초록 ▼

Disclosed herein are organic electronic devices that are encapsulated at least in part by adsorbent-loaded transfer adhesives. The adsorbent material may be a dessicant and/or a getterer. The adsorbent-loaded transfer adhesive may form a gasket around the periphery of the device, or may cover the en

Disclosed herein are organic electronic devices that are encapsulated at least in part by adsorbent-loaded transfer adhesives. The adsorbent material may be a dessicant and/or a getterer. The adsorbent-loaded transfer adhesive may form a gasket around the periphery of the device, or may cover the entire device and its periphery. An encapsulating lid covers the device.

대표청구항 ▼

1. A method of encapsulating an organic electronic device comprising:providing an adsorbent loaded transfer adhesive film containing one or both of a desiccant and a gettering material, applying the film such that it will form a gasket around the entire periphery of an organic electronic device situ

1. A method of encapsulating an organic electronic device comprising:providing an adsorbent loaded transfer adhesive film containing one or both of a desiccant and a gettering material, applying the film such that it will form a gasket around the entire periphery of an organic electronic device situated on a substrate or will cover the entire device, and applying a lid over the organic electronic device and its periphery such that the lid is adhered to the substrate by the adhesive, thereby encapsulating the device. 2. The method of claim 1 wherein the film is first applied to the lid instead of the substrate or device.3. The method of claim 1 wherein the film is made from a material selected from the group comprising hot melt adhesives, pressure sensitive adhesives, thermoset adhesives, UV curable adhesives, curable pressure sensitive adhesives, and combinations thereof.4. The method of claim 1 further comprising curing the adhesive film.5. The method of claim 1 wherein the organic electronic device is on a rigid substrate.6. The method of claim 1 wherein the organic electronic device is on a flexible substrate.7. The method of claim 6 wherein the flexible substrate is a continuous web.8. The method of claim 1 wherein the device is an organic light emitting diode.9. The method of claim 1 further comprising applying a high barrier adhesive around the entire periphery of the portion of transfer adhesive that is adhering the lid to the substrate.10. The method of claim 9 wherein the high barrier adhesive is selected from the group consisting of two part epoxies, solvent based adhesives, one part curable adhesives, and UV curable adhesives.11. The method of claim 9 wherein the film comprises an adhesive that is permeable to one or both of air and water vapor.