IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
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| 국제특허분류(IPC7판) |
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| 출원번호 |
US-0198198
(2002-07-16)
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발명자
/ 주소 |
- Eldridge, Benjamin N.
- Grube, Gary W.
- Mathieu, Gaetan L.
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| 출원인 / 주소 |
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| 인용정보 |
피인용 횟수 :
64 인용 특허 :
135 |
초록
▼
A probe card is provided for probing a semiconductor wafer with raised contact elements. In particular, the present invention is useful with resilient contact elements, such as springs. A probe card is designed to have terminals to mate with the contact elements on the wafer. In a preferred embodime
A probe card is provided for probing a semiconductor wafer with raised contact elements. In particular, the present invention is useful with resilient contact elements, such as springs. A probe card is designed to have terminals to mate with the contact elements on the wafer. In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer is prepared with contact posts on one side and terminals on the opposing side. An interposer with spring contacts connects a contact on the opposing side of the space transformer to a corresponding terminal on a probe card, which terminal is in turn connected to a terminal which is connectable to a test device such as a conventional tester.
대표청구항
▼
1. A probe card assembly comprising:a probe card comprising a plurality of electrical contacts; a probe substrate having a plurality of contact pads positioned for contacting raised contact elements of a device to be probed; a second substrate disposed between and spaced from the probe card and the
1. A probe card assembly comprising:a probe card comprising a plurality of electrical contacts; a probe substrate having a plurality of contact pads positioned for contacting raised contact elements of a device to be probed; a second substrate disposed between and spaced from the probe card and the probe substrate; and a plurality of elongate, resilient interconnection elements providing resilient electrical connections through the second substrate between the probe card and the probe substrate and thereby electrically connecting ones of the electrical contacts with ones of the contact pads. 2. The probe card assembly of claim 1, wherein the plurality of elongate interconnection elements extend from opposing surfaces of the second substrate.3. The probe card assembly of claim 1, wherein each of the plurality of elongate interconnection elements is disposed such that each of the elongate interconnection element passes through an opening in the second substrate, opposite ends of each the elongate interconnection element being spaced from the opposing surfaces of the interconnect structure.4. The probe card assembly of claim 1, wherein the plurality of elongate interconnection elements exert forces against the probe card and the probe substrate.5. The probe card assembly of claim 4, wherein the forces are spring forces.6. The probe card assembly of claim 1, wherein at least one of the elongate interconnection elements comprises a core of a first material and a coating of a second material, wherein the second material is more resilient than the first material.7. The probe card assembly of claim 1, further comprising means for changing a planarity of the contact pads of the probe substrate.8. The probe card assembly of claim 1, further comprising at least one moveable element disposed so as to change a planarity of the contact pads of the probe substrate.9. The probe card assembly of claim 8, wherein the moveable element is threaded.10. The probe card assembly of claim 8, wherein the moveable element comprises a screw.11. The probe card assembly of claim 10, wherein the screw comprises a differential screw.12. The probe card assembly of claim 1, further comprising at least one moveable element disposed so that movement of the element in a first direction causes at least a portion of the probe substrate to move toward the probe card.13. The probe card assembly of claim 12, wherein movement of the moveable element in a second direction allows at least a portion of the probe substrate to move away from the probe card.14. The probe card assembly of claim 1, further comprising a plurality of moveable elements, each disposed so as to affect a position of a portion of the probe substrate with respect to a portion of the probe card.15. The probe card assembly of claim 1, wherein the probe substrate comprises a space transformer.16. The probe card assembly of claim 1, wherein the plurality of contact pads comprise a plurality of posts each extending from the probe substrate.17. The probe card assembly of claim 1, wherein a length by which each of the interconnection elements extends away from the second substrate is at least approximately twice a cross-sectional width of the interconnection element.18. The probe card assembly of claim 1, wherein the interconnection elements are springs.19. A probe card assembly comprising:probe card means for providing electrical contacts to a tester; probe substrate means for providing contact pad terminals to contact raised contact elements on a semiconductor device under test; and interconnection means for flexibly connecting electrically the probe card means and the probe substrate means at a plurality of variations of a planar orientation of the probe substrate means with respect to the probe card means, wherein the interconnection means comprises a plurality of elongate interconnection elements for resiliently connecting electrically ones of the electrical contacts of the probe card means with ones of the contact pad terminals of the probe substrate means. 20. The probe card assembly of claim 19, further comprising means for changing a planarity of the contact pad terminals of the probe substrate means.21. The probe card assembly of claim 19, wherein the interconnection elements are springs.22. A probe card assembly comprising:a probe card comprising a plurality of electrical contacts; a probe substrate moveably attached to the probe card and comprising a plurality of contact pad elements, ones of the contact pad elements being in electrical communication with ones of the electrical contacts; and a moveable element disposed so as to change a planar orientation of the probe substrate with respect to the probe card while the probe substrate is attached to the probe card. 23. The probe card assembly of claim 22, wherein movement of the moveable element in a first direction causes at least a portion of the probe substrate to move away from the probe card.24. The probe card assembly of claim 22, wherein movement of the moveable element in a second direction allows at least a portion of the probe substrate to move toward the probe card.25. The probe card assembly of claim 22, wherein the moveable element is threaded.26. The probe card assembly of claim 22, wherein the moveable element comprises a screw.27. The probe card assembly of claim 26, wherein the screw comprises a differential screw.28. The probe card assembly of claim 22, further comprising a plurality of the moveable elements.29. The probe card assembly of claim 22, wherein the probe substrate comprises a space transformer.30. The probe card assembly of claim 22, wherein the contact pad elements comprise raised contact elements.31. The probe card assembly of claim 22, wherein:ends of the contact pad elements are disposed in a plane, the planar orientation of the probe substrate comprises an angle of the plane with respect to a surface of the probe card, and the movable element is disposed to change the angle. 32. The probe card assembly of claim 22, further comprising means for applying a biasing force biasing the probe substrate towards the probe card.33. A probe card assembly comprising:probe card means for providing an interface to a semiconductor tester; substrate means for supporting a plurality of contact pad probe elements, the probe elements being in electrical communication with the probe card means, the probe substrate means being moveably attached to the probe card means; and means for changing a planar orientation of the substrate means with respect to the probe card means while the substrate means is attached to the probe card means. 34. The probe card assembly of claim 33, wherein the probe elements comprise posts.35. The probe card assembly of claim 33, further comprising interposer means disposed between the probe card means and the substrate means for exerting forces against the probe card means and the substrate means.36. The probe card assembly of claim 33, wherein:contact portions of the probe elements are disposed in a plane, the planar orientation of the substrate means comprises an angle of the plane with respect to a surface of the probe card means, and the means for changing changes the angle. 37. The probe card assembly of claim 33 further comprising means for applying a biasing force biasing the substrate means towards the probe card means.
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