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Carrier tape 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • A47G-019/08
출원번호 US-0915122 (2001-07-25)
발명자 / 주소
  • Chung, Kevin Kwong-Tai
출원인 / 주소
  • Amerasia International Technology, Inc.
대리인 / 주소
    Dann, Dorfman, Herrell &
인용정보 피인용 횟수 : 46  인용 특허 : 65

초록

A carrier structure comprises a carrier base which is not thermally deformable and a portion of which is also transparent to electromagnetic radiation. An adhesive layer is disposed on a surface of the carrier base. Semiconductor chips or other items adhere to the adhesive layer, which is cross-link

대표청구항

1. A re-usable carrier structure for carrying an article, comprising:a carrier base having at least a portion thereof transparent to electromagnetic radiation, a surface of said carrier base adapted to have a different surface property from a surface of the article, said carrier base being stretchab

이 특허에 인용된 특허 (65)

  1. Komiyama Mikio (Yokohama JPX) Miyazawa Yasunao (Urawa JPX) Ebe Kazuyoshi (Minamisaitama JPX) Saito Takanori (Ohmiya JPX), Adhesive composition comprising (meth)acrylate polymer and epoxy resin.
  2. Asai Motoo,JPX ; Ono Yoshitaka,JPX ; Kawade Masato,JPX ; Noda Kouta,JPX ; Nishiwaki Youko,JPX, Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board.
  3. Komiyama Mikio (Yokohama JPX) Miyazawa Yasunao (Urawa JPX) Ebe Kazuyoshi (Minamisaitama JPX) Saito Takanori (Ohmiya JPX), Adhesive tape and use thereof.
  4. Patnode Gregg A. ; Hyde Patrick D., Blended pressure-sensitive adhesives.
  5. Dressler, Donald R., Carrier for decorative graphics and lettering.
  6. Braden Jeffrey S. (Livermore CA) Penry Matthew D. (Modesto CA), Carrier ring having first and second ring means with bonded surfaces.
  7. Murakami Masao,JPX ; Haraguchi Kiichiron,JPX, Coat masking tape base material, and coat masking tape.
  8. Kevin Kwong-Tai Chung, Cover for an optical device and method for making same.
  9. Kevin Kwong-Tai Chung, Cover with adhesive preform and method for applying same.
  10. Penneck Richard John (Lechlade EN) Clabburn Robin James Thomas (Highworth EN), Cross-linked olefine-ester tapes.
  11. Begelfer Larry J. (York PA) Hoofnagle Scott L. (Spring Grove PA) Yeagle Paul H. (York PA), Dimensionally stable pressure sensitive label.
  12. Reylek Robert S. (Shoreview MN) Thompson Kenneth C. (Cottage Grove MN), Electrically and thermally conductive adhesive transfer tape.
  13. Marutsuka Toshinori,JPX, Electromagnetic radiation shield material and panel and methods of producing the same.
  14. Marutsuka Toshinori,JPX, Electromagnetic radiation shield panel and method of producing the same.
  15. Gotoh Yukio,JPX ; Sato Hiroki,JPX, Electromagnetic wave leakage attenuation filter.
  16. Schenz James L. (White Bear Lake MN), Epoxy adhesive film for electronic applications.
  17. Eichelberger Charles W. (Schenectady NY) Kornrumpf William P. (Albany NY) Wojnarowski Robert J. (Ballston Lake NY), Flexible high density interconnect structure and flexibly interconnected system.
  18. Petit Dominique,BEX ; Ladang Michel,BEX, Foamed pressure sensitive tapes.
  19. Loncar, Jr., Francis V.; Regnier, Diane L.; Deyak, Frank L., Image graphic adhesive system using a non-tacky adhesive.
  20. Karl Werner Kreckel DE; Wilhelm Kuester DE; Bruno Mueller DE, Image graphic system comprising a highly tacky adhesive and method for using same.
  21. Komatsu Toshifumi ; Gybin Alexander S. ; Johnson Kyle ; MacLean Dylan E., Integral membrane layer formed from a photosensitive layer in an imageable photoresist laminate.
  22. Burns Carmen D. (Austin TX), Lead-on-chip integrated circuit apparatus.
  23. Burns Carmen D. (Austin TX), Lead-on-chip integrated circuit apparatus.
  24. Burns Carmen D. (Austin TX), Lead-on-chip integrated circuit apparatus.
  25. Burns Carmen D. (Austin TX), Lead-on-chip integrated circuit fabrication method.
  26. Salatino Matthew M. ; Young William R. ; Begley Patrick A., Lid wafer bond packaging and micromachining.
  27. Althouse Victor E. (Los Altos CA), Means for handling semiconductor die and the like.
  28. Mori Takao (Kanagawa JPX) Yoshida Satoshi (Hachioji JPX) Nishimukai Tadahiko (Sagamihara JPX) Yamaguchi Kenji (Hitachi JPX), Metal lead-film carrier assembly having a plurality of film carriers, and film carrier-semiconductor chip assembly and s.
  29. Althouse Victor E. (Los Altos CA) Benjamin Bruce J. (Palo Alto CA), Method and means for handling semiconductor and similar electronic devices.
  30. Arjavalingam Gnanalingam (Yorktown Heights NY) Deutsch Alina (Chappaqua NY) Doany Fuad E. (Katonah NY) Furman Bruce K. (Beacon NY) Hunt Donald J. (Pine Bush NY) Narayan Chandrasekhar (Hopewell Juncti, Method for fabricating multi-layer thin film structure having a separation layer.
  31. Althouse Victor E. (Los Altos CA), Method for handling semiconductor die and the like.
  32. Gorowitz Bernard (Clifton Park NY) Saia Richard J. (Schenectady NY) Durocher Kevin M. (Waterford NY), Method for protecting gallium arsenide mmic air bridge structures.
  33. Cavasin Daniel (Austin TX), Method for thinning a semiconductor wafer.
  34. Tilmans Hendrikus A. C.,NLX ; Beyne Eric,BEX ; Van de Peer Myriam,BEX, Method of fabrication of a microstructure having an internal cavity.
  35. Chung Kevin Kwong-Tai, Method of forming fine-pitch interconnections employing a standoff mask.
  36. Schofield Kevin H., Method of laser ablation of semiconductor structures.
  37. Kevin Kwong-Tai Chung, Method of making a laminated adhesive lid, as for an Electronic device.
  38. Lake Rickie C. ; Tuttle Mark E. ; Mousseau Joseph P. ; Cirino Clay L., Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing.
  39. Arjavalingam Gnanalingam (Yorktown Heights NY) Deutsch Alina (Chappaqua NY) Doany Fuad E. (Katonah NY) Furman Bruce K. (Beacon NY) Hunt Donald J. (Pine Bush NY) Narayan Chandrasekhar (Hopewell Juncti, Multi-layer thin film structure and parallel processing method for fabricating same.
  40. Amou Satoru,JPX ; Suzuki Masao,JPX ; Suwa Tokihito,JPX ; Kawamoto Mineo,JPX ; Takahashi Akio,JPX ; Nemoto Masanori,JPX ; Fukai Hiroyuki,JPX ; Yokota Mitsuo,JPX ; Kobayashi Shiro,JPX ; Miyazaki Masash, Multilayer circuit board and photosensitive resin composition used therefor.
  41. Gutentag Charles (Los Angeles CA), Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system.
  42. Kon Kazuhiro (Kawaguchi JPX) Hirota Koichi (Tokyo JPX) Kogure Masao (Fukiage JPX) Saito Takanori (Misato JPX), Plate roll and an adhesive sheet therefor.
  43. Tolles Robert D., Polishing pad with a partial adhesive coating.
  44. Katsura Naomi,JPX ; Takeuchi Hikaru,JPX ; Watanabe Yuka,JPX, Polymeric film.
  45. Delgado Joaquin (St. Paul MN) Leinen Roger W. (St. Paul MN) Silver Spencer F. (St. Paul MN), Pressure-sensitive adhesive comprising hollow tacky microspheres and macromonomer-containing binder copolymer.
  46. Bennett Richard E. (Hudson WI) Hittner Mary A. (Little Canada MN), Pressure-sensitive adhesive susceptible to ultraviolet light-induced detackification.
  47. Birkholm James G. (1889 Russell St. NW. Poulsbo WA 98370), Process for laminated electromagnetic radiation imaged polymerized material with a integral membrane.
  48. Kelly Kimberley A. ; Malhotra Ashwani K. ; Perfecto Eric D. ; Yu Roy, Process for releasing a thin-film structure from a substrate.
  49. Kelly Kimberley A. ; Malhotra Ashwani K. ; Perfecto Eric D. ; Yu Roy, Process for transferring a thin-film structure to a temporary carrier.
  50. Miller Richard Anthony ; George Scott Ellery, Radiation crosslinkable branched polyester compositions which are water-dispersible and processes.
  51. Holley Leonard E., Radiation deactivatable adhesive tape.
  52. Skoultchi Martin (Somerset NJ), Radiation-cured pressure sensitive adhesives.
  53. Wehr Mary A. (Hamilton OH), Reuseable thermal transfer ribbon.
  54. Lyden Thomas B. (Schaumburg IL), Semiconductor die bonding with conductive adhesive.
  55. Everaerts Albert I. (Oakdale MN) Purgett Mark D. (Oakdale MN) Momchilovich Bradley S. (Stillwater MN), Tackified acrylic adhesives.
  56. Plamthottam Sebastian S. (Upland CA) Bernard Margaret M. (La Verne CA) Mallya Prakash (Pasadena CA), Tackified dual cure pressure-sensitive adhesive.
  57. Plamthottam Sebastian S. ; Bernard Margaret M. ; Mallya Prakash, Tackified dual cure pressure-sensitive adhesive.
  58. Althouse Victor E. (Los Altos CA), Tape carrier for electronic and electrical parts.
  59. Althouse Victor E. ; Brodie Christopher E., Tape carrier for electronic and electrical parts.
  60. Althouse Victor E. ; Brodie Christopher E., Tape carrier for electronic and electrical parts.
  61. Jackson Scott C. (Kennett Square PA), Touch screen overlay with improved conductor durability.
  62. Toshinori Marutsuka JP, Transparent electromagnetic radiation shield material.
  63. Hodges Joe (Boise ID), UV light sensitive die-pac for securing semiconductor dies during transport.
  64. Kevin Kwong-Tai Chung, Wireless article including a plural-turn loop antenna.
  65. Kushibiki Nobuo (Yamato JPX) Kato Hideo (Yokohama JPX) Miyake Akira (Atsugi JPX) Fukuda Yasuaki (Hatano JPX), X-ray mask support and process for preparation thereof.

이 특허를 인용한 특허 (46)

  1. Trezza, John, Back-to-front via process.
  2. Trezza, John, Chip capacitive coupling.
  3. Trezza, John, Chip-based thermo-stack.
  4. Trezza, John, Chip-based thermo-stack.
  5. Trezza, John, Coaxial through chip connection.
  6. Trezza, John; Callahan, John; Dudoff, Gregory, Contact-based encapsulation.
  7. Matsumura, Takeshi; Mizutani, Masaki; Misumi, Sadahito, Dicing die-bonding film.
  8. Matsumura, Takeshi; Mizutani, Masaki; Misumi, Sadahito, Dicing die-bonding film.
  9. Matsumura,Takeshi; Mizutani,Masaki; Misumi,Sadahito, Dicing die-bonding film.
  10. Matsumura,Takeshi; Yamamoto,Masayuki, Dicing die-bonding film.
  11. Matsumura, Takeshi; Mizutani, Masaki; Misumi, Sadahito, Dicing die-bonding film, method of fixing chipped work and semiconductor device.
  12. Matsumura,Takeshi; Mizutani,Masaki; Misumi,Sadahito, Dicing die-bonding film, method of fixing chipped work and semiconductor device.
  13. Matsumura, Takeshi; Mizutani, Masaki, Dicing/die-bonding film, method of fixing chipped work and semiconductor device.
  14. Matsumura, Takeshi; Mizutani, Masaki, Dicing/die-bonding film, method of fixing chipped work and semiconductor device.
  15. Matsumura, Takeshi; Mizutani, Masaki, Dicing/die-bonding film, method of fixing chipped work and semiconductor device.
  16. Trezza, John; Callahan, John; Dudoff, Gregory, Electronic chip contact structure.
  17. Ciccaglione, Terry M., Electronic module packaging.
  18. Rafferty, Conor; Dalal, Mitul, Embedding thin chips in polymer.
  19. Rafferty, Conor; Dalal, Mitul, Embedding thin chips in polymer.
  20. Trezza, John, Inverse chip connector.
  21. Trezza, John, Inverse chip connector.
  22. Trezza, John, Isolating chip-to-chip contact.
  23. Trezza, John, Isolating chip-to-chip contact.
  24. Wung, Shih-Hsun; Chen, Yong-Dong; Xu, Wen; Xie, Ye-Ke, LED lamp.
  25. Barrette, Terry Lynne, Methods and structures for handling integrated circuits.
  26. Yeates, Kyle H.; Bilanski, James; Pyper, Dennis, Multi-part substrate assemblies for low profile portable electronic devices.
  27. Trezza, John; Callahan, John; Dudoff, Gregory, Patterned contact.
  28. Trezza, John; Frushour, Ross, Pin-type chip tooling.
  29. Trezza, John, Plated pillar package formation.
  30. Trezza, John; Callahan, John; Dudoff, Gregory, Post & penetration interconnection.
  31. Trezza, John, Post-attachment chip-to-chip connection.
  32. Trezza, John, Process for chip capacitive coupling.
  33. Trezza, John, Processed wafer via.
  34. Trezza, John; Callahan, John; Dudoff, Gregory, Profiled contact.
  35. Chung,Kevin Kwong Tai, Re-usable carrier structure.
  36. Trezza, John, Remote chip attachment.
  37. Trezza, John, Remote chip attachment.
  38. Trezza, John; Frushour, Ross, Rigid-backed, membrane-based chip tooling.
  39. Misra, Abhay; Trezza, John, Routingless chip architecture.
  40. Campbell, Eric J.; Czaplewski, Sarah K.; Labreck, Elin; Porto, Jennifer I., Selectively cross-linked thermal interface materials.
  41. Trezza, John, Side stacking apparatus and method.
  42. Trezza, John, Thermally balanced via.
  43. Trezza,John, Through chip connection.
  44. Trezza, John, Triaxial through-chip connection.
  45. Trezza, John, Triaxial through-chip connection.
  46. Dutt, Gyanendra; Zhuo, Qizhuo; Hoang, Elizabeth; Ruatta, Stephen, Wafer back side coating as dicing tape adhesive.
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