IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0116927
(2002-04-05)
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발명자
/ 주소 |
- Van Steenkiste, Thomas Hubert
- Smith, John R.
- Gorkiewicz, Daniel William
- Elmoursi, Alaa A.
- Gillispie, Bryan A.
- Patel, Nilesh B.
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출원인 / 주소 |
- Delphi Technologies, Inc.
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인용정보 |
피인용 횟수 :
21 인용 특허 :
48 |
초록
▼
A method of maintaining a non-obstructed interior opening in a kinetic spray nozzle is disclosed. The method includes the steps of providing a mixture of particles including first particle population and a second particle population; entraining the mixture of particles into a flow of a gas at a temp
A method of maintaining a non-obstructed interior opening in a kinetic spray nozzle is disclosed. The method includes the steps of providing a mixture of particles including first particle population and a second particle population; entraining the mixture of particles into a flow of a gas at a temperature below the melt temperature of the particle populations; and directing the mixture of particles entrained in the flow of gas through a supersonic nozzle to accelerate the first particle population to a velocity sufficient to result in adherence of the first particle population on a substrate positioned opposite the nozzle. The operating conditions of the kinetic spray system are selected such that the second particle population is not accelerated to a velocity sufficient to result in adherence when it impacts the substrate. The inclusion of the second particle population maintains the supersonic nozzle in a non-obstructed condition and also enables one to raise the main gas operating temperature to a much higher level, thereby increasing the deposition efficiency of the first particle population.
대표청구항
▼
1. A method of kinetic spray coating a substrate comprising the steps of:a) providing a mixture of particles comprising a first particle population and a second particle population, said first particle population having an average nominal diameter of from 75 to 106 microns and said second particle p
1. A method of kinetic spray coating a substrate comprising the steps of:a) providing a mixture of particles comprising a first particle population and a second particle population, said first particle population having an average nominal diameter of from 75 to 106 microns and said second particle population having an average nominal diameter of from 75 to 300 microns; b) entraining the mixture of particles into a flow of a gas, the gas at a temperature below a melt temperature of the first particle population and below a melt temperature of the second particle population; c) directing the mixture of particles entrained in the flow of gas through a supersonic nozzle and simultaneously accelerating the first particle population to a velocity sufficient to result in adherence of the first particle population on a substrate positioned opposite the nozzle, while accelerating the second particle population to a velocity insufficient to result in adherence of the second particle population to either the nozzle or the substrate when it impacts the substrate. 2. The method of claim 1, wherein step a) comprises selecting as the first particle population a material having a first yield stress and selecting as the second particle population a material having a second yield stress, wherein the first yield stress is lower than the second yield stress.3. The method of claim 1, wherein step a) comprises selecting as the first particle population a material having a first average nominal particle size and selecting as the second particle population a material having a second average nominal particle size, wherein the second average nominal particle size is at least twice the first average nominal particle size.4. The method of claim 3, wherein step a) further comprises selecting the material of the first particle population to be the same as the material of the second particle population.5. The method of claim 3, wherein step a) further comprises selecting the material of the first particle population to be other than the material of the second particle population.6. The method of claim 1, wherein step a) further comprises providing the second particle population in an amount of from 3 to 50 percent by volume based on the total volume of the mixture of particles.7. The method of claim 1, wherein step a) further comprises selecting as the first particle population at least one of a metal or an alloy.8. The method of claim 1, wherein step a) further comprises selecting as the second particle population at least one of a metal, an alloy, a diamond, or a ceramic.9. The method of claim 8, wherein step a) further comprises selecting as the second particle population at least one of copper, aluminum, tin, zinc, tungsten, molybdenum, silicon carbide, or aluminum nitride.10. The method of claim 1, wherein step b) further comprises setting the gas at a temperature of from 200° F. to 3000° F.11. The method of claim 1, wherein step c) further comprises selecting as the substrate at least one of a metal, an alloy, a ceramic, or a plastic.12. The method of claim 1, wherein step a) comprises selecting as the first particle population a first material having a first average nominal particle size and selecting as the second particle population the first material having a second average nominal particle size, wherein the second average nominal particle size is larger than the first average nominal particle size; and the first particle population is accelerated to a velocity that is greater than the velocity of the second particle population.13. The method of claim 1, wherein step a) comprises selecting as the first particle population a first material having a first yield stress and a first average nominal particle size and selecting as the second particle population a second material having a second yield stress and a second average nominal particle size, wherein the first yield stress is lower than the second yield stress, the second average nominal particle size is smaller than the first average nominal particle size, and the second particle population is accelerated to a higher velocity than the first particle population.14. The method of claim 1, wherein step a) comprises selecting as the first particle population a first material having a first yield stress and selecting as the second particle population a second material having a second yield stress, wherein the first yield stress is lower than the second yield stress, the first and second particle populations have the same average nominal particle size, and the first and second particle populations are accelerated to the same velocity.15. The method of claim 1, wherein step a) comprises selecting as the first particle population a first material having a first yield stress and a first average nominal particle size and selecting as the second particle population a second material having a second yield stress and a second average nominal particle size, wherein the first yield stress is lower than the second yield stress, the first average nominal particle size is smaller than the second average nominal particle size and the first particle population is accelerated to a greater velocity than the second particle population.16. A method of kinetic spray coating a substrate comprising the steps of:a) selecting a first particle population having a first average nominal diameter of from 75 to 106 microns; b) selecting a second particle population having a second average nominal diameter that is larger than the first average nominal diameter; c) forming a mixture of particles by combining the first particle population with the second particle population; d) entraining the mixture of particles into a flow of a gas, the gas at a temperature below a melt temperature of the first particle population and below a melt temperature of the second particle population; e) directing the mixture of particles entrained in the flow of gas through a supersonic nozzle and simultaneously accelerating the first particle population to a velocity sufficient to result in adherence of the first particle population on a substrate positioned opposite the nozzle, while accelerating the second particle powder to a velocity insufficient to result in adherence of the second particle population to either the nozzle or the substrate when it impacts the substrate. 17. The method of claim 16, wherein step b) comprises selecting the second particle population to have a second average nominal diameter of from 100 to 300 microns.18. The method of claim 16, wherein step b) comprises selecting the second particle population to have a second average nominal diameter that is at least twice as large as the first average nominal diameter.19. The method of claim 16, further comprising selecting a material of the first particle population to be the same as a material of the second particle population.20. The method of claim 16, further comprising selecting a material of the first particle population to be other than a material of the second particle population.21. The method of claim 16, wherein step c) further comprises providing the second particle population in an amount of from 3 to 50 percent by volume based on the total volume of the mixture of particles.22. The method of claim 16, wherein step a) further comprises selecting as the first particle population at least one of aluminum, copper, tungsten, molybdenum, tin, zinc, silicon, or mixtures thereof.23. The method of claim 16, wherein step b) further comprises selecting as the second particle population at least one of copper, aluminum, tin, zinc, tungsten, molybdenum, silicon carbide, aluminum nitride, ceramic, or mixtures thereof.
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