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Thermally conductive drive belt 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-003/02
  • B32B-027/04
  • F16H-007/02
  • F16G-001/14
  • F16G-005/12
출원번호 US-0337538 (2003-01-07)
발명자 / 주소
  • Foster, Jon S.
출원인 / 주소
  • Cool Options, Inc.
대리인 / 주소
    Barlow, Josephs &
인용정보 피인용 횟수 : 5  인용 특허 : 40

초록

The present invention provides for a power transfer belt that is manufactured of a highly thermally conductive polymer composition, in contrast to the typical rubber material used to fabricate the belts of the prior art. The new and unique belt of the present invention is manufactured of a thermally

대표청구항

1. A thermally conductive drive belt formed entirely from a uniform thermally conductive polymer composition comprising:a base flexible thermoplastic matrix of, by volume, between 30 and 60 percent; a first filler having an aspect ratio of at least 10:1 of, by volume, between 30 and 40 percent; and

이 특허에 인용된 특허 (40)

  1. Guillen Roberto,ESX ; Angulo Emilio,ESX, Belt drive arrangement for a printhead carriage.
  2. Sakuma, Norio; Koase, Kiyoshi, Belt for shoe press.
  3. Peterson Larry L. (Hudson WI), Coated abrasive article.
  4. Nelson Daryl J. (Beaverton OR) Noble Scott L. (Beaverton OR), Collapsible cooling apparatus for portable computer.
  5. Kai Zhang ; Michael D. Harris ; Daniel S. Ventura, Compound waveform gasket for low closure force EMI shielding applications.
  6. de Sorgo Miksa, Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer hav.
  7. Wotton, Geoff; Chen, Angela, Conductive heating of print media.
  8. Fouts, Jr., Robert W.; Au, Andrew N. S.; Miller, Burton E.; Gotcher, Alan J., Conductive polymer compositions and devices.
  9. Samarov Victor M. (Carlisle MA) Larson ; Jr. Ralph I. (Bolton MA) Doumani George A. (No. Andover MA), Conformal heat sink for electronic module.
  10. Morgan Norodin H. (Billerica MA), Corrosion inhibiting EMI/RFI shielding coating and method of its use.
  11. Kalinoski John P., Corrosion-resistant, form-in-place EMI shielding gasket.
  12. Hara, Takeo; Iwanaga, Shin-ichiro; Sato, Hozumi; Setaka, Ryoji, Curing composition for forming a heat-conductive sheet, heat-conductive sheet, production thereof and heat sink structure.
  13. Xie Hong (Chandler AZ) Aghazadeh Mostafa (Chandler AZ) Turturro Gregory (Chandler AZ) Chiu Chia-Pin (Chandler AZ), Dissipation of heat through keyboard using a heat pipe.
  14. Habegger Fernand (Biel-Benken CHX) Polt Niklaus (Basel CHX) Grbli Kurt (Mnchenstein CHX), Driving belt.
  15. Benn ; Sr. Robert C. (Danbury CT) Benn ; Jr. Robert C. (Danbury CT), Dual elastomer gasket shield for electronic equipment.
  16. Bunyan Michael A. (Derry NH), EMI/RFI shielding gasket.
  17. Varadan Vijay K. (State College PA) Varadan Vasundara V. (State College PA), Electromagnetic shielding and absorptive materials.
  18. Standley Paul M. (Springfield MO), Endless power transmission belt.
  19. Matsuura Masahiko,JPX ; Hirai Atsuto,JPX ; Kondo Takashi,JPX, Fixing device for an image forming apparatus.
  20. Betker Jay B. (Fullerton CA), Flexible membrane heat sink.
  21. Baucom Allan S. (Townsend MA) Foster Mark J. (Acton MA) Bovio Michele (Boston MA), Heat dissipating arrangement in a portable computer.
  22. Moore David A., Heat dissipating pad structure for an electronic component.
  23. Takano Hiroshi (Miki JPX) Takagi Shinichi (Nishinomiya JPX) Wada Kiyokazu (Miki JPX) Konishi Sadaichi (Kobe JPX) Okumura Nobuo (Kobe JPX) Kanaoka Tomizo (Kobe JPX) Matsuo Kouji (Kobe JPX), High load transmission belt.
  24. Aoto Jun,JPX ; Hirano Yasuo,JPX ; Yamashita Masahide,JPX ; Seto Mitsuru,JPX ; Fukuda Shigeru,JPX, Image forming apparatus having an intermediate transfer unit with a surface having reduced coefficient of friction.
  25. Sutrina Thomas A. (Rockford IL), Integral heat sink interface.
  26. Ross Richard J. (Moraga CA), Integrated circuit packages with heat dissipation for high current load.
  27. Michael H. Bunyan, Intumescent, flame retardant pressure sensitive adhesive composition for EMI shielding applications.
  28. Howard A. Fromson ; William J. Rozell ; Paul C. Schunk ; Russell R. Thomas, Method and apparatus for heating printing plates.
  29. Tsunashima Kenji,JPX ; Toyama Masaharu,JPX ; Miyakawa Katsutoshi,JPX ; Osada Shunichi,JPX ; Chigira Nobutsugu,JPX ; Yoshimura Hiroshi,JPX, Method of producing thermoplastic resin films and apparatus for producing the same.
  30. Kikinis Dan (20264 Ljepava Dr. Satatoga CA 95070), Microprocessor cooling in a portable computer.
  31. Morikoshi, Makoto; Sakogawa, Kouichi; Otsu, Toshihiro, Molded part.
  32. Tyler Stephen G. (Witham GBX), Package in the heat dissipation of Electronic devices.
  33. Takano Hiroshi (Miki JPX), Reinforced cog belt.
  34. Osuna Jesus E. ; Mason Keith M. ; Stygar Vernon E., Screen printable curable conductive material composition.
  35. Kitagawa Hiroji (Nagoya JPX), Sealant compound with carbon fiber mixed therein.
  36. Dubrow Robert S. (Redwood City CA) Holland Christine J. (San Mateo CA) Chan Randolph W. (Palo Alto CA) Martin Albert R. (Oakland CA) Siden Dennis C. (Portola Valley CA) Germeraad Paul B. (Menlo Park , Shielding and sealing gaskets.
  37. Fujimori Yoshinori (Tokyo JPX) Momma Jun (Yokohama JPX) Sasaki Tomiya (Yokohama JPX) Iwasaki Hideo (Kawasaki JPX) Sakamoto Toshiya (Yokohama JPX) Endo Hiroshi (Yokohama JPX) Hisano Katsumi (Yokohama , Thermal conductivity sheet.
  38. McCullough Kevin A., Thermally conductive composite material.
  39. Edward L. Schlueter, Jr. ; Joseph Mammino ; Edward F. Bowler, Jr., Thermally conductive fuser belt.
  40. Hanrahan James R., Thermally conductive polytetrafluoroethylene article.

이 특허를 인용한 특허 (5)

  1. Nelson, Sherri M.; Eastep, David W.; Tibor, Timothy L.; Regan, Timothy A.; Wesley, Michael L.; Steihm, Richard, Composite core for electrical transmission cables.
  2. Nelson, Sherri M.; Eastep, David W.; Tibor, Timothy L.; Regan, Timothy A.; Wesley, Michael L.; Stiehm, Richard, Composite core for electrical transmission cables.
  3. Oh,Hieyoung W., Conductive heat-equalizing device.
  4. Rye, Jason; Hanson, Kyle M., Processing assembly for semiconductor workpiece and methods of processing same.
  5. Nelson, Sherri M.; Eastep, David W.; Regan, Timothy A.; Wesley, Michael L., Umbilical for use in subsea applications.
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