second thermoelectric unit comprises a plurality of second thermoelectric units; andwherein the plurality of first thermoelectric units and the plurality of second thermoelectric units alternate along the object. 3. The thermoelectric module according to claim 1, wherein the plurality of p-type thermoelectric elements and the plurality of n-type thermoelectric elements are shaped as at least one of columns, sectors, and rectangular parallelepipeds.4. The thermoelectric module according to claim 1, wherein the first electrode comprises: (i) a bottom plate on which the plurality of p-type thermoelectric elements are mounted, and (ii) a heat transfer plate extending away from the bottom plate; andwherein the second electrode comprises: (i) a bottom plate on which the plurality of n-type thermoelectric elements are mounted, and (ii) a heat transfer plate extending away from the bottom plate. 5. The thermoelectric module according to claim 4, wherein the heat transfer plate of the second electrode comprises an inner heat transfer plate which extends from an inner portion of the bottom plate of the second electrode; andwherein said part of said one of first electrode and the second electrode which approximately conforms to the shape of the object comprises the inner heat transfer plate. 6. The thermoelectric module according to claim 5, wherein the inner heat transfer plate approximately surrounds the object.7. The thermoelectric module according to claim 6, wherein the inner heat transfer plate and the bottom plate of the second electrode comprise a slit, and wherein an inner diameter of the inner heat transfer plate is smaller than an outer diameter of the object.8. The thermoelectric module according to claim 4, wherein at least one of the heat transfer plate of the first electrode and the heat transfer plate of the second electrode comprise a plurality of notches.9. The thermoelectric module according to claim 1, wherein the plurality of p-type thermoelectric elements and the plurality of n-type thermoelectric elements are mounted on the second electrode.10. The thermoelectric module according to claim 1, wherein the first thermoelectric unit and the second thermoelectric unit partially surround the object.11. The thermoelectric module according to claim 1, further comprising a housing which encases the at least one first thermoelectric unit and the at least one second thermoelectric unit.12. The thermoelectric module according to claim 11, wherein the first electrode extends through the housing.13. The thermoelectric module according to claim 11, further comprising a water cooling jacket which surrounds the housing so as to cool the housing when water flows therethrough.14. The thermoelectric module according to claim 11, wherein the object comprises a pipe, and wherein a plurality of fins extend inward from an inner surface of the pipe.15. The thermoelectric module according to claim 11, further comprising a plurality of heat exchange fins extending outward from the housing.16. The thermoelectric module according to claim 15, wherein the object comprises a pipe, and wherein a plurality of fins extend inward from an inner surface of the pipe.17. The thermoelectric module according to claim 1, wherein the first thermoelectric unit comprises a plurality of separated partial first thermoelectric units, and the second thermoelectric unit comprises a plurality of separated partial second thermoelectric units.18. The thermoelectric module according to claim 1, further comprising at least one spring for maintaining contact between the first thermoelectric unit and the second thermoelectric unit.19. The thermoelectric module according to claim 1, further comprising an insulating mold material surrounding the plurality of p-type thermoelectric elements and the plurality of n-type thermoelectric elements.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (2)
Kanichi Kadotani JP; Makio Tsubota JP; Hironori Akiba JP; Tadayuki Hanamoto JP, Temperature control device and method for manufacturing the same.
Yi, Mingqiang; Scullin, Matthew L.; Matus, Gabriel Alejandro; Hilken, Dawn L.; Lee, Chii Guang; Muckenhirn, Sylvain, Arrays of long nanostructures in semiconductor materials and methods thereof.
Yi, Mingqiang; Scullin, Matthew L.; Matus, Gabriel; Hilken, Dawn L.; Lee, Chii Guang; Muckenhirn, Sylvain, Arrays of long nanostructures in semiconductor materials and methods thereof.
Weisse, Jeffrey M.; Reifenberg, John P.; Miller, Lindsay M.; Scullin, Matthew L., Ultra-long silicon nanostructures, and methods of forming and transferring the same.
Akei, Masao; Ignatiev, Kirill M; Jayanth, Nagaraj; Pham, Hung M; Caillat, Jean-Luc M, Vapor compression circuit and method including a thermoelectric device.
Akei, Masao; Ignatiev, Kirill; Jayanth, Nagaraj; Pham, Hung M.; Caillat, Jean-Luc M., Vapor compression circuit and method including a thermoelectric device.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.