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A modular connector assembly includes a modular frame having a first holes, second holes, and third holes formed at evenly spaced intervals. A plurality of modular interconnect components, fixable within the modular frame, have a back surface projection formed thereon. Each modular interconnect incl

A modular connector assembly includes a modular frame having a first holes, second holes, and third holes formed at evenly spaced intervals. A plurality of modular interconnect components, fixable within the modular frame, have a back surface projection formed thereon. Each modular interconnect includes a contact housing made of electrically insulating material, an exterior of the contact housing comprising first and second side surfaces, a back surface, and a top surface. Contact signal pins are fixed within and electrically insulated from the contact housing.

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1. A modular connector assembly comprising:a modular frame comprising a first surface and a second surface connected at an angle to the first surface by a first angle region, the first surface, second surface, and first angle region having a plurality of first holes, plurality of second holes, and p

1. A modular connector assembly comprising:a modular frame comprising a first surface and a second surface connected at an angle to the first surface by a first angle region, the first surface, second surface, and first angle region having a plurality of first holes, plurality of second holes, and plurality of third holes, respectively, formed therethrough at evenly spaced intervals, and a plurality of modular interconnect components fixable within the modular frame and including a back surface having at least one back surface projection fanned thereon, each comprising: a contact housing made of electrically insulating material, an exterior of the contact housing comprising first and second side surfaces, a back surface, and a top surface; a plurality of contact signal pins fixed within and electrically insulated from the contact housing; a plurality of side protrusions fanned on the first side surface; a plurality of side recesses formed in the second side surface; at least one back surface peg formed on the back surface of the contact housing; and top surface modular frame connection means on the top surface, wherein the top surface modular frame connection means is configured for receipt by the first holes, the at least one back surface projection is configured for receipt by the second holes, the at least one back surface peg is configured for receipt by the third holes, and wherein side protrusions of the plurality of modular interconnect components are configured for receipt by side recesses of adjacent ones of the plurality of modular interconnect components. 2. The modular connector assembly according to claim 1, wherein an exterior surface of the contact housing is electrically conductive.3. The modular connector assembly according to claim 1, wherein each of the plurality of modular interconnect components further comprises:a plurality of shielding contacts disposed within and electrically coupled to the contact housing. 4. The modular connector assembly according to claim 1, wherein each of the plurality of modular interconnect components further comprises:a component contact portion and a device contact portion integrally formed within the contact housing; at least one contact opening formed within the component contact portion; a plurality of pin openings formed in the device contact portion, each of the plurality of pin openings joining with the at least one contact opening, wherein each of the plurality of contact signal pins comprises a component contact end and, opposing the component contact end, a device contact end, wherein a plurality of component contact ends are disposed within the at least one contact opening, and wherein a plurality of device contact ends are disposed within a single one of the plurality of pin openings, wherein an active electronic device is electrically connectable to the plurality of device contact ends within the plurality of pin openings. 5. The modular connector assembly according to claim 4, wherein pairs of the device contact ends are disposed within a single one of the plurality of pin openings.6. The modular connector assembly according to claim 4, wherein:the at least one contact opening comprises a plurality of contact openings; and a plurality of the plurality of pin openings join with each of the plurality of contact openings. 7. The modular connector assembly according to claim 6, wherein each of the plurality of modular interconnect components further comprises:an angle unit made of an electrically insulating material and a plurality of electrically conductive angle pins provided therein, wherein the plurality of the electrically conductive angle pins are bent at an angle and include first ends extending beyond the angle unit to be electrically connectable to the plurality of device contact ends within the pin openings, wherein the angle unit is interposed between the active electronic device and the plurality of device contact ends, and wherein the at least one back surface projection is integrally formed on a back surface of the angle unit. 8. The modular connector assembly according to claim 7, wherein an exterior surface of the angle unit is electrically conductive.9. The modular connector assembly according to claim 7, wherein:the contact housing further comprises a notched slot structure integrally formed therein; and the angle unit comprises a latching means integrally formed therewith, wherein the latching means of the angle unit, electrically connected to the plurality of device contact ends are fixed within the notched slot structure of the contact housing.10. The modular connector assembly according to claim 8, wherein the exterior surface comprises:a substantially flat bottom surface; and a plurality of integrally formed ground bumps evenly spaced between second ends of the electrically conductive angle pins, wherein the second ends and the ground bumps protrude from the substantially flat bottom surface to be electrically contactable to the active electronic device. 11. The modular connector assembly according to claim 4, wherein:the at least one contact opening comprises a single contact opening. 12. The modular connector assembly according to claim 11, wherein the modular frame further comprises a third surface connected at an angle to the second surface by a second angle region, the third surface and the second angle region having a plurality of fourth holes, and a plurality of fifth holes, respectively, formed therethrough at evenly spaced intervals.13. The modular connector assembly according to claim 11, wherein the back surface of the contact housing comprises the at least one back surface projection.14. The modular connector assembly according to claim 12, wherein the contact housing further comprises:a bottom surface; and bottom surface modular frame connection means on the bottom surface, wherein the bottom surface modular frame connection means is configured for receipt by the fourth holes, and wherein the at least one back surface peg is additionally configured for receipt by the fifth holes. 15. The modular connector assembly according to claim 13, wherein the device contact ends extend beyond the at least one back surface projection.16. The modular connector assembly according to claim 15, wherein the at least one back surface projection comprises a plurality of electrically conductive ground bumps integrally formed therewith, wherein the electrically conductive ground bumps are evenly spaced between the device contact ends.17. A high density coaxial electrical interconnect system comprising:a contact housing formed of a unitary body of electrically insulating material, the contact housing comprising a component contact portion and a device contact portion; at least one contact opening formed within the component contact portion; a plurality of pin openings formed in the device contact portion, each of the plurality of pin openings joining with the at least one contact opening; a plurality of signal pins fixed within and electrically insulated from the contact housing, each of the plurality of signal pins comprising a component contact end and, opposing the component contact end, a device contact end, wherein a plurality of component contact ends are disposed within the at least one contact opening, and wherein a plurality of device contact ends are disposed within each of the plurality of pin openings. 18. The high density coaxial electrical interconnect system according to claim 17, further comprising a plurality of shielding contacts disposed within and electrically coupled to the contact housing.19. The high density coaxial electrical interconnect system according to claim 17, wherein each signal pin includes a handling portion arranged between the component contact end and the device contact end, the interconnect system further comprising a signal pin insulator conformally disposed over a handling portion of each of the plurality of signal pins.20. The high density coaxial electrical interconnect system according to claim 17, wherein pairs of the device contact ends are disposed within a single one of the plurality of pin openings.21. The high density coaxial electrical interconnect system according to claim 17, wherein:the at least one contact opening comprises a plurality of contact openings; and a plurality of the plurality of pin openings join with each of the plurality of contact openings. 22. The high density coaxial electrical interconnect system according to claim 21, further comprising a plurality of contact opening insulators disposed within each of the plurality of contact openings, wherein exterior dimensions of each of the plurality of contact opening insulators are conformal to dimensions of portions of the signal pins and conformal to a sidewall of each of the plurality of contact openings.23. The high density coaxial electrical interconnect system according to claim 17, further comprising a plurality of solder guides formed of electrically insulating material, each of the plurality of solder guides being provided within a single one of the pin openings, each of the solder guides comprising a plurality of solder holes each adapted to receive one of the plurality of device contact ends.24. The high density coaxial electrical interconnect system according to claim 23, further comprising solder material disposed within each of the plurality of solder holes.25. The high density coaxial electrical interconnect system according to claim 23, wherein each of the solder guides further comprises a solder guide divider structure extending between adjacent electrically conductive signal pins.26. The high density coaxial electrical interconnect system according to claim 17, wherein the at least one contact opening consists of one contact opening.27. The high density coaxial electrical interconnect system according to claim 26, further comprising:a plurality of fins integrally formed with the contact housing; and a plurality of fin insulators disposed over each of the plurality of fins, wherein each of the plurality of fin insulators is formed of electrically insulating material and includes exterior dimensions conformal to dimensions of portions of the signal pins and to dimensions of the plurality of fins, wherein a plurality of signal pins are arranged adjacent each of the plurality of fin insulators. 28. The high density coaxial electrical interconnect system according to claim 27, wherein each of the plurality of fin insulators further comprises a fin insulator divider structure extending between portions of adjacent electrically conductive signal pins.29. The high density coaxial electrical interconnect system according to claim 27, wherein dimensions of the fins comprise two major surfaces.30. The high density coaxial electrical interconnect system according to claim 29, wherein the two major surfaces are not flat.31. The high density coaxial electrical interconnect system according to claim 30, wherein the two major surfaces are diametrically configured with respect to each other.32. The high density coaxial electrical interconnect system according to claim 17, further comprising a plurality of solder guides formed of electrically insulating material, each of the plurality of solder guides being provided within a single one of the pin openings and each of the solder guides comprising a plurality of solder holes each adapted to receive one of the plurality of device contact ends.33. The high density coaxial electrical interconnect system according to claim 17, further comprising an angle body interposable between an active electronic device and the plurality of device contact ends, the angle body being formed of an electrically insulating material.34. The high density coaxial electrical interconnect system according to claim 33, whereinthe contact housing further comprises a notched slot structure integrally formed therein; and the angle body comprises an integrally formed latching means, wherein the latching means is fixable within the notched slot structure of the contact housing.35. The high density coaxial electrical interconnect system according to claim 33, wherein an exterior surface of the angle body is electrically conductive.36. The high density coaxial electrical interconnect system according to claim 33, further comprising a plurality of electrically conductive angle pins provided within the angle body, wherein the plurality of the electrically conductive angle pins are bent at an angle and include first ends extending beyond the angle unit, wherein the plurality of electrically conductive angle pins are electrically connectable to corresponding ones of the plurality of device contact ends within the pin openings.37. The high density coaxial electrical interconnect system according to claim 36, further comprising a plurality of shielding insulators, each of the shielding insulators covering a predetermined longitudinal length of at least one electrically conductive signal pin.38. The high density coaxial electrical interconnect system according to claim 37, wherein each of the shielding insulators covers a predetermined longitudinal length of a single electrically conductive signal pin.39. The high density coaxial electrical interconnect system according to claim 37, wherein each of the shielding insulators covers a predetermined longitudinal length of a plurality of electrically conductive signal pins.40. The high density coaxial electrical interconnect system according to claim 39, wherein each of the shielding insulators covers a predetermined longitudinal length of a pair of electrically conductive signal pins.41. The high density coaxial electrical interconnect system according to claim 37, wherein each of the shielding insulators is coated with an electrically conductive material.42. The high density coaxial electrical interconnect system according to claim 17, wherein an exterior surface of the contact housing is electrically conductive.43. An electrical interconnect system comprising:a first unit comprising: a first contact housing made of an electrically insulating material; and a plurality of first contact pins provided within the first contact housing; a second unit comprising: a second contact housing made of an electrically insulating materials; and a plurality of second contact pins provided within the second contact housing; an angle body made of an electrically insulating material; a plurality of conductive angle pins provided within the angle body, wherein the plurality of conductive angle pins are bent at an angle and include first ends and second ends opposing the first ends, wherein the first ends extend beyond the angle body and are electrically connectable to the second contact pins, wherein each of the plurality of first contact pins is receivable by a single one of the plurality of second contact pins, and wherein the angle body is interposable between an external device to be connected and the second unit. 44. The electrical interconnect system according to claim 43, wherein the surface of the first contact housing is electrically conductive;the surface of the second contact housing is electrically conductive; and the surface of the angle body is electrically conductive. 45. The electrical interconnect system according to claim 43, wherein each of the plurality of conductive angle pins comprises at least one electrically conductive wire, wherein a predetermined longitudinal length of the at least one electrically conductive wire is covered with a shielding insulator wherein the shielding insulator including an electrically insulating material.46. The electrical interconnect system according to claim 45, wherein each of the shielding insulators is coated with an electrically conductive material.47. The electrical interconnect system according to claim 45, wherein the at least one electrically conductive wire includes a single electrically conductive wire.48. The electrical interconnect system according to claim 45, wherein the at least one electrically conductive wire includes pairs of adjacent electrically conductive wires.49. The electrical interconnect system according to claim 44, wherein the angle body further comprises:a substantially planar bottom surface, and a plurality of integrally formed ground bumps evenly spaced between each of the plurality of second ends of the conductive angle pins for electrically grounding the angle body to a first device, the plurality of second ends protruding from the substantially planar bottom surface of the angle body to be electrically contactable to the external device. 50. The electrical interconnect system according to claim 43, wherein each of the plurality of second contact pins comprises:a conductive receiving pin configured to receive a single one of the plurality of first contact pins a handling portion arranged between opposing ends of the conductive receiving pin; and a second pin insulator conformally disposed over the handling portion of the conductive receiving pin for fixing the conductive receiving pin within the second contact housing. 51. The electrical interconnect system according to claim 50, wherein each conductive receiving pin is provided within, and is electrically insulated from, the second contact housing.52. The electrical interconnect system according to claim 50, whereinthe second contact housing comprises a plurality of integrally formed second contact openings, wherein a plurality of the conductive receiving pins are arranged within each of the plurality of second contact openings. 53. The electrical interconnect system according to claim 52, further comprising:a plurality of contact opening insulators disposed within each of the plurality of second contact openings. 54. The electrical interconnect system according to claim 53, wherein each of the plurality of contact opening insulators includes exterior dimensions conformal to dimensions of portions of the conductive receiving pins and conformal to a surface on a sidewall of the contact openings.55. The electrical interconnect system according to claim 50, further comprising solder material electrically connecting each first end to respective solder connection portions of each of the plurality of conductive receiving pins.56. The electrical interconnect system according to claim 55, wherein the first ends and the solder material are disposed within, and are electrically insulated from, the second contact housing.57. The electrical interconnect system according to claim 43, whereinthe second contact housing comprises a notched slot structure integrally formed therein; and the angle body comprises a latching means integrally formed therewith, wherein the latching means of the angle body is fixable within the notched slot structure of the second contact housing.58. The electrical interconnect system according to claim 57, wherein the latching means of the angle body is electrically connectable to the second unit.59. The electrical interconnect system according to claim 43, wherein the second contact housing is electrically connectable to the angle body.60. The electrical interconnect system according to claim 43, wherein each of the plurality of first contact pins comprises:a conductive projecting pin configured to be in receipt of a single one of the plurality of second contact pins; a handling portion arranged between opposing ends of the conductive projecting pin; and a first pin insulator conformally disposed over the handling portion of the conductive projecting pin and fixing the conductive projecting pin within the first contact housing. 61. The electrical interconnect system according to claim 60, wherein each conductive projecting pin is provided within, and is electrically insulated from, the first contact housing.62. The electrical interconnect system according to claim 60, further comprising:a plurality of fins integrally formed with the first contact housing; and a plurality of fin insulators formed of electrically insulating material, the plurality of fin insulator disposable over each of the plurality of fins, wherein each of the plurality of fin insulators includes exterior dimensions that are conformal to dimensions of portions of the conductive projecting pins and conformal to dimensions of the fins, wherein a plurality of the conductive projecting pins are arranged adjacent each of the plurality of fin insulators. 63. The electrical interconnect system according to claim 62, wherein the dimensions of the fins comprise two major surfaces, the two major surfaces are not flat and diametrically oppose one another.64. The electrical interconnect system according to claim 62, wherein dimensions of the fins comprise two major surfaces.65. The high density coaxial electrical interconnect system according to claim 64, wherein the two major surfaces are not flat.66. The high density coaxial electrical interconnect system according to claim 65, wherein the two major surfaces are diametrically configured with respect to each other.67. The electrical interconnect system according to claim 44, further comprising:a plurality of first shielding contacts disposed within and electrically coupled to the first contact housing; and a plurality of second shielding contacts disposed within and electrically coupled to the second contact housing, wherein each of the plurality of first contact pins are configured for receipt by a single one of the plurality of second contact pins and each of the plurality of first shielding contacts is configured for receipt by a single one of the plurality of second shielding contacts. 68. The electrical interconnect system according to claim 43, whereinthe second unit further comprises press fit pegs integrally formed with the second contact housing for aligning the second ends of the first angle unit with corresponding electrical contacts found on the external device. 69. The electrical interconnect system according to claim 43, whereinthe first unit is a male unit; and the second unit is a female unit. 70. An electrical interconnect system comprising:a first unit comprising a first contact housing and a plurality of first contact pins provided within the first contact housing; a second unit comprising a second contact housing made of an electrically insulating material, the second contact housing having a notched slot structure integrally formed therein and a plurality of second contact pins provided within the second contact housing; an angle body made of an electrically insulating material and including an integrally formed latching means; a plurality of conductive angle pins provided within the angle body, wherein the angle pins being electrically connectable to the second unit, the first angle unit being interposable between an external device connectable to the second unit, wherein the latching means is electrically connectable to the second unit and is fixable within the notched slot structure. 71. A system comprising:a first unit comprising a unitary first contact housing made of electrically insulating material, and a plurality of conductive projecting pins provided within and electrically insulated from the first contact housing; a second unit comprising a unitary second contact housing made of electrically insulating material, the second contact housing comprising a plurality of integrally formed second contact openings, and a plurality of conductive receiving pins arranged within each of the plurality of second contact openings and electrically insulated from the second contact housing, wherein each of the plurality of first contact pins is receivable by a single one of the plurality of conductive receiving pins. 72. The system according to claim 71, wherein the surface of the first contact housing is electrically conductive.73. The system according to claim 71, wherein the surface of the second contact housing is electrically conductive.74. The system according to claim 71, further comprising:a plurality of fins integrally formed with the first contact housing; a plurality of fin insulators formed of electrically insulating material and disposed over each of the plurality of fins, wherein each of the plurality of fin insulators comprises exterior dimensions conformal to dimensions of portions of the conductive projecting pins and dimensions of the fins, wherein a plurality of the conductive projecting pins are arranged adjacent each of the plurality of fin insulators. 75. The system according to claim 74, wherein the fin insulators are contactable by sidewalls of the second contact openings at predetermined locations defined by adjacent ones of the plurality of conductive receiving pins such that the fin insulators are present between each of the plurality of conductive projecting pins received by the plurality of conductive receiving pins.