[특허]Fingerprint sensor and interconnect

[미국특허] Fingerprint sensor and interconnect 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G06K-011/00
출원번호	US-0160438 (2002-05-31)
§371/§102 date	20021127 (20021127)
발명자 / 주소	Manansala, Michael
출원인 / 주소	Fujitsu Limited
대리인 / 주소	Sheppard Mullin Richter &
인용정보	피인용 횟수 : 77 인용 특허 : 7

초록 ▼

Flexible interconnect packaging system. The system includes a flexible substrate material that includes internal traces coupled to fingerprint sensor mounted to the substrate. Bonding pads of the fingerprint sensor are connected to conductive trace pads of the internal traces using techniques such as, wire bonding, ball/bump methods, tape automated bonding (TAB), or any other applicable bonding methodology for integrated circuits. The final package includes a pre-molded package the forms an open cavity, thereby allowing a sensor surface of the fingerprint sensor to be exposed for access by a user.

대표청구항 ▼

1. A flexible interconnect apparatus for flexibly coupling a fingerprint sensor to an external circuit, comprising:a multilayer flexible substrate having conductive traces that lead to a connector at one end of said substrate for connecting to an external circuit; a fingerprint sensor mounted on an end portion of the multilayer flexible substrate distal from said connector end and having a sensor surface, the fingerprint sensor having sensor contacts that are connected to the conductive traces; and a molded package coupled to a portion of the bottom of the multilayer flexible substrate below the fingerprint sensor such that at least a portion of the multilayer flexible substrate is positioned between the fingerprint sensor and the molded package, the molded package forming an open top cavity that allows the sensor surface of the fingerprint sensor to be exposed for access by a user, such that the portion of said interconnect apparatus proximate said molded package is rigid, and the portion of said interconnect apparatus distal from said molded package is flexible. 2. The apparatus of claim 1, wherein the flexible interconnect apparatus is mounted to a housing for a cellular telephone so that the surface of said fingerprint sensor is exposed at an outside surface of the housing, and wherein the connector is connected to an external circuit located on a main PCB within the housing.3. The apparatus of claim 2 wherein the orientation of the fingerprint sensor is different than the orientation of the main PCB within the housing.4. The apparatus of claim 1, wherein said flexible substrate has sufficient flexibility to be folded.5. The apparatus of claim 1, wherein said flexible substrate has sufficient flexibility to be twisted.6. The apparatus of claim 1 further comprising a stiffener coupled to said flexible substrate at the connector end thereof.7. The apparatus of claim 1 wherein said conductive traces are formed in a conductive layer that is internally positioned within said multilayer flexible substrate, and a portion of said multilayer flexible substrate has a cavity formed in one or more of the layers thereof adjacent to said fingerprint sensor, said cavity in said multilayer flexible substrate extending to and exposing a corresponding portion of said conductive layer, and further comprising wires connecting said sensor contacts to said conductive layers within said cavity in said multilayer flexible substrate.8. The apparatus of claim 7 further comprising an encapsulation material filling said cavity in said multilayer flexible substrate and covering said wires.9. The apparatus of claim 1 wherein said molded package surrounds only a portion of said fingerprint sensor.10. A fingerprint sensing apparatus, comprising:an elongate multilayer flexible substrate having a conductive layer comprising a plurality of conductive traces; a fingerprint sensor mounted on top of said elongate multilayer flexible substrate proximate a first end thereof; said fingerprint sensor having a sensor surface and a plurality of electrical contacts which are connected to conductive traces in said conductive layer at a location removed from said first end; a frame mounted below a portion of said elongate multilayer flexible substrate adjacent said first end, such that at least a portion of said elongate multilayer flexible substrate is between said frame and said sensor, and such that said sensor surface is exposed and the portion of said elongate multilayer flexible substrate proximate said frame is rigid; a connector at a second end of said elongate multilayer flexible substrate distal from said first end, said connector having a plurality of electrical contacts coupled to said conductive traces; such that a major portion of said elongate multilayer flexible substrate between said frame and said connector is free to flex. 11. The fingerprint sensing apparatus of claim 10 further comprising a stiffener for providing rigidity to said connector.12. The fingerprint sensing apparatus of claim 10 wherein said frame surrounds only a portion of said fingerprint sensor.

이 특허에 인용된 특허 (7) 인용/피인용 타임라인 분석

Uden Edward (Barmstedt DEX), Data card and method of manufacturing same.
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Setlak Dale R., Electric field fingerprint sensor apparatus and related methods.
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Thompson, Erik Jonathon; Dean, Gregory Lewis; Jandu, Jaswinder; Erhart, Richard Alexander, Apparatus and method for finger activity on a fingerprint sensor.
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Nelson, Richard Brian; Erhart, Richard Alexander; Perezselsky, Armando Leon, Apparatus and method for protecting fingerprint sensing circuitry from electrostatic discharge.
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Dean, Gregory Lewis; Erhart, Richard Alexander; Jandu, Jaswinder; Thompson, Erik Jonathan, Apparatus and method for reducing noise in fingerprint sensing circuits.
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Gardner, Lawrence C., Unitized ergonomic two-dimensional fingerprint motion tracking device and method.
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[미국특허] Fingerprint sensor and interconnect 원문보기

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[미국특허] Fingerprint sensor and interconnect 원문보기

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