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[미국특허] Interposer assembly 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-012/00
출원번호 US-0407040 (2003-04-04)
발명자 / 주소
  • Neidich, Douglas A.
출원인 / 주소
  • InterCon Systems, Inc.
대리인 / 주소
    Hooker &
인용정보 피인용 횟수 : 10  인용 특허 : 38

초록

An interposer assembly includes a dielectric plate having a plurality of contact passages extending through the plate with a contact in each passage. Each contact includes a pair of laterally spaced contact points at the top and bottom of the plate. Sandwiching of the interposer assembly between two

대표청구항

1. An interposer assembly for forming redundant electrical connections with contact pads on substrates positioned above and below the assembly, said assembly comprising:a) an insulating plate having top and bottom sides and a plurality of passages extending through the thickness of the plate; and b)

이 특허에 인용된 특허 (38) 인용/피인용 타임라인 분석

  1. Fijten Roger Johannes Jacobus,NLX ; Van Dijk Petrus Richardus Martinus,NLX, Arrangement for resilient contacting.
  2. Senor Ronald (No. Attleboro MA) Cummings Michael T. (So. Attleboro MA), Bottom loaded I.C. socket.
  3. Juret Bernard (Crissey FRX), Card connector contact element.
  4. Reynier Helena M. A. (Helmond NLX) Van Oosterhout Johannes A. J. (Nieuwegein NLX), Card reader.
  5. Kirkman Michael (Swansea MA) Rydwansky ; Jr. Frank C. (Quincy MA) Hanlon Richard J. (Attleboro MA) Petersen Richard W. (Taunton MA), Carrier socket for leadless integrated circuit devices.
  6. Yumibe George (Huntington Beach CA) Gratzinger Paul (Moreno Valley CA) Nguyen Thanh (Pomona CA) Wisner Duane (Riverside CA), Compliant stacking connector for printed circuit boards.
  7. Niitsu Toshihiro,JPX, Connector with flexible beam providing uniform contact pressure.
  8. Hashiguchi Osamu,JPX, Contact set having a wiping action for printed circuit board.
  9. Hashiguchi Osamu (Tokyo JPX), Electric connector in which a plurality of contact members can be readily assembled to an insulator.
  10. DiStefano Thomas H. ; Smith John W. ; Karavakis Konstantine N. ; Kovac Zlata ; Fjelstad Joseph, Electrical connections with deformable contacts.
  11. Natori Akira,JPX ; Sato Junichi,JPX, Electrical connector contact element having multi-contact points to come into contact with a single mating contact element with independent contacting forces.
  12. Hashiguchi Osamu,JPX ; Takahashi Takuya,JPX, Electrical connector having spring contact with double contact projections as a contact region with contact pad of an external electronic component.
  13. Wetter James A., Electrical connector with terminals of varying lengths.
  14. Fujiura Yoshitsugu (Tokyo JPX) Niwa Takeo (Kawasaki JPX), Electrical connectors.
  15. Benasutti John Eugene (Warren PA), Electrical contact and connector.
  16. Grabbe Dimitry (Middletown PA) Korsunsky Iosif (Harrisburg PA) Laub Michael F. (Etters PA), High density area array modular connector.
  17. Smith Brian M. (Mansfield MA) Torti Emanuel D. (Boston MA), High density chip socket.
  18. Lopergolo Emanuele Frank ; Goldmann Lewis Sigmund ; Sullivan Joseph Michael ; Tompkins ; Jr. Charles Russell, High density electrical interconnect apparatus and method.
  19. Malo Cheryne (Foxboro MA) Marian Steven P. (Plainville MA) Mendenhall David W. (Greenville RI), High density parallel interconnect.
  20. Strange Andrew H. ; Alden ; III Wayne S., High speed backplane connector.
  21. Neidich Douglas A. ; Walden John D., Interposer assembly.
  22. Simmons Richard L. (Jonestown TX) Wehrly ; Jr. James D. (Austin TX) Bertram Michael J. (Austin TX), Method and apparatus for forming metal leads.
  23. Simmons Richard L. (Jonestown TX) Wehrly ; Jr. James D. (Austin TX) Bertram Michael J. (Austin TX), Method and apparatus for the excise and lead form of TAB devices.
  24. Seidler Jack (Flushing NY), Method of making an array of electrical components with leads attached and the product thereof.
  25. Distefano Thomas H. (Monte Sereno CA) Kovac Zlata (Los Gatos CA) Grange John (Cupertino CA), Microelectronic bonding with lead motion.
  26. Distefano Thomas H. (Monte Sereno CA) Kovac Zlata (Los Gatos CA) Grange John (Cupertino CA), Microelectronic bonding with lead motion.
  27. Fjelstad Joseph (Sunnyvale CA) Smith John W. (Palo Alto CA) Distefano Thomas H. (Monte Sereno CA) Zaccardi James (Sunnyvale CA) Walton A. Christian (Belmont CA), Microelectronic contacts with asperities and methods of making same.
  28. Marian Steven P. (Plainville MA), Modified high density backplane connector.
  29. Weisenburger Lawrence Paul (Winston-Salem NC), Multi-contact connector for substrate-to-board connections.
  30. Bright Edward J. (Elizabethtown PA) Kandybowski Steven J. (Tower City PA) Sheesley Wilmer L. (Dauphin PA) Sinisi David B. (Middletown PA), Pad array socket.
  31. Smith Donald Leonard ; Alimonda Andrew Sebastian, Photolithographically patterned spring contact.
  32. Norden Alexander R. (New York NY), Rejection fuse holders.
  33. Herve G. Bricaud FR, Smart card connector with improved contacts.
  34. Grabbe Dimitry G. (Middletown PA) Korsunsky Iosif (Harrisburg PA) Ringler Daniel R. (Elizabethville PA), Surface mount electrical connector.
  35. Kunkle John P. (Clemmons NC) McClune Donald W. (Winston-Salem NC), Surface mount socket for dual in-line package.
  36. Olsson Billy E. (New Cumberland PA), Terminal device having improved retention means.
  37. Takagishi Takashi (Shizuoka JPX) Makita Toshihiko (Shizuoka JPX), Terminal for passing through waterproof rubber plug and method of producing terminal.
  38. Takagishi Takashi,JPX ; Makita Toshihiko,JPX ; Otaka Kazuto,JPX ; Ohsumi Hideki,JPX, Terminal for passing through waterproof rubber plug and method of producing terminal.

이 특허를 인용한 특허 (10) 인용/피인용 타임라인 분석

  1. Horikawa, Yasuyoshi, Connecting terminal structure, manufacturing method of the same and socket.
  2. Chen, David; Ong, Chengvee; Yu, Chichih, Connector and electronic device.
  3. Champion, Bruce Allen; Millard, Steven Jay; Lin, Bin, Connector system having contact overlapping vias.
  4. Polnyi,Igor, Contact for an interposer-type connector array.
  5. Ju,Ted, Electrical connector array.
  6. Taylor, Paul R., Interposer assembly and method.
  7. Walden, John D.; Hileman, James S.; Pickles, Charles Sands, Interposer assembly and method.
  8. Neidich, Douglas A.; Taylor, Paul R., Interposer assembly with flat contacts.
  9. Florence, Jr., Robert F.; Lopergolo, Emanuele F.; Singh, Prabjit, Land grid array interposer with compressible conductors.
  10. Liao,Fang Jwu; Szu,Ming Lun; Lee,Genn Sheng, Land grid array socket having terminals with spring arms.

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