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Embodiments of the present invention provides an electronic component cooling system and method that diverts a portion of a cooling fan's cooling air from high power electronic components such as processors and directs the cooling air to other electronic components of a system. Active cooling air ma

Embodiments of the present invention provides an electronic component cooling system and method that diverts a portion of a cooling fan's cooling air from high power electronic components such as processors and directs the cooling air to other electronic components of a system. Active cooling air may be provided at higher velocities and lower temperatures to cool electronic components of a system such as a computer or other electronic device. An attach block may be thermally coupled to a first electronic component. A heat exchanger may be thermally coupled to the attach block. A cooling fan may receive inlet air and may generate cooling air. A plenum duct between the cooling fan and the heat exchanger may direct the generated cooling air from the fan to the heat exchanger. A portion of the generated cooling air from the cooling fan may be diverted towards a second electronic component included in the system.

대표청구항 ▼

1. A system comprising:an attach block thermally coupled to a first electronic component; a heat exchanger thermally coupled to the attach block; a cooling fan to receive inlet air and generate exit cooling air; and a plenum duct between the cooling fan and the heat exchanger to direct the exit cool

1. A system comprising:an attach block thermally coupled to a first electronic component; a heat exchanger thermally coupled to the attach block; a cooling fan to receive inlet air and generate exit cooling air; and a plenum duct between the cooling fan and the heat exchanger to direct the exit cooling air from the fan to the heat exchanger, wherein a portion of the exit cooling air from the cooling fan is diverted towards a second electronic component included in the system. 2. The system of claim 1, wherein the cooling fan comprises:a fan housing coupled to the plenum duct to direct the exit cooling air from the fan to the heat exchanger via the plenum duct, wherein the portion of the exit cooling air from the fan is diverted towards the second electronic component from the fan housing. 3. The system of claim 1, wherein the portion of the exit cooling air from the fan is diverted towards the second electronic component without passing through the heat exchanger.4. The system of claim 1, wherein the portion of the exit cooling air from the fan is diverted towards the second electronic component by the plenum duct.5. The system of claim 1, wherein the plenum duct contains an opening to divert the portion of the exit cooling air from the cooling fan towards the second electronic component.6. The system of claim 1, further comprising:a heat pipe coupled to the attach block and the heat exchanger. 7. The system of claim 1, wherein the first electronic component comprises a processor.8. The system of claim 1, wherein the second electronic circuit comprises a memory controller hub.9. The system of claim 1, wherein the second electronic component comprises an input/output hub.10. The system of claim 1, wherein the second electronic component comprises a voltage regulator.11. The system of claim 1, wherein the cooling fan is 5 mm to 30 mm in thickness.12. The system of claim 1, wherein the attach block, first electronic component, second electronic component, cooling fan and heat exchanger are located inside a laptop computer.13. The system of claim 1, wherein the attach block, first electronic component, second electronic component, cooling fan and heat exchanger are located inside a desktop computer.14. The system of claim 1, wherein the first and second electronic components are included in a laptop computer.15. The system of claim 1, wherein the first and second electronic components are included in a desktop computer.16. The system of claim 1, wherein the heat exchanger is remotely located from the first component.17. A method for cooling electronic components in a laptop computer, the method comprising:generating cooling air by a cooling fan; directing the cooling air from the cooling fan to a heat exchanger thermally coupled to a first electronic component in the laptop computer; and diverting a portion of the cooling air generated by the fan towards a second electronic component. 18. The method of claim 17, further comprising:diverting the portion of the generated cooling air towards the second electronic component without passing the generated cooling air through the heat exchanger. 19. The method of claim 18, further comprising:diverting the portion of the generated cooling air towards a second electronic component in the laptop computer using a plenum duct. 20. The method of claim 18, further comprising:diverting the portion of the generated cooling air towards a second electronic component by a cooling fan housing. 21. An apparatus for cooling electronic components, comprising:a plenum duct between a cooling fan and a heat exchanger thermally coupled to a first electronic component, the plenum duct that is to direct cooling air generated by the fan to the heat exchanger, wherein a portion of the cooling air generated by the cooling fan is diverted, from the plenum duct, towards a second electronic component before reaching the heat exchanger. 22. The apparatus of claim 21, further comprising:an attach block thermally coupled to the first electronic component. 23. The apparatus of claim 22, further comprising:a heat pipe that is to thermally couple the attach block and the heat exchanger. 24. The apparatus of claim 21, wherein the cooling fan comprises:a fan housing coupled to the plenum duct to direct the cooling air generated by the fan to the heat exchanger via the plenum duct, wherein the portion of the cooling air generated by the fan is diverted towards the second electronic component from the fan housing. 25. The apparatus of claim 21, wherein the portion of the cooling air generated by the fan is diverted towards the second electronic component without passing through the heat exchanger.26. The apparatus of claim 21, wherein the plenum duct contains an opening to divert the portion of the cooling air generated by the cooling fan towards the second electronic component.27. The apparatus of claim 21, wherein the cooling fan is 5 mm to 30 mm in thickness.28. The apparatus of claim 21, wherein the first electronic component is a processor of a laptop computer.29. The apparatus of claim 21, wherein the first electronic component is a processor of a desktop computer.