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An interconnect for use with a pixel layer of a pixel web is provided, the interconnect including an interconnect substrate having a plurality of conductive leads and a plurality of contact vias formed on and extending from the interconnect substrate. The contact vias are formed in a predetermined p

An interconnect for use with a pixel layer of a pixel web is provided, the interconnect including an interconnect substrate having a plurality of conductive leads and a plurality of contact vias formed on and extending from the interconnect substrate. The contact vias are formed in a predetermined pattern on the interconnect substrate and are in electrical communication with the conductive leads. The interconnect includes a patterned spacer of a thickness substantially equal to a height of the contact vias. The patterned spacer includes a plurality of through-holes also formed according to the predetermined pattern and having a dimension substantially equal to a dimension of the contact vias. The interconnect substrate and the patterned spacer are capable of being assembled onto the pixel layer, with the patterned spacer being in a middle position and the contact vias extending through the through-holes to contact corresponding cathode portions on the pixel layer.

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1. An interconnect adapted for use with a pixel layer of a pixel web, comprising:an interconnect substrate including a plurality of conductive leads;a plurality of contact vias formed on and extending from said interconnect substrate, said plurality of contact vias being formed in a predetermined pa

1. An interconnect adapted for use with a pixel layer of a pixel web, comprising:an interconnect substrate including a plurality of conductive leads;a plurality of contact vias formed on and extending from said interconnect substrate, said plurality of contact vias being formed in a predetermined pattern on said interconnect substrate and being in electrical communication with said plurality of conductive leads of said interconnect substrate; anda patterned spacer of a thickness substantially equal to a height of said plurality of contact vias, said patterned spacer including a plurality of through-holes also formed according to said predetermined pattern and having a dimension substantially equal to a dimension of said plurality of contact vias;wherein said interconnect substrate and said patterned spacer are capable of being assembled onto said pixel layer of said pixel web, with said patterned spacer being in a middle position and said plurality of contact vias extending through said plurality of through-holes of said patterned spacer to contact corresponding cathode portions on said pixel layer.2. The interconnect of claim 1, wherein said patterned spacer is formed of a dielectric material.3. The interconnect of claim 1, wherein said patterned spacer is formed of an insulator material.4. The interconnect of claim 1, wherein said interconnect substrate further comprises at least one driver formed as part of said interconnect substrate and providing an electrical drive current to an associated contact via.5. The interconnect of claim 1, wherein multiple contact vias are capable of being in contact with a cathode portion of said pixel layer.6. The interconnect of claim 1, wherein multiple contact vias are capable of being in contact with a cathode portion of said pixel layer, and wherein said multiple contact vias are spaced according to a predetermined distribution pattern.7. The interconnect of claim 1, wherein said patterned spacer is formed on said pixel layer.8. The interconnect of claim 1, wherein said patterned spacer is formed on said interconnect substrate.9. The interconnect of claim 1, wherein a plurality of cathodes are formed in columns on said pixel layer, with a cathode of said plurality of cathodes comprising a plurality of individual cathode portions.10. An interconnect adapted for use with a pixel layer of a pixel web, comprising:a plurality of cathodes formed in columns on said pixel layer, with a cathode of said plurality of cathodes comprising a plurality of individual cathode portions;an interconnect substrate including a plurality of conductive leads;a plurality of contact vias formed on and extending from said interconnect substrate, said plurality of contact vias being formed in a predetermined pattern on said interconnect substrate and being in electrical communication with said plurality of conductive leads of said interconnect substrate;at least one driver formed in said interconnect substrate, with said at least one driver providing an electrical drive current to an associated contact via; and a patterned spacer of a thickness substantially equal to a height of said plurality of contact vias, said patterned spacer including a plurality of through-holes also formed according to said predetermined pattern and having a dimension substantially equal to a dimension of said plurality of contact vias;wherein said interconnect substrate and said patterned spacer are capable of being assembled onto said pixel layer of said pixel web, with said patterned spacer being in a middle position and said plurality of contact vias extending through said plurality of through-holes of said patterned spacer to contact corresponding cathode portions on said pixel layer.11. The interconnect of claim 10, wherein multiple contact vias are capable of being in contact with a cathode portion of said pixel layer.12. The interconnect of claim 10, wherein multiple contact vias are capable of being in contact with a cathode portion of said pixel layer, and wherein said multiple contact vias are spaced according to a predetermined distribution pattern.13. The interconnect of claim 10, wherein said patterned spacer is formed on said pixel layer.14. The interconnect of claim 10, wherein said patterned spacer is formed on said interconnect substrate.