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An improved cooling system designed for electronic components such as a central processing unit of a computer with an integrated unit comprising a radiation housing, an absorption housing having a coolant store unit, an absorption layer between the coolant store unit and the electronic component and

An improved cooling system designed for electronic components such as a central processing unit of a computer with an integrated unit comprising a radiation housing, an absorption housing having a coolant store unit, an absorption layer between the coolant store unit and the electronic component and a circulation generation unit which causes a coolant to flow from the coolant store unit to the absorption layer and back to the coolant store unit through a conduit.

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1. An improved cooling system designed for an electronic component comprising:(a) a coolant; and (b) an integrated unit comprising: (i) an absorption housing having a coolant storage unit, the coolant storage unit having a cover for preventing leakage of coolant from the coolant storage unit; (ii) a

1. An improved cooling system designed for an electronic component comprising:(a) a coolant; and (b) an integrated unit comprising: (i) an absorption housing having a coolant storage unit, the coolant storage unit having a cover for preventing leakage of coolant from the coolant storage unit; (ii) a radiation housing having a plurality of radiation sheets; (iii) an absorption layer between the coolant storage unit and the electronic component; and (iv) a circulation generation unit having a brushless DC motor, a motor stator, a rotor separated from the motor stator via the cover, and an impeller which causes the coolant to flow from the coolant storage unit to the radiation housing and back to the coolant storage unit through a conduit. 2. The cooling system of claim 1 wherein the electronic component is selected from the group consisting of a Central Processing Unit (CPU), super power tube, integrated chip (IC) and internet networking master board; and wherein the coolant is a fluid selected from a group consisting of gas, liquid or mixtures thereof.3. The cooling system of claim 2 wherein the fluid is selected from a group consisting of water (H2O), ammonia (NH3), transformer oil, fluorinated organic compounds, ethylene glycol or mixtures thereof.4. The cooling system of claim 1 wherein the absorption layer is formed to have a high heat conductivity, the absorption layer being formed of a material selected from a group consisting of bronze, copper (Cu), red copper tube, aluminum (Al), and alloys thereof, and wherein said absorption layer forms a chassis of the cooling system and is in contact with the electronic component and the coolant.5. The cooling system of claim 4 wherein the absorption layer is a mixture of plastic and copper powder.6. The cooling system of claim 4 wherein the conduit circumnavigates in the integrated unit and connects an inlet and an outlet of the coolant storage unit so that the coolant flowing out of the coolant storage unit and the coolant flowing into the coolant storage unit is in the same direction as the rotation of the impeller.7. The cooling system of claim 1 wherein the absorption layer further comprises at least one groove bent in the same angle as the rotation of the impeller.8. The cooling system of claim 1 wherein the circulation generation unit comprises the same power supply as the electronic component.9. The cooling system of claim 1 wherein the impeller further comprises an axis and at least one blade having one-third of the bottom part slightly bent at an angle towards the direction of rotation making it a shape of an arc to enhance the heat transfer process by creating a lifting force for the coolant at the bottom part of the coolant storage unit.10. The cooling system of claim 1 wherein the radiation housing further comprises a fan.11. The cooling system of claim 1 wherein the top cover is non-magnetic.12. The cooling system of claim 8 wherein the top cover is non-magnetic.13. The cooling system of claim 3 wherein the absorption layer is formed to have a high heat conductivity, the absorption layer being formed of a material selected from a group consisting of bronze, copper (Cu), red copper tube, aluminum (Al), and alloys thereof, and wherein said absorption layer forms a chassis of the cooling system and is in contact with the electronic component and the coolant.14. An improved cooling system designed for an electronic component comprising:(a) a coolant; and (b) an integrated unit comprising: (i) an absorption housing having a coolant storage unit, the coolant storage unit having a cover for preventing leakage of coolant from the coolant storage unit; (ii) a radiation housing having a plurality of radiation sheets; (iii) an absorption layer between the coolant storage unit and the electronic component; and (iv) a circulation generation unit having a brushless DC motor, a motor stator, a rotor, and a rotatable impeller which causes the coolant to flow from the coolant storage unit to the radiation housing and back to the coolant storage unit through a conduit; wherein the absorption layer includes at least one groove bent in the direction of rotation of the impeller. 15. An improved cooling system designed for an electronic component comprising:(a) a coolant; and (b) an integrated unit comprising: (i) an absorption housing having a coolant storage unit, the coolant storage unit having a cover for preventing leakage of coolant from the coolant storage unit; (ii) a radiation housing having a plurality of radiation sheets; (iii) an absorption layer between the coolant storage unit and the electronic component; and (iv) a circulation generation unit having a brushless DC motor, a motor stator, a rotor, and an impeller which causes the coolant to flow from the coolant storage unit to the radiation housing and back to the coolant storage unit through a conduit; wherein the circulation generation unit has the same power supply as the electronic component. 16. An improved cooling system designed for an electronic component comprising:(a) a coolant; and (b) an integrated unit comprising: (i) an absorption housing having a coolant storage unit, the coolant storage unit having a cover for preventing leakage of coolant from the coolant storage unit; (ii) a radiation housing having a plurality of radiation sheets; (iii) an absorption layer between the coolant storage unit and the electronic component; and (iv) a circulation generation unit having a brushless DC motor, a motor stator, a rotor, and a rotatable impeller which causes the coolant to flow from the coolant storage unit to the radiation housing and back to the coolant storage unit through a conduit; wherein the impeller includes at least one blade in which a bottom portion of the at least one blade is slightly bent at an angle towards the direction of rotation of the impeller. 17. An improved cooling system designed for an electronic component comprising:an absorption section having a coolant storage unit and an absorption layer, the coolant storage unit housing coolant and an impeller, the coolant storage unit further having a cover for preventing leakage from the coolant storage unit, and the absorption layer being disposed between the coolant storage unit and an electronic component; a radiation section disposed adjacent to the absorption section; a conduit for connecting the absorption section with the radiation section; and a circulation generation unit disposed within the absorption section, the circulation generation unit having a brushless DC motor comprising a motor stator and a rotor, the motor stator and rotor being separated by the cover; whereby activation of the circulation generation unit activates the impeller, thereby causing coolant to flow from the coolant storage unit to the radiation section and back to the coolant storage unit via the conduit.