초록 ▼

A manufacturing method of a thin-film structural body, capable of preparing a thin-film structural body by using a sacrifice film without any protruding part on its surface, thereby preparing a thin-film structural body having high strength and reliability. After a sacrifice film is formed with a fi

A manufacturing method of a thin-film structural body, capable of preparing a thin-film structural body by using a sacrifice film without any protruding part on its surface, thereby preparing a thin-film structural body having high strength and reliability. After a sacrifice film is formed with a film thickness greater than a predetermined value, the surface of the sacrifice film is ground so that the surface of the sacrifice film is flattened with the film thickness of the sacrifice film being adjusted to the predetermined value. Thus, the influence of the surface irregularity of a substrate is eliminated and the surface of the sacrifice film is flattened. Thereby, a mass body, beams and fixed electrodes of a semiconductor acceleration sensor are prepared by using the sacrifice film.

대표청구항 ▼

1. A manufacturing method of a thin-film structural body including a supporting part formed on a substrate and a floating part integrally formed with said supporting part, supported by said supporting part and placed with a predetermined distance from said substrate, said manufacturing method compri

1. A manufacturing method of a thin-film structural body including a supporting part formed on a substrate and a floating part integrally formed with said supporting part, supported by said supporting part and placed with a predetermined distance from said substrate, said manufacturing method comprising:forming a wiring on a part of said substrate; forming a sacrifice film on said wiring and said substrate with a film thickness greater than said predetermined distance; flattening a surface of said sacrifice film; forming an anchor hole part by selectively removing a portion of said sacrifice film that covers said wiring on which said supporting part is to be formed; depositing a thin-film layer on said sacrifice film and said wiring exposed through said anchor hole part; selectively removing and patterning said thin-film layer so that a residual portion of said thin-film layer forms said thin-film structural body; and removing said sacrifice film, wherein said wiring is formed to protrude from a surface of said substrate, said supporting part and said floating part are made from a conductive material, said supporting part is formed on said wiring so as to be electrically connected to said wiring, at least one portion of a circumferential edge of said supporting part is placed above an outer edge of said wiring, and said floating part is connected to said at least one portion of said supporting part and extends in a direction departing from the outer edge of said wiring. 2. The manufacturing method of a thin-film structural body according to claim 1, whereinin said flattening of the surface of said sacrifice film, the surface of said sacrifice film is ground. 3. The manufacturing method of a thin-film structural body according to claim 2, whereinin said flattening of the surface of said sacrifice film, said film thickness of said sacrifice film is adjusted to a value which is equal to said predetermined distance. 4. The manufacturing method of a thin-film structural body according to claim 3, whereinin said depositing of said thin-film layer, said thin-film layer is deposited with a film thickness greater than a film thickness of said flattened sacrifice film. 5. The manufacturing method of a thin-film structural body according to claim 1, whereinsaid thin-film structural body forms at least one portion of a sensor part which is installed in an acceleration sensor and which has a function of detecting an acceleration. 6. A manufacturing method of a thin-film structural body including a conductive supporting part formed on a wiring formed on a surface of a substrate and a conductive floating part supported by said supporting part and placed with a predetermined distance from said substrate, said manufacturing method comprising:forming a groove having a depth equal to a film thickness of said wiring, said groove being formed on the surface of said substrate and corresponding to at least a portion of said supporting part; forming said wiring in said groove to obtain a flat surface of said substrate; forming a sacrifice film covering a surface of said wiring and said surface of said substrate; forming an anchor hole part by selectively removing a portion of said sacrifice film on which said supporting part is to be formed such that a portion of said wiring is exposed; depositing a thin-film layer on said sacrifice film and said portion of wiring exposed through said anchor hole part, said thin-film layer comprising a conductive material; selectively removing and patterning said thin-film layer so that residual portions of said thin-film layer form said thin-film structural body; and removing said sacrifice film. 7. The manufacturing method of a thin-film structural body according to claim 6, whereinin said depositing of said thin-film layer, said thin-film layer is deposited with a film thickness greater than a film thickness of said sacrifice film. 8. The manufacturing method of a thin-film structural body according to claim 6, whereinsaid forming of said wiring includes: depositing a conductive film on said substrate having said groove with a film thickness equal to said depth of said groove by using the same material as said wiring; and patterning said conductive film to remove a portion of said conductive film other than a portion located inside said groove, with a predetermined gap dimension from each side wall of said groove so that a residual portion of said conductive film forms said wiring. 9. The manufacturing method of a thin-film structural body according to claim 6, whereinsaid thin-film structural body forms at least one portion of a sensor part which is installed in an acceleration sensor and which has a function of detecting an acceleration. 10. The manufacturing method of a thin-film structural body according to claim 8, whereinat least one portion of a circumferential edge of said supporting part is placed above an outer edge of said wiring, and said floating part is connected to said at least one portion of said supporting part and extends in a direction departing from the outer edge of said wiring.